Multilayer integrated substrate and manufacturing method for multilayer ceramic element

• US 6,621,010 B2
• Filed: 02/15/2001
• Issued: 09/16/2003
• Est. Priority Date: 03/03/2000
• Status: Expired due to Term

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Iida, Kazuhiro, Sakai, Norio
• Primary Examiner(s): Talbott, David L.
• Assistant Examiner(s): NORRIS, JEREMY C
• Application Number:
  US09/783,922
• Publication Number:
  US 20010018983A1
• Time in Patent Office: 943 Days
• Field of Search: 174/255, 174/260, 438/33, 438/68, 438/113, 438/221, 438/FOR.386
• US Class Current: 174/255
• CPC Class Codes: H01L 21/481 Insulating layers on insulating parts, with or without metallisation
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate
• CPC Class Codes: H05K 2201/0909 Preformed cutting or breaking line
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2203/302 Bending a rigid substrate; Breaking rigid substrates by bending
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49163 with sintering of base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49789 Obtaining plural product pieces from unitary workpiece
• CPC Class Codes: Y10T 29/4979 Breaking through weakened portion

Abstract

A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.

Claims

1. A multilayer integrated substrate comprising:

a laminate body including a plurality of ceramic green sheets and having a main surface;

a plurality of breaking grooves arranged in the main surface in a grid pattern;

a plurality of multilayer ceramic elements which are constructed in a plurality of blocks sectioned by said plurality of breaking grooves; and

at least one fracture-preventing member provided in said laminated body and arranged so as to cross at least one of said plurality of breaking grooves, and said at least one fracture-preventing member being arranged below said at least one of said plurality of breaking grooves in said laminated body.

2. A multilayer integrated substrate according to claim 1, wherein said at least one fracture-preventing member includes at least one fracture-preventing conductor which contains a metal component.

3. A multilayer integrated substrate according to claim 2, wherein said at least one fracture-preventing conductor includes at least one fracture-preventing conductive film disposed on at least one of said plurality of ceramic layers.

4. A multilayer integrated substrate according to claim 3, wherein said at least one fracture-preventing conductive film is disposed on at least one of the surface boundaries in said plurality of ceramic layers.

5. A multilayer integrated substrate according to claim 2, wherein said at least one fracture-preventing conductor defines a co-fired member with said laminate.

6. A multilayer integrated substrate according to claim 5, wherein said at least one fracture-preventing conductor contains substantially the same ceramic component as a ceramic component contained in said plurality of ceramic layers.

7. A multilayer integrated substrate according to claim 1, wherein said at least one fracture-preventing conductor is provided at ends of said plurality of breaking grooves in the region closer to the periphery of said multilayer integrated substrate than the intersectional points of said plurality of breaking grooves, and wherein each of said plurality of multilayer ceramic elements is constructed in each of said plurality of blocks which are surrounded by said plurality of breaking grooves at four sides thereof.

8. A multilayer integrated substrate according to claim 1, wherein said at least one fracture-preventing member is disposed in a margin of said multilayer integrated substrate.

9. A multilayer integrated substrate according to claim 8, wherein said at least one fracture-preventing member is arranged to cross two or more of said plurality of breaking grooves that are substantially parallel to each other.

10. A multilayer integrated substrate according to claim 8, wherein said at least one fracture-preventing members is arranged to cross two of said plurality of breaking grooves which intersect each other.

11. A multilayer integrated substrate according to claim 1, further comprising a plurality of said fracture-preventing members arranged so as to cross said plurality of breaking grooves.