Probe card assembly

• US 6,624,648 B2
• Filed: 12/05/2001
• Issued: 09/23/2003
• Est. Priority Date: 11/16/1993
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Mathieu, Gaetan L., Eldridge, Benjamin N., Grube, Gary W., Khandros, Igor Y.
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): Tang, Minh N.
• Application Number:
  US10/011,335
• Publication Number:
  US 20020067181A1
• Time in Patent Office: 657 Days
• Field of Search: 324/754, 324/755, 324/761, 324/762, 324/765, 428/209, 428/210, 439/482, 257/723, 257/724, 297/05, 361/764, 361/773, 361/776, 361/783, 361/813, 174/251, 174/254, 174/256, 174/260, 174/262, 174/267
• US Class Current: 324/756.03
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: C23C 18/31 Coating with metals
• CPC Class Codes: C23C 18/32 Coating with nickel, cobalt or mixtures thereof with phosphorus or boron C23C18/50 takes precedence
• CPC Class Codes: C25D 21/02 Heating or cooling
• CPC Class Codes: C25D 5/12 at least one layer being of nickel or chromium
• CPC Class Codes: C25D 7/0607 Wires
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/4889 Connection or disconnection of other leads to or from wire-like parts, e.g. wires
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/76897 Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step self-aligned silicidation on field effect transistors H01L29/665
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/12 Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 2224/13099 : Material
• CPC Class Codes: H01L 2224/16 : of an individual bump connector
• CPC Class Codes: H01L 2224/16145 : the bodies being stacked
• CPC Class Codes: H01L 2224/45 : of an individual wire connector
• CPC Class Codes: H01L 2224/45015 : being circular
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48 : of an individual wire connector
• CPC Class Codes: H01L 2224/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 2224/49109 : outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73203 : Bump and layer connectors
• CPC Class Codes: H01L 2224/81801 : Soldering or alloying
• CPC Class Codes: H01L 2224/85201 : Compression bonding
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 : Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06555 : Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/72 : Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01R 12/52 : connecting to other rigid printed circuits or like structures
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/0397 : Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/068 : wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/1031 : Surface mounted metallic connector elements
• CPC Class Codes: H05K 2201/10318 : Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2201/10719 : Land grid array [LGA]
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/10757 : Bent leads
• CPC Class Codes: H05K 2201/10878 : Means for retention of a lead in a hole
• CPC Class Codes: H05K 2201/10909 : Materials of terminal, e.g. of leads or electrodes of components
• CPC Class Codes: H05K 2201/10946 : Leads attached onto leadless component after manufacturing the component
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/308 : Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 3/3426 : characterised by the leads
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: H05K 3/4092 : Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 7/1069 : with spring contact pieces
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49222 : forming array of contacts or terminals

Abstract

A probe card assembly includes a probe card, a space transformer, and an interposer disposed between the space transformer and the probe card. Suitable mechanisms for adjusting the orientation of the space transformer without changing the orientation of the probe card, and for determining what adjustments to make, are disclosed.

Claims

1. A probe card assembly comprising:

a probe card comprising a plurality of electrical contacts;

a probe substrate having a plurality of elongate, resilient probe elements; and

a second substrate disposed between and spaced from said probe card and said probe; and

a plurality of elongate interconnection elements providing compliant electrical connections through said second substrate between said probe card and said probe substrate and thereby electrically connecting ones of said electrical contacts with ones of said probe elements.

2. The probe card assembly of claim 1, wherein said plurality of elongate interconnection elements extend from opposing surfaces of said second substrate.

3. The probe card assembly of claim 1, wherein each of said plurality of elongate interconnection elements is disposed such that each said elongate interconnection element passes through an opening in said second substrate, opposite ends of each said elongate interconnection element being spaced from said opposing surfaces of said interconnect structure.

4. The probe card assembly of claim 1, wherein said plurality of elongate interconnection elements exert forces against said probe card and said probe substrate.

5. The probe card assembly of claim 4, wherein said forces are spring forces.

6. The probe card assembly of claim 1, wherein said elongate interconnection elements are resilient.

7. The probe card assembly of claim 6, wherein at least one of said elongate interconnection elements comprises a core of a first material and a coating of a second material, wherein said second material is more resilient than said first material.

8. The probe card assembly of claim 1, further comprising means for altering an orientation of said probe substrate with respect to said probe card.

9. The probe card assembly of claim 1 further comprising at least one moveable element disposed so as to affect an orientation of said probe substrate with respect to said probe card.

10. The probe card assembly of claim 9, wherein said moveable element is threaded.

11. The probe card assembly of claim 9, wherein said moveable element comprises a screw.

12. The probe card assembly of claim 11, wherein said screw comprises a differential screw.

13. The probe card assembly of claim 1 further comprising at least one moveable element disposed so that movement of said element in a first direction causes at least a portion of said probe substrate to move toward said probe card.

14. The probe card assembly of claim 13, wherein movement of said moveable element in a second direction allows at least a portion of said probe substrate to move away from said probe card.

15. The probe card assembly of claim 1 further comprising a plurality of moveable elements, each disposed so as to affect a position of a portion of said probe substrate with respect to a portion of said probe card.

16. The probe card assembly of claim 1 further comprising a servo mechanism disposed to alter a position of said probe substrate with respect to said probe card.

17. The probe card assembly of claim 1 further comprising a piezoelectric actuator disposed to alter a position of said probe substrate with respect to said probe card.

18. The probe card assembly of claim 1, wherein said probe substrate comprises a space transformer.

19. The probe card assembly of claim 1, wherein said probe elements comprise a core of a first material and a coating of a second material, wherein said second material is more resilient than said first material.

20. A probe card assembly comprising:

probe card means for providing electrical contacts to a tester;

probe substrate means for providing elongate, resilient electrical contacts to a semiconductor device under test; and

interconnection means for compliantly connecting electrically said probe card means and said probe substrate means at a plurality of variations in orientation of said probe substrate means with respect to said probe card means.

21. The probe card assembly of claim 20, wherein said interconnection means comprises a plurality of elongate interconnection elements for resiliently connecting electrically ones of said electrical contacts of said probe card means with ones of said electrical contacts of said probe substrate means.

22. The probe card assembly of claim 20 further comprising means for altering an orientation of said probe substrate means with respect to said probe card means.

23. A probe card assembly comprising:

a probe card comprising a plurality of electrical contacts;

a probe substrate moveably fixed to said probe card and comprising a plurality of elongate, resilient probe elements, ones of said elongate resilient probe elements being in electrical communication with ones of said electrical contacts; and

a moveable element disposed so as to affect an orientation of said probe substrate with respect to said probe card.

24. The probe card assembly of claim 23, wherein movement of said moveable element in a first direction causes at least a portion of said probe substrate to move away from said probe card.

25. The probe card assembly of claim 24, wherein movement of said moveable element in a second direction allows at least a portion of said probe substrate to move toward said probe card.

26. The probe card assembly of claim 23, wherein said moveable element is threaded.

27. The probe card assembly of claim 23, wherein said moveable element comprises a screw.

28. The probe card assembly of claim 27, wherein said screw comprises a differential screw.

29. The probe card assembly of claim 23, wherein said moveable element comprises a servo mechanism.

30. The probe card assembly of claim 23, wherein said moveable element comprises a piezoelectric actuator.

31. The probe card assembly of claim 23 further comprising a plurality of said moveable elements.

32. The probe card assembly of claim 23, wherein said probe substrate comprises a space transformer.

33. The probe card assembly of claim 23, wherein said probe elements comprise a core of a first material and a coating of a second material, wherein said second material is more resilient than said first material.

34. A probe card assembly comprising:

probe card means for providing an interface to a semiconductor tester;

substrate means for supporting a plurality of elongate, resilient probe elements, said probe elements being in electrical communication with said probe card means, said probe substrate means being moveably fixed to said probe card means; and

means for altering an orientation of said substrate means with respect to said probe card means.

35. The probe card assembly of claim 34, wherein said probe elements comprise a core of a first material and a coating of a second material, wherein said second material is more resilient than said first material.

36. The probe card assembly of claim 34 further comprising interposer means disposed between said probe card means and said substrate means for exerting forces against said probe card means and said substrate means.