Apparatus and method for maintaining a dry atmosphere to prevent moisture absorption and allow demoisturization of electronic components

• US 6,622,399 B1
• Filed: 10/26/2000
• Issued: 09/23/2003
• Est. Priority Date: 03/31/2000
• Status: Expired due to Term

• Current Assignee: Air Liquide Industrial US LP (Air Liquide SA), L'Air Liquide SA
• Original Assignee: L'Air Liquide Societe Anonyme Pour L'Etude et L'Exploitation Des Procedes Georges Claude (L'Air Liquide SA), Air Liquide America LP (Mitsubishi Chemical Group Corp.)
• Inventors: Boyce, Kristen, Theriault, Martin, Rabia, Stephane
• Primary Examiner(s): Lazarus, Ira S.
• Assistant Examiner(s): Ragonese, Andrea M.
• Application Number:
  US09/699,001
• Time in Patent Office: 1,062 Days
• Field of Search: 341/92, 341/95, 341/97, 342/01, 342/02, 342/18, 343/80, 342/11, 342/12, 62/78, 165/47.T, 312/31-31
• US Class Current: 34/380
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 21/67769 Storage means

Abstract

The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10° C. to about 60° C.

Claims

1. An electronic component storage system comprising:

an enclosed component storage area configured to enclose a plurality of electronic components;

a dry gas delivery system for delivery of a dry gas to the storage area to maintain a dry atmosphere in the storage area and to prevent moisture from being absorbed by the electronic components; and

a temperature control system for controlling a temperature of the dry gas to about 10°

C. to about 60°

C., wherein a temperature and a flow rate of the dry gas are controlled by the control system to eliminate moisture from the electronic components while the electronic components are stored in the storage area to achieve a moisture level in which moisture accounts for 0.1% or less of the weight of the electronic components.

2. The system of claim 1, wherein the component storage area is a feeder cart for storing the electronic components.

3. The system of claim 1, wherein the component storage area is a cabinet receiving at least one feeder cart for storing the electronic components.

4. The system of claim 1, wherein the component storage area is a storage cabinet for storing the electronic components.

5. The system of claim 1, wherein the temperature control system controls the temperature of the dry gas to about 20°

C. to about 50°

C.

6. The system of claim 1, wherein a flow rate of the dry gas delivered to the storage area is controlled by a control system including a humidity sensor within the component storage area.

7. The system of claim 1, wherein the temperature and the flow rate of the dry gas are controlled to remove about 0.1% or more of the weight of the electronic components by elimination of moisture while the components are stored in the storage area.

8. The system of claim 2, wherein the feeder cart is enclosed by panels and a door.

9. The system of claim 2, wherein the feeder cart is ESD dissipative.

10. The system of claim 1, wherein the component storage area contains at least one of the group consisting of trays, tapes, sticks, and bulk feeders containing the electronic components.

11. The system of claim 10, wherein the electronic components are surface mount devices.

12. The system of claim 11, wherein the surface mount devices include plastic cases.

29. The system of claim 2, wherein the feeder cart is ESD dissipative.

13. An integrated circuit chip storage system comprising:

an enclosed chip storage area containing a plurality of moisture sensitive integrated circuit chips;

an inert gas delivery system for delivery of an inert gas having a relative humidity of 10% or less to the storage area to maintain a dry atmosphere in the storage area and to prevent moisture from being absorbed by the chips; and

a temperature control system for controlling a temperature of the inert gas delivered to the storage area to a temperature of about 10°

C. to about 60°

C., wherein the temperature and the flow rate of the inert gas are controlled to remove about 0.1% or more of the weight of the chips by elimination of moisture while the components are stored in the storage area.

14. The system of claim 13, wherein the chip storage area is a feeder cart for storing the chips.

15. The system of claim 14, wherein the feeder cart is enclosed by panels and a door.

16. The system of claim 14, wherein the feeder cart is ESD dissipative.

17. The system of claim 13, wherein the chip storage area is a cabinet receiving at least one feeder cart storing the chips.

18. The system of claim 13, wherein the chip storage area is a storage cabinet for storing the chips in at least one of the group consisting of trays, tapes, sticks, and bulk feeders.

19. The system of claim 13, wherein the temperature control system controls the temperature of the inert gas to about 20°

C. to about 50°

C.

20. The system of claim 13, wherein a flow rate of the dry gas delivered to the storage area is controlled by a control system including a humidity sensor within the chip storage area.

21. The system of claim 13, wherein the electronic components are surface mount devices.

22. The system of claim 13, wherein the surface mount devices include plastic cases.

23. The system of claim 13, wherein a temperature and a flow rate of the dry gas are controlled by the control system to eliminate moisture from the chips while the chips are stored in the storage area to achieve a moisture level in which moisture accounts for 0.1% or less of the weight of the chips.

24. An electronic component storage system comprising:

an enclosed component storage area configured to enclose a plurality of electronic components;

a nitrogen gas delivery system for delivery of nitrogen gas to the storage area to maintain a dry atmosphere in the storage area and to prevent moisture from being absorbed by the electronic components; and

a control system for controlling a flow of the nitrogen gas to the storage area, wherein the temperature and the flow rate of the nitrogen gas are controlled to remove about 0.1% or more of the weight of the chips by elimination of moisture while the components are stored in the storage area.

25. The system of claim 24, wherein the component storage area is a feeder cart for storing the electronic components.

26. The system of claim 24, wherein the component storage area is a cabinet receiving at least one feeder cart for storing the electronic components.

27. The system of claim 24, wherein the component storage area is a storage cabinet for storing the electronic components.

28. The system of claim 24, wherein the temperature control system controls the temperature of the nitrogen gas to about 20°

C. to about 50°

C.

30. An integrated circuit chip storage system comprising:

an enclosed chip storage area containing a plurality of moisture sensitive integrated circuit chips;

an inert gas delivery system for delivery of an inert gas leaving a relative humidity of 10% or less to the storage area to maintain a dry atmosphere in the storage area and to prevent moisture from being absorbed by the chips; and

a temperature control system for controlling a temperature of the inert gas delivered to the storage area to a temperature of about 10°

C. to about 60°

C., wherein a temperature and a flow rate of the inert gas are controlled by the control system to eliminate moisture from the chips while the chips are stored in the storage area to achieve a moisture level in which moisture accounts for 0.1% or less of the weight of the chips.

31. An electronic component storage system comprising:

an enclosed component storage area configured to enclose a plurality of electronic components;

a nitrogen gas delivery system for delivery of nitrogen gas to the storage area to maintain a dry atmosphere in the storage area and to prevent moisture from being absorbed by tile electronic components; and

a control system for controlling a flow of the nitrogen gas to die storage area, wherein a temperature and a flow rate of the nitrogen gas are controlled by the control system to eliminate moisture from the chips while the chips are stored in the storage area to achieve a moisture level in which moisture accounts for 0.1% or less of the weight of the chips.