Three dimensional processor using transferred thin film circuits
First Claim
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1. A method of fabricating a circuit, comprising:
- forming a first processing circuit in a first layer of semiconductor material;
forming a second circuit having an array of diodes in a second layer of semiconductor material;
bonding the second layer to the first layer with a bonding layer;
forming a plurality of vias through the bonding layer, each via defining an interconnect path between the first circuit and the second circuit; and
depositing a conductor into the vias to interconnect the first circuit with the second circuit along the interconnection paths.
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Abstract
A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.
274 Citations
37 Claims
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1. A method of fabricating a circuit, comprising:
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forming a first processing circuit in a first layer of semiconductor material;
forming a second circuit having an array of diodes in a second layer of semiconductor material;
bonding the second layer to the first layer with a bonding layer;
forming a plurality of vias through the bonding layer, each via defining an interconnect path between the first circuit and the second circuit; and
depositing a conductor into the vias to interconnect the first circuit with the second circuit along the interconnection paths. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of fabricating a processing circuit, comprising:
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forming a second circuit including a diode array within a second layer of a semiconductor material;
bonding the second circuit to the first circuit with a bonding layer;
forming a plurality of vias through the bonding layer, each via defining an interconnect path between the first circuit and the second circuit; and
depositing a conductor into the vias to interconnect the first circuit with the second circuit along the interconnection paths. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method of fabricating a microprocessor, comprising:
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forming a first circuit layer having a microprocessor in a silicon material;
forming a second circuit layer including an array of diode elements;
bonding the second circuit layer to the first circuit layer with a bonding layer;
forming a plurality of vias through the bonding layer, each via defining an interconnect path between the first circuit and the second circuit; and
depositing a conductor into the vias to interconnect the first circuit with the second circuit along the interconnection paths. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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21. A method of fabricating a circuit, comprising:
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forming a first circuit in a first layer of a first semiconductor material;
forming a second circuit in a second layer of a second semiconductor material;
bonding the first layer to the second layer with a bonding layer of an adhesive;
forming a plurality of vias through the bonding layer, each via defining an interconnection path between the first circuit and the second circuit; and
depositing a conductor into the vias to interconnect the first circuit with the second circuit along the interconnection paths. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A method of fabricating a circuit, comprising:
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forming a first circuit in a first layer of a silicon-on-insulator material;
forming a second circuit in a second layer of a semiconductor material, the second layer including an array of diodes;
bonding the first layer to the second layer with a bonding layer of an electrically insulating and thermally conductive adhesive compound, the adhesive compound including a polymeric adhesive and a thermally conductive filler, the bonding layer being less than about 5 microns thick;
forming a plurality of vias through the bonding layer, each via defining an interconnection path between the first circuit and the second circuit; and
depositing a conductor into the vias to interconnect the first circuit with the second circuit along the interconnection paths. - View Dependent Claims (34, 35, 36, 37)
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Specification