Infrared data communication module and method of making the same

• US 6,625,036 B1
• Filed: 08/31/2000
• Issued: 09/23/2003
• Est. Priority Date: 08/31/1999
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Horio, Tomoharu
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): DINH, TUAN T
• Application Number:
  US09/653,268
• Time in Patent Office: 1,118 Days
• Field of Search: 361/760-764, 361/776-779, 438/25-29, 257/80-85, 257/666-667, 257/700-703, 257/723-724
• US Class Current: 361/760
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 31/12 structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto semiconductor devices with at least one potential barrier or surface barrier adapted for light emission H01L33/00; amplifiers using electroluminescent element and photocell H03F17/00; electroluminescent light sources per se H05B33/00
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: H05K 2201/09181 Notches in edge pads
• CPC Class Codes: H05K 2201/09954 More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A method of making an infrared data communication module includes the steps of: forming predetermined wiring patterns on an obverse and a reverse surfaces (10a, 10b) of a substrate (1); mounting, on one of the surfaces of the substrate (1), a group of components including plural sets of light emitting elements (2) and light receiving elements (3); resin-packaging the group of components mounted on the substrate (1); and dividing the resin-packaged components to provide a plurality of infrared data communication modules (4) each of which includes a respective set of light emitting element and light receiving element. The resin-packaging step includes forming a plurality of mutually separated resin packages (4) each of which collectively seals at least two sets of light emitting elements (2) and light receiving elements (3).

Claims

1. A method of making infrared data communication modules comprising the steps of:

forming predetermined conductor patterns on an obverse and a reverse surfaces of a substrate;

mounting, on one of the surfaces of the substrate, plural sets of light emitting elements and light receiving elements;

resin-molding a non-cut package which encloses the plural sets of light emitting elements and light receiving elements on the substrate; and

dividing the non-cut package into a plurality of cut packages each of which encloses a respective set of light emitting element and light receiving element;

wherein the mounting step includes arranging the plural sets of light emitting elements and light receiving elements in a matrix on said one surface of the substrate; and

wherein the resin-molding step includes forming a plurality of non-cut packages arranged in a matrix.

2. The method of making infrared data communication modules according to claim 1, wherein the substrate is elongated in one direction, the substrate being formed with a plurality of slits extending widthwise of the substrate and spaced from each other longitudinally of the substrate, the plural sets of light emitting elements and light receiving elements being mounted on said one surface of the substrate in each of regions defined between the slits.

3. The method of making infrared data communication modules according to claim 1, wherein the pattern forming step includes forming, on the reverse surface of the substrate, terminals for connection to through-holes penetrating the substrate thicknesswise together with dummy patterns which are substantially equal in thickness to the terminals.

4. The method of making infrared data communication modules according to claim 1, wherein the pattern forming step includes forming, on the reverse surface of the substrate, terminals for connection to through-holes penetrating the substrate thicknesswise, the terminals being elongated to be substantially rectangular for bonding to an external mounting board.

5. An infrared data communication module comprising:

a substrate having an obverse surface and a reverse surface,

a wiring pattern formed on the obverse surface of the substrate,

a set of light emitting element and light receiving element mounted on the obverse surface of the substrate in electrical connection to the wiring pattern,

a resin package formed on the obverse surface of the substrate for enclosing the set of light emitting element and light receiving element,

a plurality of terminals formed on the reverse surface of the substrate in electrical connection to the wiring pattern, and

a dummy pattern formed on the reverse surface of the substrate but electrically separated from the wiring pattern and the terminals, the dummy pattern corresponding in position and in general configuration to the wiring pattern.