Chip scale surface mounted device and process of manufacture

• US 6,624,522 B2
• Filed: 03/28/2001
• Issued: 09/23/2003
• Est. Priority Date: 04/04/2000
• Status: Expired due to Term

• Current Assignee: Infineon Technologies Americas Corp. (Infineon Technologies AG)
• Original Assignee: International Rectifier Corporation (Infineon Technologies AG)
• Inventors: Standing, Martin, Schofield, Hazel Deborah
• Primary Examiner(s): Tran, Minh Loan
• Assistant Examiner(s): Dickey, Thomas L.
• Application Number:
  US09/819,774
• Publication Number:
  US 20010048116A1
• Time in Patent Office: 909 Days
• Field of Search: 438/307, 438/546, 438/650, 438/652-654, 257/741, 257/762, 257/768, 257/772, 257/781, 257/782, 257/784, 257/785, 257/786
• US Class Current: 257/782
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 2224/1147 using a lift-off mask
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73153 Bump and layer connectors
• CPC Class Codes: H01L 2224/8121 using a reflow oven
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/492 Bases or plates or solder therefor
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/1301 : Thyristor
• CPC Class Codes: H01L 2924/13034 : Silicon Controlled Rectifier [SCR]
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A solderable contact layer is then formed over the passivation layer. The individual die are mounted drain side down in a metal clip or can with the drain electrode disposed coplanar with a flange extending from the can bottom.

Claims

1. A semiconductor device package comprising a semiconductor device die having parallel top and bottom surfaces;

said top surface having a first planar metallic electrode, said bottom surface having a solderable planar metal electrode;

at least one solderable conductive layer formed on at least a first portion of said first planar metallic electrode, said at least one solderable conductive layer having an upper planar surface;

a metal clip having a flat web portion and at least one peripheral rim portion extending from an edge of said flat web portion;

said bottom surface of said web being electrically connected in surface to surface contact to said solderable planar metal electrode on the bottom surface of said die;

said peripheral rim portion of said clip being extended over and spaced from an edge of said die and terminating in a clip rim surface which is in plane parallel to the plane of said upper planar surface of said at least one solderable conductive layer and being insulated therefrom, whereby said clip rim surface and said at least one solderable conductive layer are mountable to metallized patterns on a support surface, wherein a plurality of spaced solderable planar metal post-shaped electrodes are connected to said planar metallic electrode and all terminate in the plane of said upper planar surface.

2. The package of claim 1 which further includes a second planar metallic electrode on said top surface of said die, said second metallic electrode comprising a control electrode;

and a second solderable planar metal post-shaped electrode having an upper surface which is coplanar with said upper planar surface of said at least one solderable conductive layer.

3. The device of claim 1 wherein all of said solderable planar metal post-shaped electrodes include a nickel layer connected to the underlying metallic electrode and an easily solderable metal connected atop said nickel layer.

4. The device of claim 3 which further includes a conductive epoxy connecting said bottom surface of said web to said solderable planar metal electrode.

5. The device of claim 3 wherein said clip is a cup-shaped structure and wherein said peripheral rim is a continuous rim surrounding and spaced from the exterior of said die.

6. The device of claim 1 which further includes a conductive epoxy connecting said bottom surface of said web to said solderable planar metal electrode.

7. The device of claim 1 wherein said clip has a second peripheral rim portion on the opposite side of said clip from said at least one peripheral rim portion which extends over and is spaced from an opposite edge of said die and terminating in said plane parallel to the plane in which said at least one peripheral rim portion terminates.

8. The device of claim 1 wherein said clip is a cup-shaped structure and wherein said peripheral rim is a continuous rim surrounding and spaced from the exterior of said die.

9. The device of claim 8 wherein said space between said die and said peripheral rim is filled with an insulation bead.

10. A semiconductor device package comprising a semiconductor device die having parallel top and bottom surfaces;

said top surface having a first planar metallic electrode, said bottom surface having a solderable planar metal electrode;

at least one solderable conductive layer formed on at least a first portion of said first planar metallic electrode, said at least one solderable conductive layer having an upper planar surface;

a metal clip having a flat web portion and at least one peripheral rim portion extending from an edge of said flat web portion;

said bottom surface of said web being electrically connected in surface to surface contact to said solderable planar metal electrode on the bottom surface of said die;

said peripheral rim portion of said clip being extended over and spaced from an edge of said die and terminating in a clip rim surface which is in plane parallel to the plane of said upper planar surface of said at least one solderable conductive layer and being insulated therefrom, wherein said rim portion and said web portion are integral and form a unitary body, said clip is a cup-shaped structure, said peripheral rim is a continuous rim surrounding and spaced from the exterior of said die, and said space between said die and said peripheral rim is filled with an insulation bead.

11. A semiconductor device package comprising a semiconductor device die having parallel top and bottom surfaces;

said top surface having a first planar metallic electrode, said bottom surface having a solderable planar metal electrode;

at least one solderable conductive layer formed on at least a first portion of said first planar metallic electrode, said at least one solderable conductive layer having an upper planar surface;

a metal clip having a flat web portion and at least one peripheral rim portion extending from an edge of said flat web portion;

said bottom surface of said web being electrically connected in surface to surface contact to said solderable planar metal electrode on the bottom surface of said die;

said peripheral rim portion of said clip being extended over and spaced from an edge of said die and terminating in a clip rim surface which is in plane parallel to the plane of said upper planar surface of said at least one solderable conductive layer and being insulated therefrom, wherein said rim portion and said web portion are integral and form a unitary body, said clip is a cup-shaped structure, said peripheral rim is a continuous rim surrounding and spaced from the exterior of said die, a conductive epoxy connects said bottom surface of said web to said solderable planar metal electrode, and said space between said die and said peripheral rim is filled with an insulation bead.