Wafer edge cleaning utilizing polish pad material

• US 6,622,334 B1
• Filed: 03/29/2000
• Issued: 09/23/2003
• Est. Priority Date: 03/29/2000
• Status: Expired due to Term

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Delehanty, Donald J., Ziemins, Uldis A., Ocasio, Jose M., Khoury, Raymond M.
• Primary Examiner(s): Warden, Sr., Robert J.
• Assistant Examiner(s): KARLS, SHAY LYNN
• Application Number:
  US09/537,206
• Time in Patent Office: 1,273 Days
• Field of Search: 15/77, 15/892, 15/893, 15/971, 151/02, 451/44, 451/41
• US Class Current: 15/77
• CPC Class Codes: B08B 1/32 using rotary cleaning members
• CPC Class Codes: B24B 9/065 of thin, brittle parts, e.g. semiconductors, wafers
• CPC Class Codes: H01L 21/02052 Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/67046 using mainly scrubbing means, e.g. brushes

Abstract

An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.

Claims

1. In a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer drive wheels for rotating the wafer, the improvement comprising:

wafer guide wheels supported proximate the wafer, with a polish pad material disposed on a circumference of the guide wheels, wherein the guide wheel is rotated in a direction opposite rotation of the wafer at the point of contact, and

wherein the polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer, and

wherein each drive wheel is supported on a control arm and each control arm also supports one of the guide wheels.

2. The improvement of claim 1 wherein the guide wheel is contoured having a circumferential groove receiving the edge of the wafer.

3. The improvement of claim 1 further comprising an inflatable air bladder disposed inwardly of the polish pad material to contour the polish pad material to the edge of the wafer.

4. The improvement of claim 1 further comprising an applicator applying dilute hydrofluoric acid to the edge of the wafer.

5. The improvement of claim 4 wherein the applicator comprises a roll applicator.

6. The improvement of claim 1 further comprising a brush contacting the edge of the wafer.

7. The improvement of claim 6 wherein the brush comprises a rotating cup brush.

8. The improvement of claim 6 further comprising a cylinder for moving the brush into and out of contact with the edge of the wafer.