×

Semiconductor processing module with integrated feedback/feed forward metrology

  • US 6,625,497 B2
  • Filed: 07/10/2001
  • Issued: 09/23/2003
  • Est. Priority Date: 11/20/2000
  • Status: Expired due to Fees
First Claim
Patent Images

1. An apparatus for processing a semiconductor wafer, comprising:

  • a measuring tool for measuring a dimension of a structure on the wafer;

    a first processing tool for performing a first process on the wafer using a first set of process parameter values;

    a transfer mechanism for transferring the wafer between the measuring tool and the first processing tool;

    a chamber for enclosing the transfer mechanism and allowing communication between the transfer mechanism, the measuring tool and the first processing tool in a clean environment; and

    a processor configured to select the first set of process parameter values based on the measurement of the dimension;

    wherein the measuring tool is for measuring a critical dimension (CD) of a target feature on the wafer;

    wherein the chamber comprises;

    a mainframe for mounting a plurality of processing tools, including the first processing tool;

    a factory interface for housing the measurement tool and for mounting a wafer cassette; and

    a transfer chamber between and in communication with the mainframe and the factory interface; and

    wherein the transfer mechanism comprises a first robot for transferring the wafer between the measurement tool, the transfer chamber and the wafer cassette, and a second robot for transferring the wafer between the transfer chamber and the first processing tool.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×