Plasma processing apparatus
First Claim
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1. A plasma processing system comprising:
- a vacuum vessel;
a substrate table arranged in the vacuum vessel for supporting a substrate;
a microwave power supply system for generating high-frequency waves;
a waveguide for guiding said high-frequency waves into the vacuum vessel;
a dielectric member arranged at an end portion of the waveguide; and
a conductive film of a metal coated on the lower surface of said dielectric member, the conductive film facing the substrate table, the conductive film having a thickness smaller than a skin thickness of the conductive film so that standing wave formation in the vacuum vessel is suppressed while allowing high-frequency waves to penetrate the conductive film toward the substrate.
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Abstract
A plasma processing system may include a vacuum vessel, a substrate table arranged in the vacuum vessel, and a radio-frequency power supply system for generating high-frequency waves. A waveguide may be provided for guiding high-frequency waves into the vacuum vessel, and a dielectric member may be arranged at an end portion of the waveguide. The plasma processing system may also include a conductive film arranged on the dielectric member and facing the substrate table, wherein the conductive film may have a thickness smaller than or approximately equal to a skin thickness of the conductive film.
35 Citations
5 Claims
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1. A plasma processing system comprising:
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a vacuum vessel;
a substrate table arranged in the vacuum vessel for supporting a substrate;
a microwave power supply system for generating high-frequency waves;
a waveguide for guiding said high-frequency waves into the vacuum vessel;
a dielectric member arranged at an end portion of the waveguide; and
a conductive film of a metal coated on the lower surface of said dielectric member, the conductive film facing the substrate table, the conductive film having a thickness smaller than a skin thickness of the conductive film so that standing wave formation in the vacuum vessel is suppressed while allowing high-frequency waves to penetrate the conductive film toward the substrate. - View Dependent Claims (2, 3, 4, 5)
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Specification