Automated process monitoring and analysis system for semiconductor processing
First Claim
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1. A method of manufacturing, the method comprising:
- processing a workpiece;
measuring a parameter characteristic of the processing;
forming an output signal corresponding to the characteristic parameter measured by using the characteristic parameter measured as an input to a partial least squares transistor model;
predicting a wafer electrical test (WET) resulting value based on the output signal;
detecting faulty processing based on the predicted WET resulting value; and
correcting the faulty processing.
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Abstract
A method is provided for manufacturing, the method comprising processing a workpiece, measuring a parameter characteristic of the processing, and forming an output signal corresponding to the characteristic parameter measured by using the characteristic parameter measured as an input to a transistor model. The method also comprises predicting a wafer electrical test (WET) resulting value based on the output signal, detecting faulty processing based on the predicted WET resulting value, and correcting the faulty processing.
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Citations
44 Claims
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1. A method of manufacturing, the method comprising:
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processing a workpiece;
measuring a parameter characteristic of the processing;
forming an output signal corresponding to the characteristic parameter measured by using the characteristic parameter measured as an input to a partial least squares transistor model;
predicting a wafer electrical test (WET) resulting value based on the output signal;
detecting faulty processing based on the predicted WET resulting value; and
correcting the faulty processing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A computer-readable, program storage device encoded with instructions that, when executed by a computer, perform a method for manufacturing a workpiece, the method comprising:
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processing the workpiece;
measuring a parameter characteristic of the processing performed on the workpiece;
forming an output signal corresponding to the characteristic parameter measured by using the characteristic parameter measured as an input to a partial least squares transistor model;
predicting a wafer electrical test (WET) resulting value based on the output signal;
detecting faulty processing based on the predicted WET resulting value; and
correcting the faulty processing. - View Dependent Claims (26, 27, 28, 29, 30)
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31. A computer programmed to perform a method of manufacturing, the method comprising:
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processing a workpiece;
measuring a parameter characteristic of the processing performed on the workpiece;
forming an output signal corresponding to the characteristic parameter measured by using the characteristic parameter measured as an input to a partial least squares transistor model;
predicting a wafer electrical test (WET) resulting value based on the output signal;
detecting faulty processing based on the predicted WET resulting value; and
correcting the faulty processing. - View Dependent Claims (32, 33, 34, 35, 36)
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37. A method of manufacturing, the method comprising:
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forming a plurality of structures on a workpiece using an in-line process metrology tool having at least one input value in a processing step;
measuring a parameter characteristic of the plurality of structures;
forming an output signal using the measured characteristic parameter and the at least one input value as inputs to a partial least squares transistor model;
predicting a wafer electrical test (WET) resulting value based on the output signal;
detecting faulty processing in the processing step based on the predicted WET resulting value; and
correcting the faulty processing. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44)
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Specification