Minitab rectifying diode package with two different types of diodes for alternators

• US 6,627,975 B2
• Filed: 07/19/2001
• Issued: 09/30/2003
• Est. Priority Date: 03/12/2001
• Status: Expired due to Fees

• Current Assignee: ASBU Holdings, LLC
• Original Assignee: International Rectifier Corporation (Infineon Technologies AG)
• Inventors: Guerra, Alberto, Richard, Hugh
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): MANDALA, VICTOR A
• Application Number:
  US09/909,454
• Publication Number:
  US 20020127765A1
• Time in Patent Office: 803 Days
• Field of Search: 257/144, 257/152, 257/150, 257/175, 257/176, 257/177, 257/181, 257/203, 257/207, 257/208, 257/355, 257/481, 257/551, 257/603, 257/625, 257/658, 257/666, 257/675, 257/676, 257/678, 257/688, 257/690, 257/691, 257/692, 257/693, 257/698, 257/734, 257/737, 257/784, 257/787, 257/712, 257/713, 257/723, 257/724, 257/291
• US Class Current: 257/658
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/27013 for holding or confining the layer connector, e.g. solder flow barrier
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/83905 Combinations of bonding methods provided for in at least two different groups from H01L2224/838 - H01L2224/83904
• CPC Class Codes: H01L 2224/83951 Forming additional members, e.g. for reinforcing, fillet sealant
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/488 consisting of soldered or bonded constructions bump connectors H01L24/01
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 29/861 : Diodes
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12035 : Zener diode
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A diode for use in an under-the-hood automotive application has a TO 220 outline and consists of a diode die on a two piece lead frame which has a thick section to which the bottom of the die is soldered, and a thinner section which extends through a plastic housing as a connection tab and which has a forked end for easy connection to a node of a three phase bridge. The bottom of the thickened section is exposed through the insulation housing for easy connection to a d-c heat sink rail. The diode is particularly useful in applications greater than 2 KW.

Claims

1. A set of diodes comprising two diode types for application to alternators, each diode being configured for being connectable between an alternator a-c terminal and a d-c bus heat sink;

each said diode comprising;

a flat thin silicon diode die having first and second main diode electrodes on its opposite respective surfaces,

a lead frame having a relatively thick conductive section which receives said first one of said main diode electrodes and which supports said die, and a relatively thin conductive section which is laterally removed from and insulated from said relatively thick section and a wire bond connecting the second one of said main diode electrodes to said relatively thin conductive section, and

a plastic insulation housing enclosing said die and at least portions of said relatively thick and relatively thin lead frame sections and said wire bond;

said relatively thick lead frame section having a bottom which is exposed through said plastic housing for connection to said d-c bus heat sink;

said relatively thin conductive section defining a connection tab extending through said plastic housing and connectable to said a-c terminal;

in one of said two diode types, said first and second main diode electrodes being respectively an anode and a cathode of said diode; and

in the other one of said two diode types, said first and second main diode electrodes being respectively a cathode and an anode of said diode.

2. The device of claim 1, wherein each said diode has the outline of a TO 220 type device.

3. The device of claim 1, wherein the free end of each said relatively thin conductive lead frame section has a forked end for bolt connection.

4. The device of claim 2, wherein the free end of each said relatively thin conductive lead frame section has a forked end for bolt connection.

5. The device of claim 1, wherein each said thin conductive lead frame section is bent at an angle out of its plane in regions external to said plastic housing.

6. The device of claim 1, wherein each said diode is a zener diode.

7. A set of diodes comprising two diode types, each diode comprising a flat thin silicon diode die having first and second main diode electrodes on its opposite respective surfaces,

a lead frame having a relatively thick conductive section which receives said first one of said main diode electrodes and which supports said die, and a relatively thin conductive section which is laterally removed from and insulated from said relatively thick section and a wire bond connecting the second one of said main diode electrodes to said relatively thin conductive section, and

a plastic insulation housing enclosing said die and at least portions of said relatively thick and relatively thin lead frame sections and said wire bond;

said relatively thick lead frame section having a bottom which is exposed through said plastic housing for connection to a heat sink;

said relatively thin conductive section defining a connection tab extending through said plastic housing and connectable to an external terminal;

in one of said two diode types, said first and second main diode electrodes being respectively an anode and a cathode of said diode; and

in the other one of said two diode types, said first and second main diode electrodes being respectively a cathode and an anode of said diode.

8. The device of claim 7, wherein each said diode has the outline of a TO 220 type device.

9. The device of claim 7, wherein the free end of each said relatively thin conductive lead frame section has a forked end for bolt connection.

10. The device of claim 8, wherein the free end of each said relatively thin conductive lead frame section has a forked end for bolt connection.

11. The device of claim 7, wherein each said thin conductive lead frame section is bent at an angle out of its plane in regions external to said plastic housing.

12. The device of claim 10, wherein each said thin conductive lead frame section is bent at an angle out of its plane in regions external to said plastic housing.