Process for producing resonant tag

• US 6,618,939 B2
• Filed: 09/15/1999
• Issued: 09/16/2003
• Est. Priority Date: 02/27/1998
• Status: Expired due to Term

• Current Assignee: Novatron Electronics (Hangzhou) Co., Ltd.
• Original Assignee: Kabushiki Kaisha Miyake
• Inventors: Mizukawa, Takaaki, Hatanaka, Yoshinori, Uchibori, Shinya
• Primary Examiner(s): Arbes, Carl J.
• Assistant Examiner(s): TRINH, MINH N
• Application Number:
  US09/396,277
• Publication Number:
  US 20020171528A1
• Time in Patent Office: 1,462 Days
• Field of Search: 298/46, 295/921, 298/98, 298/48, 296/021, 292/61, 296/06, 29/254.2, 298/32, 340/572.5, 340/572.1, 340/572.8, 428/209, 428/457, 428/461, 428/901, 428/347, 174/250, 174/254
• US Class Current: 29/846
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G08B 13/242 Tag deactivation
• CPC Class Codes: G08B 13/2431 Tag circuit details
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: G08B 13/244 Tag manufacturing, e.g. continuous manufacturing processes
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01F 5/003 Printed circuit coils
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/532 Conductor
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/2817 : Heat sealable
• CPC Class Codes: Y10T 428/31681 : Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

A process for producing a resonant tag, wherein a metal foil having a thermal adhesion adhesive applied to at least one face thereof is stamped out into a circuit-like shape and is adhered to a base sheet, the process comprising: stamping out the metal foil into a predetermined shaped metal foil portion (4c) while being passed through a die roll (1) having thereon a stamping blade with a predetermined shape and a transfer roll (2) in contact with the die roll (1) which functions also as a die back-up roll; holding this metal foil portion obtained by the stamping-out operation onto the surface of the transfer roll by suction holes formed in the transfer roll; and thermally adhering the stamped metal foil portion to the base sheet (7) in contact with the transfer roll (2) at its another face by an adhesive roll (3) in contact with the transfer roll through the base sheet. The present invention has such advantages as no damage to the base sheet since the stamping-out operation for the metal foil and the thermal adhesion operation thereof to the base sheet are carried out in separate positions, and no requirement of carrier sheet because the resultant metal foil portion obtained by the stamping-out operation is sucked and held onto the surface of the transfer roll.

Claims

1. A process for producing a resonant tag,

wherein resonant circuits having a wide width are applied to both faces of a base sheet such that a first circuit and a second circuit face each other with a base sheet in between, said process comprising:

stamping out a metal foil having a thermal adhesion adhesive applied to at least one side thereof into a predetermined shaped foil circuit while passing through a die roll having thereon a stamping blade with a predetermined circuit shape and a transfer roll contacting the die roll and functioning also as a die backup roll;

holding only the stamped-out metal foil circuit obtained by stamping out operation onto a first surface of the transfer roll by suction holes formed in the transfer roll, the width of the circuit enabling said circuit to be supported against said first surface by said suction holes; and

thermally adhering the stamped-out predetermined shape metal foil circuit to the base sheet in contact with the transfer roll at one surface by an adhesive roll in contact with the transfer roll at a second surface through the base sheet, by using the thermal adhesive adhesion,

wherein the width of the metal foil circuit is wide in width within the scope where a resonant property is formed,

the suction holes formed in the transfer roll are smaller than the width of the metal foil and an appropriate number of suction holes are formed in said transfer roll so as to correspond in shape to the metal foil to be stamped out,

the base sheet is a dielectric film, and

another metal foil circuit as prepared above adhered on the other surface of the base sheet, one surface of which is adhered with the metal foil circuit, by the above-mentioned process.

2. The process for producing a resonant tag as claimed in claim 1 wherein the adhesive roll is an adhesive roll having protrusions thereon so as to correspond in shape to said metal foil circuit obtained by the stamping-out operation which is to be transferred.

3. A process for producing a resonant tag,

wherein resonant circuits having a wide width are applied to both faces of a base sheet such that a first circuit and a second circuit face each other with a base sheet in between, said process comprising:

stamping out a metal foil having a thermal adhesion adhesive applied to at least one side thereof into a predetermined shaped metal foil circuit while passing through a die roll having thereon a stamping blade with a predetermined circuit shape and a transfer roll contacting the die roll and functioning also as a die backup roll;

holding only the stamped-out predetermined shape metal foil circuit onto a surface of the transfer roll by suction holes formed in the transfer roll,

transferring the metal foil circuit obtained by the stamping out operation onto a second transfer roll in contact with the transfer roll, the second transfer roll being formed therein with protrusions and suction holes so as to correspond in shape to metal foils obtained by the stamping-out operation,

thermally adhering the metal foil circuit obtained by the stamping out operation to the base sheet running between the second transfer and the adhesive roll, held on the surface of the transfer roll to the base sheet in contact with the second transfer roll at another position by an adhesive roll in contact with the transfer roll through the base sheet by the thermal adhesion adhesive,

wherein the width of the metal foil circuit is wide in width within the scope where a resonant property is formed,

the suction holes formed in the transfer roll are smaller than the width of the metal foil circuit and an appropriate number of suction holes are formed in a surface of said transfer roll so as to correspond in shape to the metal foil to be stamped out, and

the base sheet is a dielectric film, and

another metal foil circuit as prepared above is adhered on the other surface of the base sheet one surface of which is adhered with the metal foil circuit, by the above-mentioned process.