Method of manufacturing semiconductor device

• US 6,627,560 B1
• Filed: 11/29/2002
• Issued: 09/30/2003
• Est. Priority Date: 05/30/2002
• Status: Expired due to Fees

• Current Assignee: LAPIS Semiconductor Co., Ltd. (ROHM Co., Ltd.)
• Original Assignee: OKI Electric Industry Company Limited
• Inventors: Miyano, Junichi, Toshikawa, Kiyohiko, Motoyama, Yoshikazu
• Primary Examiner(s): GHYKA, ALEXANDER G
• Application Number:
  US10/305,952
• Time in Patent Office: 305 Days
• Field of Search: 438/788, 438/778, 438/787, 438/795
• US Class Current: 438/788
• CPC Class Codes: C23C 16/401 containing silicon
• CPC Class Codes: C23C 16/482 using incoherent light, UV to IR, e.g. lamps
• CPC Class Codes: H01L 21/02126 the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
• CPC Class Codes: H01L 21/02216 the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
• CPC Class Codes: H01L 21/02277 the reactions being activated by other means than plasma or thermal, e.g. photo-CVD
• CPC Class Codes: H01L 21/2686 using incoherent radiation
• CPC Class Codes: H01L 21/3122 layers comprising polysiloxane compounds
• CPC Class Codes: H01L 21/31633 Deposition of carbon doped silicon oxide, e.g. SiOC
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method of manufacturing an interlayer insulating film that can form an insulating layer having excellent planarization property without using an etch-back process is offered. A method of manufacturing a semiconductor device having a step of forming an interlayer insulating film on an object comprises a step of supplying octa-methylcyclotetrasiloxane as a source gas into a vacuum processing chamber of a vacuum ultraviolet CVD apparatus in which an object on which an interlayer insulating film is to be formed is arranged; and a step of irradiating vacuum ultraviolet light from a vacuum ultraviolet light source arranged on an upper part of the vacuum processing chamber onto the object placed in the vacuum processing chamber to grow an interlayer insulating film.

Claims

1. A method of manufacturing a semiconductor device comprising;

a step of supplying octa-methylcyclotetrasiloxane into a vacuum processing chamber of a vacuum ultraviolet CVD apparatus in which an object on which an interlayer insulating film is to be formed is arranged; and

a step of irradiating vacuum ultraviolet light from a vacuum ultraviolet light source arranged on an upper part of the vacuum processing chamber onto the object placed in the vacuum processing chamber to grow the interlayer insulating film.

2. A method of manufacturing a semiconductor device according to claim 1, wherein the vacuum ultraviolet light source is arranged on a synthetic quartz window arranged on the upper part of the vacuum processing chamber through heating means.

3. A method of manufacturing a semiconductor device according to claim 2, further comprising a step of changing a shape of the heating means or a number of heating means depending on a processing state before the step of growing the interlayer insulating film.

4. A method of manufacturing a semiconductor device according to claim 2, further comprising a step of changing the shape of the heating means or the number of heating means depending on a processing state before the step of growing the interlayer insulating film.

5. A method of manufacturing a semiconductor device according to claim 2, wherein the heating means heats the synthetic quartz window to a temperature which is not lower than a threshold temperature of the octa-methylcyclotetrasiloxane.

6. A method of manufacturing a semiconductor device according to claim 2, wherein a heating temperature of the synthetic quartz window set by the heating means is 90°

C.

7. A method of manufacturing a semiconductor device according to claim 1, wherein a placing table on which the object is placed has a temperature regulating function.

8. A method of manufacturing a semiconductor device according to claim 7, wherein the temperature of the object is regulated within a range of room temperature to 350°

C. by the temperature regulating function.

9. A method of manufacturing a semiconductor device according to claim 1, wherein the interlayer insulating film in the vacuum ultraviolet CVD apparatus is formed such that the temperature of the object is not higher than 100°

C.

10. A method of manufacturing a semiconductor device comprising:

a step of supplying octa-methylcyclotetrasiloxane and an inert gas into a vacuum processing chamber of a vacuum ultraviolet CVD apparatus in which an object on which an interlayer insulating film is to be formed is arranged; and

a step of irradiating vacuum ultraviolet light from a vacuum ultraviolet light source arranged on an upper part of the vacuum processing chamber onto the object placed in the vacuum processing chamber to grow the interlayer insulating film.

11. A method of manufacturing a semiconductor device according to claim 10, wherein a total pressure in the vacuum processing chamber is regulated depending on a partial pressure of the octa-methylcyclotetrasiloxane.

12. A method of manufacturing a semiconductor device according to claim 10, wherein the vacuum ultraviolet light source is arranged on a synthetic quartz window arranged on an upper part of the vacuum processing chamber through heating means.

13. A method of manufacturing a semiconductor device according to claim 10, further comprising a step of changing a shape of the heating means or a number of heating means depending on a processing state before the step of growing the interlayer insulating film.

14. A method of manufacturing a semiconductor device according to claim 12, further comprising a step of changing the shape of the heating means or the number of heating means depending on the processing state before the step of growing the interlayer insulating film.

15. A method of manufacturing a semiconductor device according to claim 12, wherein the heating means heats the synthetic quartz window to a temperature which is not lower than a threshold temperature of the octa-methylcyclotetrasiloxane.

16. A method of manufacturing a semiconductor device according to claim 12, wherein a heating temperature of the synthetic quartz window set by the heating means is 90°

C.

17. A method of manufacturing a semiconductor device according to claim 10, wherein a placing table on which the object is placed has a temperature regulating function.

18. A method of manufacturing a semiconductor device according to claim 17, wherein the temperature of the object is regulated within the range of room temperature to 350°

C. by the temperature regulating function.

19. A method of manufacturing a semiconductor device according to claim 10, wherein the interlayer. insulating film in the vacuum ultraviolet CVD apparatus is formed such that the temperature of the object is not higher than 100°

C.