Devices incorporating electrochromic elements and optical sensors

• US 6,621,616 B1
• Filed: 10/03/2000
• Issued: 09/16/2003
• Est. Priority Date: 08/21/1998
• Status: Expired due to Term

• Current Assignee: Gentex Corporation
• Original Assignee: Gentex Corporation
• Inventors: Bauer, Frederick T., Stam, Joseph S.
• Primary Examiner(s): Ben, Loha
• Application Number:
  US09/678,586
• Time in Patent Office: 1,078 Days
• Field of Search: 359/270, 359/290, 359/291, 359/271, 359/273, 359/265, 359/266, 359/267, 359/268, 359/275, 359/272, 359/288, 257/222, 257/215, 257/291, 257/432, 257/434, 257/437, 250/338.4, 250/214.1, 439/67
• US Class Current: 359/273
• CPC Class Codes: G01J 1/0204 Compact construction
• CPC Class Codes: G01J 1/0403 Mechanical elements; Supports for optical elements; Scanning arrangements
• CPC Class Codes: G01J 1/24 using electric radiation detectors
• CPC Class Codes: G01J 2001/0276 Protection
• CPC Class Codes: G02F 1/153 Constructional details
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

The device of the present invention includes an electrochromic element having a transmittance that varies in response to an electrical signal, a base substrate disposed in spaced relation to the electrochromic element, a seal disposed between the base substrate and the electrochromic element, and an optical sensor. The seal, base substrate, and electrochromic element form a sealed cavity therebetween, in which the optical sensor is disposed. According to another embodiment, an electrochromic device is provided that includes a first substrate, an electrochromic medium disposed on the first substrate, a pair of electrodes in contact with the electrochromic medium, a pair of conductive clips, each in electrical contact with a respective one of the electrodes, and two pairs of electrical lead posts for mounting the first substrate to the circuit board. Each pair of lead posts is attached to, and extends from, a respective one of the conductive clips. According to another embodiment, an imaging device is disclosed having an image recorder for recording a scene or object, and an electrochromic element positioned between the image recorder and the object or scene to be imaged. The electrochromic element is configured to exhibit a non-uniform transmittance in response to an applied electrical signal.

Claims

1. An electrochromic device for mounting to a circuit board, the electrochromic device comprising:

a first substrate;

an electrochromic medium;

a pair of electrodes in contact with said electrochromic medium, a first one of said electrodes being disposed on said first substrate;

a pair of conductive clips, each in electrical contact with a respective one of said electrodes; and

two pairs of electrical lead posts for mounting said first substrate to the circuit board, each pair of lead posts attached to, and extending from, a respective one of said conductive clips.

2. The electrochromic device of claim 1 and further including a second substrate spaced apart from said first substrate and attached thereto by a seal to define a sealed chamber therebetween, said electrochromic medium is contained in the sealed chamber.

3. The electrochromic device of claim 2, wherein a second one of said electrodes is disposed on said second substrate, and where a first one of said pair of conductive clips is attached to an edge of said first substrate, and a second one of said conductive clips is attached to an edge of said second substrate.

4. The electrochromic device of claim 3, wherein said first and second conductive clips are attached to opposite sides of the electrochromic device.

5. The electrochromic device of claim 4, wherein said pairs of electrical lead posts extend from opposite ends of a respective one of said conductive clips so as to extend from opposite corners of the electrochromic device.

6. The electrochromic device of claim 1, wherein said first and second conductive clips are attached to opposite sides of the electrochromic device.

7. The electrochromic device of claim 6, wherein said pairs of electrical lead posts extend from opposite ends of a respective one of said conductive clips so as to extend from opposite corners of the electrochromic device.

8. The electrochromic device of claim 1, wherein said pairs of electrical lead posts extend from opposite ends of a respective one of said conductive clips.

9. The electrochromic device of claim 1, wherein said pairs of electrical lead posts extend from opposite corners of the electrochromic device.

10. A device comprising:

an electrochromic element having a transmittance that varies in response to an electrical signal;

a base substrate disposed in spaced relation to said electrochromic element;

a seal disposed between said base substrate and said electrochromic element, said seal, base substrate, and said electrochromic element forming a sealed cavity therebetween; and

an optical sensor disposed on said base substrate within the sealed cavity.

11. The device of claim 10, and further including conductive strips disposed on said base substrate, said conductive strips providing electrical connection paths to said optical sensor.

12. The device of claim 11, wherein said base substrate includes a front surface and a back surface, said optical sensor, electrochromic element, and said conductive strips are disposed on the front surface of said base substrate.

13. The device of claim 10, wherein the device is a camera and said electrochromic element functions as a shutter.

14. The device of claim 10, wherein the device is a camera and said electrochromic element functions as a variable transmission filter.

15. The device of claim 10, wherein said electrochromic element comprises:

a first substrate;

an electrochromic medium;

a pair of electrodes in contact with said electrochromic medium, a first one of said electrodes disposed on said first substrate;

a pair of conductive clips, each in electrical contact with a respective one of said electrodes; and

two pairs of electrical lead posts for mounting said first substrate to said base substrate, each pair of lead posts attached to, and extending from, a respective one of said conductive clips.

16. The device of claim 15, wherein said base substrate is a printed circuit board.

17. An image sensor package comprising:

a base substrate having a plurality of conductive strips disposed thereon;

an electrochromic element having a transmittance that varies in response to an electrical signal; and

an image sensor array disposed on said-base substrate between said base substrate and said electrochromic element, said image sensor array is electrically coupled to said conductive strips,

wherein said electrochromic element is carried on one of said base substrate and said image sensor array.

18. The image sensor package of claim 17 and further including a seal for maintaining said base substrate and said electrochromic element in spaced relation and for providing a sealed cavity therebetween in which said optical sensor is mounted.

19. The image sensor package of claim 17, wherein said base substrate includes a front surface and a back surface, said optical sensor, electrochromic element, and said conductive strips are disposed on the front surface of said base substrate.

20. A package for encapsulating an integrated circuit optical sensor, the package mountable on a support substrate, the sensor having a bottom surface and a top surface, the top surface comprising imaging electronics connected to a plurality of sensor bonding pads, the sensor bonding pads operable to provide bonding points for connections off the sensor, the package comprising:

a glass base substrate with a top surface and a bottom surface, the base substrate top surface having the optical sensor bottom surface bonded thereon;

a plurality of conductive strips upon the base substrate top surface, each conductive strip extending from a region near the optical sensor to an edge of the base substrate top surface;

a plurality of wires, each wire bonded on one end to a sensor bonding pad for which connection is desired and bonded on the other end to a corresponding conductive strip;

means for connecting each conductive strip to a corresponding trace on the support substrate; and

a glass window bonded to the base substrate top surface in a spaced-apart relationship by a seal material, the seal material extending around the sensor enclosing each wire bond but not enclosing any of the means for connecting each conductive strip to a corresponding trace, the window admitting light to the optical sensor.

21. The package of claim 20 wherein the means for connecting each conductive strip to the corresponding trace on the support substrate comprises a plurality of conductive clips, each clip having a connecting section, an opposing section, and at least one joining section joining the connecting section and the opposing section such that the connecting section and the opposing section are separated by a distance less than the thickness of the base substrate, each clip placed on the base substrate such that the connecting section is in contact with one conductive strip and the opposing section is in contact with the base substrate bottom surface.

22. The package of claim 21 wherein the support substrate is a through-hole printed circuit board and wherein at least one clip further comprises a lead operable to allow the package to be mounted to the through-hole printed circuit board.

23. The package of claim 21 wherein the support substrate is a flexible circuit and wherein each clip is operable to be attached to the flexible circuit.

24. The package of claim 21 wherein at least one clip is operable to be surface mounted to the support substrate.

25. The package of claim 20 wherein the support substrate defines an opening of sufficient size to accept the window without accepting the entire base substrate, the means for connecting each, conductive strip to the corresponding trace on the support substrate comprising at least one conductive strip formed to provide a clipless bonding point to a corresponding trace on the support substrate bottom surface, the at least one conductive strip positioned such that, when the at least one conductive strip is bonded to the corresponding trace, the window is inside the opening.

26. The package of claim 20 wherein the window is coated with at least one film operative to affect the spectrum of light passing through the window and striking the optical sensor.

27. The package of claim 20 further comprising an electro-optic filter attached to the window.

28. The package of claim 20 further comprising at least one lens attached to the window.

29. The package of claim 20 wherein a cavity formed by the base substrate, the window, and the seal material bonding the window to the base substrate is filled with an optically transparent material.

30. The package of claim 20 wherein the window is a first window, the package further comprising:

a first transparent electrode on the top surface of the first window;

a second window bonded to the first window in a spaced-apart relationship by a seal material, the second window admitting light to the optical sensor, the second window bottom surface having a second transparent electrode thereon, the first window, the second window, and the seal material bonding the first window and the second window forming a cavity; and

an electrochrornic medium of variable transmittance disposed within the cavity;

wherein an electrochromic variable attenuator is formed by the first transparent electrode, the second transparent electrode, and the electrochromic medium, the electrochromic variable attenuator operable to regulate the intensity of light admitted to the optical sensor.

31. A package for encapsulating an integrated circuit optical sensor, the package mountable on a support substrate, the sensor comprising a top surface having imaging electronics connected to a plurality of sensor bonding pads, the sensor bonding pads operable to provide flip chip bonding points for connections off the sensor, the package comprising:

a base substrate with a top surface and a bottom surface, the base substrate constructed of an insulating material;

a plurality of conductive strips upon the base substrate bottom surface, the optical sensor top surface flip chip bonded on the base substrate bottom surface such that each sensor bonding pad is bonded to a corresponding conductive strip, each conductive strip extending to the edge of the base substrate; and

means for connecting each conductive strip to a corresponding trace on the support substrate.

32. A package for encapsulating an integrated circuit optical sensor as in claim 31 wherein the base substrate is transparent, the base substrate admitting light to the imaging electronics.

33. A package for encapsulating an integrated circuit optical sensor as in claim 32 wherein the base substrate is glass.

34. A package for encapsulating an integrated circuit optical sensor as in claim 32 wherein the base substrate is coated with at least one film operative to affect the spectrum of light passing through the base substrate and striking the optical sensor.

35. A package for encapsulating an integrated circuit optical sensor as in claim 32 further comprising an electro-optic filter attached to the base substrate top surface.

36. A package for encapsulating an integrated circuit optical sensor as in claim 32 further comprising a photochromic filter attached to the base substrate top surface.

37. A package for encapsulating an integrated circuit optical sensor as in claim 32 further comprising at least one lens attached to the base substrate.

38. A package for encapsulating an integrated circuit optical sensor as in claim 32 wherein the base substrate is formed to function as one or more lens.

39. A package for encapsulating an integrated circuit optical sensor as in claim 32 the package further comprising:

a first transparent electrode on the base substrate top surface;

a window bonded to the base substrate in a spaced-apart relationship by a seal material, the window admitting light to the optical sensor, the window bottom surface having a second transparent electrode thereon, the base substrate, the window, and the seal material bonding the window to the base substrate forming a cavity; and

an electrochromic medium of variable transmittance disposed within the cavity;

wherein an electrochromic variable attenuator is formed by the first transparent electrode, the second transparent electrode, and the electrochromic medium, the electrochromic variable attenuator operable to regulate the intensity of light admitted to the optical sensor.

40. A package for encapsulating an integrated circuit optical sensor as in claim 39 further comprising a lens attached to the window top surface.

41. A package for encapsulating an integrated circuit optical sensor as in claim 32 further comprising:

a first transparent electrode on base substrate top surface;

a cathodic electrochromic layer on the first transparent electrode;

a polymeric electrolyte layer on the cathodic electrochromic layer;

an anodic electrochromic layer on the polymeric electrolyte layer; and

a second transparent electrode on the anodic electrochromic layer.

42. A package for encapsulating an integrated circuit optical sensor as in claim 31 wherein the base substrate is opaque, the base substrate forming a hole through which the optical sensor imaging electronics receive light, the package further comprising a window bonded to the base substrate top surface in a spaced-apart relationship by a seal material, the seal material extending around the hole, the window admitting light to the imaging electronics.

43. A package for encapsulating an integrated circuit optical sensor as in claim 42 wherein the seal material comprises:

a sealant; and

a plurality of uniformly sized spacer elements mixed with the sealant.

44. A package for encapsulating an integrated circuit optical sensor as in claim 42 wherein the window is coated with at least one film operative to affect the spectrum of light passing through the window and striking the optical sensor.

45. A package for encapsulating an integrated circuit optical sensor as in claim 42 further comprising an electro-optic filter attached to the window top surface.

46. A package for encapsulating an integrated circuit optical sensor as in claim 42 further comprising a photochromic filter attached to the window top surface.

47. A package for encapsulating an integrated circuit optical sensor as in claim 42 further comprising at least one lens attached to the window.

48. A package for encapsulating an integrated circuit optical sensor as in claim 42 wherein the window is formed to function as one or more lens.

49. A package for encapsulating an integrated circuit optical sensor as in claim 42 wherein the window is a first window, the package further comprising:

a first transparent electrode on the first window top surface;

a second window bonded to the first window top surface in a spaced-apart relationship by a seal material, the second window admitting light to the optical sensor, the second window bottom surface having a second transparent electrode thereon, the first window, the second window, and the seal material bonding the second window to the first window forming a cavity; and

an electrochromic medium of variable transmittance disposed within the cavity;

wherein an electrochromic variable attenuator is formed by the first transparent electrode, the second transparent electrode, and the electrochromic medium, the electrochromic variable attenuator operable to regulate the intensity of light admitted to the optical sensor.

50. A package for encapsulating an integrated circuit optical sensor as in claim 49 further comprising a lens attached to the second window top surface.

51. A package for encapsulating an integrated circuit optical sensor as in claim 31 wherein the means for connecting each conductive strip to the corresponding trace on the support substrate comprises a plurality of conductive clips, each clip having a connecting section, an opposing section, and at least one joining section joining the connecting section and the opposing section such that the connecting section and the opposing section are separated by a distance less than the thickness of the base substrate, each clip placed on the base substrate such that the connecting section is in contact with one conductive strip and the opposing section is in contact with the base substrate bottom surface.

52. A package for encapsulating an integrated circuit optical sensor as in claim 51 wherein the support substrate is a through-hole printed circuit board and wherein at least one clip further comprises a lead operable to allow the package to be mounted to the through-hole printed circuit board.

53. A package for encapsulating an integrated circuit optical sensor as in claim 51 wherein the support substrate is a flexible circuit and wherein each clip is operable to be attached to the flexible circuit.

54. A package for encapsulating an integrated circuit optical sensor as in claim 51 wherein at least one clip is operable to be surface mounted to the support substrate.

55. A package for encapsulating an integrated circuit optical sensor as in claim 31 wherein the support substrate defines an opening of sufficient size to accept the window without accepting the entire base substrate, the means for connecting each conductive strip to the corresponding trace on the support substrate comprising at least one conductive strip formed to provide a clip less bonding point to the corresponding trace on the support substrate bottom surface, the at least one conductive strip positioned such that, when the at least one conductive strip is bonded to the corresponding trace, the window is inside the opening.

56. A package for encapsulating an integrated circuit optical sensor as in claim 31 further comprising a cover bonded to the base substrate bottom surface in a spaced-apart relationship by a seal material, the seal material extending around the sensor.

57. A package for encapsulating an integrated circuit optical sensor as in claim 56 wherein the seal material comprises:

a sealant; and

a plurality of uniformly sized spacer elements mixed with the sealant.

58. A package for encapsulating an integrated circuit optical sensor as in claim 31 further comprising coating the optical sensor with a transparent curable resin to provide environmental protection.

59. An optical sensor with controlled light attenuation comprising:

an optical sensor assembly comprising an integrated circuit optical sensor disposed within a package, the optical sensor comprising imaging electronics, the package comprising a package window through which light strikes the imaging electronics; and

a variable attenuator bonded to the package in a spaced-apart relationship by a seal material, the seal material extending around the package window.

60. An optical sensor as in claim 59 wherein the seal material comprises:

a sealant; and

a plurality of uniformly sized spacer elements mixed with the sealant.

61. An optical sensor as in claim 59 wherein the variable attenuator is an electrochromic window.