Bi-level heat sink

• US 6,626,233 B1
• Filed: 01/03/2002
• Issued: 09/30/2003
• Est. Priority Date: 01/03/2002
• Status: Expired due to Fees

• Current Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Original Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Inventors: Connors, Matthew Joseph
• Primary Examiner(s): ATKINSON, CHRISTOPHER MARK
• Application Number:
  US10/038,636
• Time in Patent Office: 635 Days
• Field of Search: 165/80.3, 165/185, 165/104.26, 165/104.21, 165/104.33, 165/122, 361/700, 361/687, 257/714, 257/715, 257/722, 174/15.2, 174/16.3
• US Class Current: 165/80.3
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A bi-level assembly comprises a heat sink, a processor and a power supply. The heat sink includes a base and at least one fin structure attached to the base. The base may be a plate with attached heat pipes or the base may be a vapor chamber. The base is connected to the top of the processor and power supply and has an s-bend to accommodate the differing heights of the processor and power supply. Heat from the higher heat generating processor may be transferred by the base and dissipated by the fins above the power supply.

Claims

1. A circuit board assembly, comprising:

a printed circuit board Including a substrate with wirings printed thereon;

a processor mounted to the printed circuit board, the processor having a first height;

a component mounted to the printed circuit board next to the processor, the component being a heat source, the component having a second height different from the first height; and

a plurality of heat pipes;

a heat sink including a base having a first side abutting said processor and said heat generating component, and a second side having at least one fin structure positioned thereupon, said first side defining a plurality of open channels with one of said plurality of heat pipes positioned within each of said plurality of open channels, said base further including an offset located between said processor and said heat generating component and an opening defined through said offset, said opening communicating between said first and second sides of said base so as to expose a portion of each of said heat pipes to said second side of said base.

2. A bi-level heat sink assembly comprising:

a processor having a first height,

a heat generating component arranged adjacent to said processor and having a second height that is different from said first height;

a plurality of heat pipes;

a heat sink including a base having a first side abutting said processor and said heat generating component, and a second side having at least one fin structure positioned thereupon, said first side defining a plurality of open channels with one of said plurality of heat pipes positioned within each of said plurality of open channels, said base further including an offset located between said processor and said heat generating component and an opening defined through said offset, said opening communicating between said first and second sides of said base so as to expose a portion of each of said heat pipes to said second side of said base.

3. The assembly of claim 2, wherein the at least one fin structure is attached to a second side of the base opposite the first side.

4. The assembly of claim 3, wherein:

the base has a lower condenser section and an upper condenser section, and

the at least one fin structure includes a first fin structure attached to the lower condenser section and a second fin structure attached to the upper condenser section.

5. The assembly of claim 3, wherein the at least one fin structure is a folded fin.

6. The assembly of claim 2, wherein heat pipes include at least one evaporator section proximate to one of the group consisting of the processor and the heat generating component, and said heat pipes include at least one condenser section proximate to the second side of the base.

7. The assembly of claim 6, wherein:

each of said heat pipes has an upper evaporator section and a lower evaporator section,

the lower evaporator section is located on top of the processor and the upper evaporator section is located on top of the heat generating component, and

the at least one condenser section includes an upper condenser section above the upper evaporator section, a lower condenser section above the lower evaporator section, and said offset located between the upper and lower evaporator sections.

8. The assembly of claim 2, wherein the heat generating component is a power supply.

9. A bi-level heat sink comprising:

a first base portion having a first side and a second side, said first side defining a plurality of open channels each receiving a portion of a heat pipe;

a second base portion having a first side and a second side, said first side of said second base defining a plurality of open channels corresponding to said plurality of open channels in said first base portion and each receiving a corresponding portion of said heat pipes

an offset located between said first base portion and said second base portion so that said first and second sides of said first base portion are lower than said first and second sides of said second base portion, said offset further defining an opening that exposes a portion of each of said heat pipes; and

at least one fin structure positioned upon said second sides of said first base portion and said second base portion.