Heat transfer device

• US 6,626,231 B2
• Filed: 08/01/2002
• Issued: 09/30/2003
• Est. Priority Date: 09/18/2001
• Status: Expired due to Term

• Current Assignee: Alcatel SA (Nokia Corporation)
• Original Assignee: Alcatel SA (Nokia Corporation)
• Inventors: Tjiptahardja, Tisna, Amidieu, Marcel, Cluzet, Gérard
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): MCKINNON, TERRELL L
• Application Number:
  US10/208,864
• Publication Number:
  US 20030051857A1
• Time in Patent Office: 425 Days
• Field of Search: 165/41, 165/46, 165/86, 165/104.76, 165/104.33, 244/158.R, 244/159
• US Class Current: 165/41
• CPC Class Codes: B64G 1/503 Radiator panels
• CPC Class Codes: B64G 1/506 Heat pipes
• CPC Class Codes: F28D 15/043 forming loops, e.g. capillary pumped loops

Abstract

A heat transfer device includes a capillary-pumped first fluid loop including an evaporator situated on a satellite in the vicinity of a source of dissipated heat and a condenser connected by heat transfer members to the evaporator and situated on a deployable radiator panel of the satellite. The deployable radiator comprises at least two panels, and the heat transfer device itself further comprises at least one second capillary-pumped fluid loop. The fluid loops are connected in cascade with each other so that the evaporator of each fluid loop other than the first fluid loop is on the same panel as the condenser of the preceding loop and the condenser of each fluid loop other than the first fluid loop is on the panel next to that carrying the condenser of the first loop. The evaporator of one loop is connected to the condenser of the same loop by flexible heat transfer members.

Claims

1. A heat transfer device including a capillary-pumped first fluid loop including an evaporator situated on a satellite in the vicinity of a source of dissipated heat and a condenser connected by heat transfer means to said evaporator and situated on a deployable radiator panel of said satellite, in which heat transfer device said deployable radiator comprises at least two panels, said heat transfer device itself further comprises at least one second capillary-pumped fluid loop, said fluid loops are connected in cascade with each other so that the evaporator of each fluid loop other than said first fluid loop is on the same panel as the condenser of the preceding loop and the condenser of each fluid loop other than said first fluid loop is on the panel next to that carrying the condenser of said first loop, and said evaporator of one loop is connected to said condenser of the same loop by flexible heat transfer means.

2. The heat transfer device claimed in claim 1 wherein heat is transferred between said condenser of one loop and said evaporator of the next loop by means of at least one heat pipe.

3. The heat transfer device claimed in claim 1 wherein said evaporator of one or more of said loops takes the form of a plurality of individual evaporator circuits connected in parallel or in series with each other.

4. The heat transfer device claimed in claim 1 wherein said condenser of one or more of said loops takes the form of a plurality of individual condenser circuits connected in parallel or in series with each other.