Thin image sensor package

• US 6,627,864 B1
• Filed: 11/22/1999
• Issued: 09/30/2003
• Est. Priority Date: 11/22/1999
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P., Webster, Steven, Hollaway, Roy Dale
• Primary Examiner(s): Allen, Stephone
• Assistant Examiner(s): Spears, Eric J
• Application Number:
  US09/447,202
• Time in Patent Office: 1,408 Days
• Field of Search: 250/216, 250/208.1, 250/239, 250/214.1, 257/433, 257/460
• US Class Current: 250/208.1
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01032 Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]

Abstract

A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture.

Claims

1. A structure comprising:

an image sensor having a bond pad and an active area responsive to radiation;

a substrate transparent to said radiation;

an electrically conductive trace formed on said substrate, wherein said bond pad is electrically connected to said trace; and

a step up ring which surrounds said image sensor, a first surface of said step up ring being attached to said substrate.

2. The structure of claim 1 wherein said substrate comprises a material selected from the group consisting of glass, germanium and silicon.

3. The structure of claim 1 wherein said substrate includes one or more coatings on a first surface of said substrate.

4. The structure of claim 3 wherein said trace is formed on a second surface of said substrate opposite said first surface of said substrate.

5. The structure of claim 1 further comprising an electrically conductive bump which electrically connects said bond pad to said trace.

6. The structure of claim 1 further comprising a bead, said bead securing a periphery of said image sensor to said substrate.

7. The structure of claim 1 wherein a plurality of substrates are integrally connected together, said plurality of substrates including said substrate.

8. The structure of claim 1 further comprising:

an electrically conductive land on a second surface of said step up ring; and

an electrically conductive via extending from said first surface to said second surface of said step up ring, said via electrically connecting said trace to said land.

9. The structure of claim 8 wherein said via extends through said step up ring from said first surface to said second surface of said step up ring.

10. A structure comprising:

an image sensor having a bond pad and an active area responsive to radiation;

a substrate transparent to said radiation;

an electrically conductive trace formed on said substrate, wherein said bond pad is electrically connected to said trace;

a bead securing a periphery of said image sensor to said substrate, wherein said image sensor, said bead and said substrate define a cavity, said active area being located within said cavity.

11. The structure of claim 10 further comprising a first electrically conductive interconnection ball formed on said trace.

12. The structure of claim 11 further comprising a plurality of electrically conductive interconnection balls including said first interconnection ball, said plurality of electrically conductive interconnection balls being distributed in an array format, said structure being a ball grid array package.

13. The structure of claim 11 wherein said active region is formed on a first surface of said image sensor, said image sensor comprising a second surface opposite said first surface, said trace being formed on a first surface of said substrate, wherein said interconnection ball extends above said first surface of said substrate to a greater height than a height of said second surface of said image sensor above said first surface of said substrate.

14. The structure of claim 10 wherein said cavity contains a medium which is transparent to said radiation.

15. The structure of claim 14 wherein said medium is air.

16. The structure of claim 10 further comprising:

a step up ring which surrounds said image sensor, a first surface of said step up ring being attached to said substrate; and

an electrically conductive land on a second surface of said step up ring, wherein said trace is electrically connected to said land.

17. The structure of claim 16 further comprising an electrically conductive via extending from said first surface to said second surface of said step up ring, said via electrically connecting said trace to said land.

18. The structure of claim 16 further comprising an electrically conductive interconnection ball electrically connected to said land.

19. The structure of claim 16 wherein said step up ring has an outer side which extends between said first surface and said second surface of said step up ring, said trace being electrically connected to said land by an outer trace extending along said outer side of said step up ring.

20. A structure comprising:

an image sensor having a bond pad and an active area responsive to radiation;

a substrate transparent to said radiation;

an electrically conductive trace formed on said substrate;

an electrically conductive bump which electrically connects said bond pad to said trace; and

a flexible conductor electrically connected to said trace.