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Polishing pad, polishing apparatus and polishing method

  • US 6,620,336 B2
  • Filed: 03/26/2001
  • Issued: 09/16/2003
  • Est. Priority Date: 03/27/2000
  • Status: Expired due to Fees
First Claim
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1. A polishing pad for use in polishing a surface of a substrate, comprising:

  • a pad main body having a polishing surface; and

    a plurality of electrode portions formed in the pad main body and mutually spaced apart in a plane direction of the pad main body;

    each of the electrode portions being formed of a conductive portion and an insulating portion formed on the conductive portion and covering a polishing surface side of the conductive portion.

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