Pattern release film between two laminated surfaces
First Claim
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1. A method of forming a laminate structure, said method comprising:
- providing a first organic substrate and a second organic substrate each having first and second substrate surfaces respectively, and wherein the surfaces are present in an opposed spaced apart relationship;
contacting at least one of the first or second substrate surfaces with an inorganic release material such that a portion of the first or second substrate surface is covered with the release material while the remainder of the first or second substrate surface is not covered with the release material;
bringing the first and second substrate surfaces of the first and second substrates into contact with each other; and
subjecting the substrates to conditions such that the portions of the first and second substrate surfaces not covered with release material become bonded to one another and a laminate structure is formed;
wherein the portion of the first or second substrate surface covered with the release material allows the first and second substrates to separate from each other such that an opening is formed therebetween that is substantially coincident with the portion covered with the release material, and wherein said release material is formed from a material selected from the group consisting of Al2O3, AlN, MgO, SiO2, Si3N4, NiO, TiN, ZrN, HfN, compounds thereof, and combination thereof.
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Abstract
A method of forming a laminate structure comprises providing a first substrate and a second substrate each having first and second substrate surfaces respectively, and wherein the surfaces are present in an opposed spaced apart relationship; contacting at least one of the first or second substrate surfaces with a release material such that a portion of the first or second substrate surface is covered with the release material while the remainder of the first or second substrate surface is not covered with the release material; bringing the first and second substrate surfaces of the first and second substrates into contact with each other; and subjecting the substrates to conditions such that the portions of the first and second substrate surfaces not covered with release material become bonded to one another and a laminate structure is formed. The portion of the first or second substrate surface covered with the release material allows the first and second substrates to separate from each other such that an opening is formed therebetween that is substantially coincident with the portion covered with the release material.
37 Citations
89 Claims
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1. A method of forming a laminate structure, said method comprising:
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providing a first organic substrate and a second organic substrate each having first and second substrate surfaces respectively, and wherein the surfaces are present in an opposed spaced apart relationship;
contacting at least one of the first or second substrate surfaces with an inorganic release material such that a portion of the first or second substrate surface is covered with the release material while the remainder of the first or second substrate surface is not covered with the release material;
bringing the first and second substrate surfaces of the first and second substrates into contact with each other; and
subjecting the substrates to conditions such that the portions of the first and second substrate surfaces not covered with release material become bonded to one another and a laminate structure is formed;
wherein the portion of the first or second substrate surface covered with the release material allows the first and second substrates to separate from each other such that an opening is formed therebetween that is substantially coincident with the portion covered with the release material, and wherein said release material is formed from a material selected from the group consisting of Al2O3, AlN, MgO, SiO2, Si3N4, NiO, TiN, ZrN, HfN, compounds thereof, and combination thereof. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of forming a laminate structure, said method comprising:
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providing a first substrate and a second substrate each having first and second substrate surfaces respectively, and wherein the surfaces are present in an opposed spaced apart relationship;
contacting at least one of the first or second substrate surfaces with a release material comprising at least one carbon nitride such that a portion of the first or second substrate surface is covered with the release material while the remainder of the first or second substrate surface is not covered with the release material;
bringing the first and second substrate surfaces of the first and second substrates into contact with each other; and
subjecting the substrates to conditions such that the portions of the first and second substrate surfaces not covered with release material become bonded to one another and a laminate structure is formed;
wherein the portion of the first or second substrate surface covered with the release material allows the first and second substrates to separate from each other such that an opening is formed therebetween that is substantially coincident with the portion covered with the release material. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A method of forming a laminate structure, said method comprising:
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providing a first substrate and a second substrate each having first and second substrate surfaces respectively, and wherein the surfaces are present in an opposed spaced apart relationship;
contacting at least one of the first or second substrate surfaces with a release material such that a portion of the first or second substrate surface is covered with the release material while the remainder of the first or second substrate surface is not covered with the release material;
bringing the first and second substrate surfaces of the first and second substrates into contact with each other; and
subjecting the substrates to conditions such that the portions of the first and second substrate surfaces not covered with release material become bonded to one another and a laminate structure is formed;
wherein the portion of the first or second substrate surface covered with the release material allows the first and second substrates to separate from each other such that an opening is formed therebetween that is substantially coincident with the portion covered with the release material;
wherein said release material is represented by the formula M—
O—
C—
H—
N wherein M is a metal selected from the group consisting of silicon, titanium, tantalum, germanium, boron, zirconium, aluminum, hafnium, and yttrium.- View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
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43. A method of forming a laminate structure, said method comprising:
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providing a first substrate and a second substrate each having first and second substrate surfaces respectively, and wherein the surfaces are present in an opposed spaced apart relationship;
contacting both of the first and second substrate surfaces with a release material such that a portion of the first or second substrate surface is covered with the release material while the remainder of the first or second substrate surface is not covered with the release material, wherein the thickness of the release material ranges from about 10 Å
to about 10,000 Å
;
bringing the first and second substrate surfaces of the first and second substrates into contact with each other; and
subjecting the substrates to conditions such that the portions of the fist and second substrate surfaces not covered with release material become bonded to one another and a laminate structure is formed;
wherein the portion of the first or second substrate surface covered with the release material allows the first and second substrates to separate from each other such that an opening is formed therebetween that is substantially coincident with the portion covered with the release material. - View Dependent Claims (44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57)
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58. A method of forming a laminate structure, said method comprising:
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providing a first substrate and a second substrate each having first and second substrate surfaces respectively, and wherein the surfaces are present in an opposed spaced apart relationship;
contacting at least one of the first or second substrate surfaces with a release material by depositing the release material onto the first or second substrate by a technique selected from the group consisting of evaporation, sputtering, chemical vapor deposition, and ion beam deposition, such that a portion of the first or second substrate surface is covered with the release material while the remainder of the first or second substrate surface is not covered with the release material;
bringing the first and second substrate surfaces of the first and second substrates into contact with each other; and
subjecting the substrates to conditions such that the portions of the first and second substrate surfaces not covered with release material become bonded to one another and a laminate structure is formed;
wherein the portion of the first or second substrate surface covered with the release material allows the first and second substrates to separate from each other such that an opening is formed therebetween that is substantially coincident with the portion covered with the release material. - View Dependent Claims (59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73)
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74. A method of forming a laminate structure, said method comprising:
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providing a first substrate and a second substrate each having first and second substrate surfaces respectively, and wherein the surfaces are present in an opposed spaced apart relationship;
contacting at least one of the first or second substrate surfaces with a release material such that a portion of the first or second substrate surface is covered with the release material while the remainder of the first or second substrate surface is not covered with the release material;
wherein the release material is formed by an electrochemical redox reaction;
bringing the first and second substrate surfaces of the first and second substrates into contact with each other; and
subjecting the substrates to conditions such that the portions of the first and second substrate surfaces not covered with release material become bonded to one another and a laminate structure is formed;
wherein the portion of the first or second substrate surface covered with the release material allows the first and second substrates to separate from each other such that an opening is formed therebetween that is substantially coincident with the portion covered with the release material. - View Dependent Claims (75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89)
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Specification
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Current AssigneeNorth Carolina State University (University of North Carolina System)
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Original AssigneeNorth Carolina State University (University of North Carolina System)
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InventorsUfer, Stefan, Cuomo, Jerome J.
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Primary Examiner(s)Mayes, Curtis
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Application NumberUS09/625,903Time in Patent Office1,161 DaysField of Search156/289, 156/290, 156/291, 156/308.4, 156/252, 156/257, 264/610US Class Current156/289CPC Class CodesB32B 2315/02 CeramicsB32B 2379/08 PolyimidesB32B 27/08 of synthetic resinB32B 27/281 comprising polyimidesB32B 37/0076 characterised in that the l...B32B 7/06 permitting easy separationY10T 156/1056 Perforating laminaY10T 156/1064 Partial cutting [e.g., groo...
