Connector with base having channels to facilitate surface mount solder attachment

• US 6,623,283 B1
• Filed: 12/20/2001
• Issued: 09/23/2003
• Est. Priority Date: 03/08/2000
• Status: Expired due to Fees

• Current Assignee: Autosplice, Inc. (Autosplice Parent, Inc.)
• Original Assignee: Autosplice, Inc. (Autosplice Parent, Inc.)
• Inventors: Tomczak, Gary L., Torigian, Gregory K., Lynch, Joseph J.
• Primary Examiner(s): Bradley, P. Austin
• Assistant Examiner(s): LEON, EDWIN A
• Application Number:
  US10/027,894
• Time in Patent Office: 642 Days
• Field of Search: 439/83, 439/876, 298/40, 228/180.21, 228/245, 228/246, 228/248.1, 228/165, 228/167, 228/254, 361/773, 361/772, 361/774, 361/760, 361/782, 361/783, 257/696, 257/779, 257/773, 174/260
• US Class Current: 439/83
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 43/0256 for soldering or welding connectors to a printed circuit board
• CPC Class Codes: H01R 43/0263 for positioning or holding parts during soldering or welding process
• CPC Class Codes: H05K 13/0465 by soldering H05K13/0469 takes precedence
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A surface mount connector for circuit board attachment is provided in the form of an elongate pin with a head or base formed at the lower end of the pin. The base has a bottom surface that extends substantially normal to the axis of the pin and is dimensioned to be positioned on, and soldered to, a pad on a primary circuit board. A solder bond is achieved by re-flowing a quantity of solder applied to the pad along with a quantity of flux before placing the base on top of the quantity of solder. The base is formed with a plurality of channels that open through the bottom surface and through a peripheral wall of the base for permitting gases generated by vaporizing the flux during solder re-flow to escape from underneath the base and to increase the strength of the solder bond between the pad and the base. Exhaustion of the gases prevents undesirable skating of the connector and misalignment and eliminates voids in the solder bond that would otherwise weaken the bond.

Claims

1. A surface mount connector for circuit board attachment, comprising:

a) an elongate pin defining an axis and having opposing ends, a lower end being formed with a base with a bottom surface extending substantially normal to the axis of the pin and dimensioned to be positioned on top of, and soldered to, a hole-less pad on a primary circuit board by re-flowing a quantity of solder applied to the pad along with a quantity of a flux before placing the base on top of the quantity of solder, the pin having an upper end being dimensioned and configured to be engageable with a mating connector or a secondary circuit board, the base being formed with at least one channel that opens through the bottom surface and through a peripheral wall of the base for permitting gases generated by vaporizing the flux during solder re-flow to escape from underneath the base to strengthen the solder bond between the pad and the base,

b) the pin being formed with at least one stop for establishing a vertical position relative to a reference surface.

2. A surface mount connector for circuit board attachment, comprising:

a) an elongate pin defining an axis and having opposing ends, a lower end being formed with a base with a bottom surface extending substantially normal to the axis of the pin and dimensioned to be positioned on top of, and soldered to, a hole-less pad on a primary circuit board by re-flowing a quantity of solder applied to the pad along with a quantity of a flux before placing the base on top of the quantity of solder, the pin having an upper end being dimensioned and configured to be engageable with a mating connector or a secondary circuit board, the base being formed with at least one channel that opens through the bottom surface and through a peripheral wall of the base for permitting gases generated by vaporizing the flux during solder re-flow to escape from underneath the base to strengthen the solder bond between the pad and the base,

b) the base being formed with a generally centrally located cavity or recess that opens through the bottom surface of the base and communicates with a plurality of radially-extending channels that intersect.

3. In combination:

A) a substrate area having a planar mounting pad free of holes for receiving the base of an SMT connector;

B) an SMT connector forming a solder bond with the mounting pad of the substrate area,

i) said SMT connector having a longitudinal dimension and a lower end forming a base with a solid bottom surface circumscribed by a peripheral wall with the bottom surface extending generally normal to the longitudinal dimension and parallel to the mounting pad of the substrate area and positioned on top of and forming the solder bond with the mounting pad of the substrate area,

ii) other than the solder bond, the SMT connector being free at its base of any lateral support to other parts of the connector or to other connectors,

iii) the solid bottom surface of the base having a plurality of channels of limited depth running laterally from the inside of the bottom surface to the base peripheral wall for venting of gasses during the soldering process and for enhancing the solder bond between the base and the solid substrate area, said channels being filled with solder during the soldering process;

C) the connector being a pin having a cylindrical or square configuration;

D) the pin being formed with at least one stop for establishing a vertical position relative to a reference surface.

4. In combination:

A) a substrate area having a planar mounting pad free of holes for receiving the base of an SMT connector;

B) an SMT connector forming a solder bond with the mounting pad of the substrate area,

i) said SMT connector having a longitudinal dimension and a lower end forming a base with a solid bottom surface circumscribed by a peripheral wall with the bottom surface extending generally normal to the longitudinal dimension and parallel to the mounting pad of the substrate area and positioned on top of and forming the solder bond with the mounting pad of the substrate area,

ii) other than the solder bond, the SMT connector being free at its base of any lateral support to other parts of the connector or to other connectors,

iii) the solid bottom surface of the base having a plurality of channels of limited depth running laterally from the inside of the bottom surface to the base peripheral wall for venting of gasses during the soldering process and for enhancing the solder bond between the base and the solid substrate area, said channels being filled with solder during the soldering process;

C) the base being formed with a plurality of radially-extending channels that intersect and a generally centrally located cavity or recess that opens through the bottom surface of the base and communicates with the plurality of radially-extending channels.

5. A surface mount connector for circuit board attachment, comprising:

a) an elongate pin defining an axis and having opposing ends, a lower end being formed with a base with a bottom surface extending substantially normal to the axis of the pin and dimensioned to be positioned on top of, and soldered to, a hole-less pad on a primary circuit board by re-flowing a quantity of solder applied to the pad along with a quantity of a flux before placing the base on top of the quantity of solder, the pin having an upper end dimensioned and configured to be engageable with a mating connector or a secondary circuit board, the base being formed with a plurality of laterally-extending channels each of which opens through the bottom surface and through a peripheral wall of the base, the channels being laterally separated at least at the peripheral wall of the base, the plurality of laterally-extending channels being dimensioned such as to permit gases generated by vaporizing the flux during solder re-flow to escape from underneath the base to limit pin-skating and to strengthen the solder bond between the pad and the base.

6. The surface mount connector of claim 5, wherein the pin has a cylindrical or square configuration and each of the channels have a depth and width of about 0.006-0.010 inches.

7. The surface mount connector of claim 5, wherein the pin has a cylindrical or square configuration and each of the channels have a depth and width at least about 0.006 inches.

8. The surface mount connector of claim 7, wherein the channels in the base are parallel.

9. The surface mount connector of claim 5, wherein the center of the base has a region free of the channels, and the channels extend generally radially from the base region free of the channels to the base periphery.

10. The surface mount connector of claim 9, wherein the base is formed with a plurality of radially-extending ribs that extend between the channels.

11. In combination:

A) a substrate area having a planar mounting pad free of holes for receiving the base of an SMT connector;

B) an SMT connector forming a solder bond with the mounting pad of the substrate area,

i) said SMT connector having a longitudinal dimension and a lower end forming a base with a solid bottom surface circumscribed by a peripheral wall with the bottom surface extending generally normal to the longitudinal dimension and parallel to the mounting pad of the substrate area and positioned on top of and forming the solder bond with the mounting pad of the substrate area,

ii) other than the solder bond, the SMT connector being free at its base of any lateral support to other parts of the connector or to other connectors,

iii) the solid bottom surface of the base having a plurality of channels of given depth and width running laterally from the inside of the bottom surface to the base peripheral wall;

C) the solder bond having been formed by re-flowing a layer of solder paste containing flux on the pad while the base is in contact with the layer of solder paste;

D) each of the channels given depth and width being at least about the thickness of the layer of solder paste before reflowing so as to permit gases generated by vaporizing the flux during solder re-flow to escape from underneath the base to limit pin-skating and to strengthen the solder bond between the pad and the base;

E) said channels being filled with solder when the re-flowed solder hardens forming the solder bond.

12. The combination of claim 11, wherein each of the channels have a depth and width at least about 0.006 inches.

13. The combination of claim 11, wherein each of the channels have a depth and width of about 0.006-0.010 inches.