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Three dimensional processor using transferred thin film circuits

  • US 6,624,046 B1
  • Filed: 11/01/1999
  • Issued: 09/23/2003
  • Est. Priority Date: 09/30/1993
  • Status: Expired due to Fees
First Claim
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1. A method of fabricating a circuit, comprising:

  • forming a first processing circuit in a first layer of semiconductor material;

    forming a second circuit having an array of diodes in a second layer of semiconductor material;

    bonding the second layer to the first layer with a bonding layer;

    forming a plurality of vias through the bonding layer, each via defining an interconnect path between the first circuit and the second circuit; and

    depositing a conductor into the vias to interconnect the first circuit with the second circuit along the interconnection paths.

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