Method and apparatus for through-body optical component attachment using laser soldering

• US 6,627,847 B1
• Filed: 12/13/2001
• Issued: 09/30/2003
• Est. Priority Date: 06/28/2001
• Status: Expired due to Term

• Current Assignee: RPX Clearinghouse LLC (RPX Corporation)
• Original Assignee: Nortel Networks Limited (Nortel Networks Corporation)
• Inventors: Hu, Chaolin, Azimi, Masud, Tayebati, Parviz
• Primary Examiner(s): Dunn, Tom
• Assistant Examiner(s): JOHNSON, JONATHAN J
• Application Number:
  US10/021,975
• Time in Patent Office: 656 Days
• Field of Search: 219/121.85, 219/121.63, 219/121.64, 219/121.65, 219/121.66, 228/180.22, 228/180.21, 228/254, 228/122.1, 228/248.1
• US Class Current: 219/121.85
• CPC Class Codes: B23K 1/0056 soldering by means of beams, e.g. lasers, E.B.
• CPC Class Codes: B23K 2103/08 Non-ferrous metals or alloys
• CPC Class Codes: B23K 2103/14 Titanium or alloys thereof
• CPC Class Codes: B23K 2103/18 Dissimilar materials
• CPC Class Codes: B23K 2103/26 Alloys of Nickel and Cobalt and Chromium
• CPC Class Codes: B23K 2103/54 Glass
• CPC Class Codes: B23K 35/001 Interlayers, transition pieces for metallurgical bonding of workpieces
• CPC Class Codes: B23K 35/3013 Au as the principal constituent
• CPC Class Codes: C03C 27/08 with the aid of intervening metal
• CPC Class Codes: G02B 6/4238 Soldering

Abstract

According to an aspect of the present invention, a method for laser soldering optical components is described. In that method, a first selected material is disposed on the components to facilitate the deposition of solder. Subsequently, solder is disposed on that material and the component is aligned. A laser beam is properly focused on the solder such that the solder melts and, when the laser beam is turned off, hardens, thereby fixing the component in the desired position.

Claims

1. A method for laser soldering an optical component in a desired position, comprising the steps of:

disposing a first material on a portion of said optical component, said first material capable of bonding to said optical component and to a solder material;

disposing said solder material onto at least a portion of said first material;

positioning said optical component at the desired position;

illuminating through said optical component at least a portion of said solder material with a laser beam such that said solder material melts; and

stopping said illumination such that said solder material hardens, thereby fixing said optical component in said desired position.

2. The method for laser soldering an optical component, as described in claim 1, wherein said first material comprises one or more materials selected from a group consisting of molybdenum, titanium, nickel, niobium, rhenium, tungsten.

3. The method for laser soldering an optical component, as described in claim 1, wherein said solder material is comprised of approximately 80% gold and approximately 20% tin.

4. The method for laser soldering an optical component, as described in claim 1, wherein said optical component comprises a lens.

5. The method for laser soldering an optical component, as described in claim 1, wherein said illumination step comprises transmitting said laser beam through another optical component onto said solder material.

6. The method for laser soldering an optical component, as described in claim 5, wherein said another optical component is a lens.

7. The method for laser soldering an optical component, as described in claim 1, further comprising focusing said laser beam onto said solder material.

8. The method for laser soldering an optical component, as described in claim 1, comprising defocusing said laser beam to control the melting of said solder material.