Method for mounting an electronic component

• US 6,627,483 B2
• Filed: 03/01/1999
• Issued: 09/30/2003
• Est. Priority Date: 12/04/1998
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Pedersen, David V., Ondricek, Douglas S.
• Primary Examiner(s): Whitehead, Jr., Carl
• Assistant Examiner(s): BEREZNY, NEMA O
• Application Number:
  US09/260,795
• Publication Number:
  US 20020025603A1
• Time in Patent Office: 1,674 Days
• Field of Search: 438/15, 438/106, 438/117, 257/678, D18/15, 101/32, 738/56, 738/59, 738/60, 439/632, 324/762
• US Class Current: 438/117
• CPC Class Codes: G01R 1/0408 Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808
• CPC Class Codes: G01R 1/0433 Sockets for IC's or transistors
• CPC Class Codes: G01R 1/0466 concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
• CPC Class Codes: G01R 31/01 Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station testing of cables continuously passing the testing apparatus G01R31/59; testing dielectric strength or breakdown voltage G01R31/12
• CPC Class Codes: G01R 31/2863 Contacting devices, e.g. sockets, burn-in boards or mounting fixtures in general G01R1/04
• CPC Class Codes: G01R 31/2867 Handlers or transport devices, e.g. loaders, carriers, trays
• CPC Class Codes: G01R 31/2893 Handling, conveying or loading, e.g. belts, boats, vacuum fingers G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H01L21/67
• CPC Class Codes: H01L 21/67294 using identification means, e.g. labels on substrates or labels on containers
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2224/73251 on different surfaces
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/32 Holders for supporting the complete device in operation, i.e. detachable fixtures H01L23/40 takes precedence
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H05K 2201/09472 : Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 3/325 : by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308

Abstract

A method for mounting an electronic component. In one example of this method, the electronic component is an integrated circuit which is placed against an element of a carrier, such as a frame of a carrier. The electronic component has a plurality of elongate, resilient, electrical contact elements which are mounted on a corresponding first electrical contact pads on the electronic component. The electronic component is secured to the carrier, aNd the carrier is pressed against a first substrate having a plurality of second electrical contacts on a surface of the first substrate. In a typical example of this method, the electronic component is an integrated circuit which is being tested while being held in a carrier. The integrated circuit has been singulated from a wafer containing a plurality of integrated circuits.

Claims

1. A method for mounting an electronic component, said method comprising the steps of:

placing said electronic component against a frame of a carrier having standoffs, said electronic component having a plurality of elongate, resilient, electrical contact elements mounted on corresponding first electrical contact pads on said electronic component, said plurality of elongate, resilient, electrical contact elements extending beyond an exterior surface of said carrier;

securing said electronic component to said carrier;

receiving said standoffs in positioning holes on a first substrate to position said carrier with respect to said first substrate to cause said electrical contact elements to wipe a plurality of second electrical contacts on a surface of said first substrate; and

pressing said carrier against said plurality of second electrical contact pad.

2. A method as in claim 1 wherein said electronic component is an integrated circuit (IC).

3. A method as in claim 2 wherein said method further comprises:

mounting said plurality of elongate, resilient, electrical contact elements on said IC before placing said IC against said frame.

4. A method as in claim 3 further comprising:

singulating a wafer comprising said IC after mounting said plurality of elongate, resilient, electrical contact elements to IC'"'"'s on said wafer.

5. A method as in claim 4 wherein each of said elongate, resilient, electrical contact elements is freestanding at least after just mounting said elongate, resilient, electrical contact elements to said IC.

6. A method as in claim 5 wherein said securing comprises placing a top on said carrier.

7. A method as in claim 5 wherein a dimension of said frame defines a maximum limit of compression for each of said elongate, resilient, electrical contact elements when said elongate, resilient, electrical contact elements are used to make electrical interconnections.

8. A method as in claim 7 wherein said elongate, resilient, electrical contact elements electrically interconnect said first electrical contact pads to corresponding ones of said second electrical contacts.

9. A method as in claim 7 wherein said first substrates is a testing circuit board for testing said IC.

10. A method as in claim 7 wherein said first substrate is a final package for using said IC.

11. A method as in claim 7 wherein said IC is placed against said frame without a package for said IC.

12. A method as in claim 6 wherein said top is substantially planar.

13. A method as in claim 6 wherein said top comprises an element which protrudes from a surface of said top and which is configured to press against a surface of said IC.

14. A method as in claim 7 wherein said elongate, resilient, electrical contact element is compressed less during testing of said IC than during use after testing.

15. A method as in claim 7 further comprising:

aligning automatically said carrier relative to said first substrate.

16. A method as in claim 15 wherein said carrier comprises a plurality of first elements and said first substrate comprises a plurality of second elements which are configured to uniquely mate with said plurality of first elements to automatically align said carrier relative to said first substrate.

17. A method as in claim 16 wherein said plurality of first elements protrude from said surface of said carrier, said surface facing said first substrate and wherein said plurality of second elements are receptors on said first substrate, said receptors for receiving said first elements.

18. A method as in claim 17 wherein said plurality of first elements protect said plurality of elongate, resilient, electrical contact elements when said carrier is not pressed against said first substrate.

19. A method as in claim 5 wherein said IC is secured in said carrier by:

securing a first side of said IC by a retainer which is coupled to said carrier; and

wherein said frame secures a second side of said IC, said second side opposing said first side, said plurality of elongate, resilient, electrical contact elements mounted on said second side of said IC.

20. A method as in claim 19 wherein said retainer mechanically abuts at least a portion of said first side of said IC and said frame mechanically abuts at least a portion of said second side of said IC.

21. A method as in claim 20 wherein said retainer comprises at least one opening.

22. A method as in claim 21 further comprising:

marking an indicia on said IC through said at least one opening in said retainer after said IC is secured in said carrier.

23. A method as in claim 22 wherein said indicia represents information relating to a result of testing said IC.

24. A method as in claim 23 wherein said testing comprises burn-in testing of said IC.

25. A method as in claim 5 further comprising:

transferring heat from said IC to a heat transfer media on said carrier.

26. A method as in claim 20 wherein said retainer comprises openings for transferring heat from said IC.

27. A method as in claim 20 wherein said retainer comprises a probe for measuring a temperature of said IC.

28. A method as in claim 20 wherein said carrier is mounted against said first substrate and then said IC is placed against said frame, and said IC is then secured to said carrier.

29. A method as in claim 20 wherein said IC is placed against said frame and then said IC is secured to said carrier and then said carrier is pressed against said first substrate.

30. A method as in claim 1, wherein each said positioning hole comprises a sloped wall.

31. A method for mounting an electronic component having elongate, resilient, electrical contact elements mounted on corresponding first electrical contact pads, the method comprising the steps of:

placing the electronic component against a frame of a carrier having standoffs so that the contact elements extend beyond an exterior surface of said carrier;

securing said electronic component to said carrier;

receiving said standoffs in positioning holes on a first substrate to position said carrier with respect to said first substrate;

wiping a plurality of second electrical contacts on a surface of said first substrate with said electrical contact elements based on said receiving step; and

pressing said carrier against said plurality of second electrical contact pads.

32. A method for mounting an electronic component having elongate, resilient, electrical contact elements mounted on corresponding first electrical contact pads, the method comprising the steps of:

securing the electronic component to a frame of a carrier so that the contact elements extend beyond an exterior surface of said carrier; and

positioning said carrier with respect to a first substrate by receiving standoffs on said carrier in positioning holes on said first substrate, said positioning holes causing said electrical contact elements to wipe a plurality of second electrical contacts on a surface of said first substrate.