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Fingerprint sensor package having enhanced electrostatic discharge protection and associated methods

  • US 6,628,812 B1
  • Filed: 05/09/2000
  • Issued: 09/30/2003
  • Est. Priority Date: 05/11/1999
  • Status: Expired due to Term
First Claim
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1. A fingerprint sensor package comprising:

  • a housing;

    a fingerprint sensing integrated circuit within said housing and comprising a plurality of electric field sensing electrodes and processing circuitry connected thereto, said processing circuitry comprising at least one power supply line for external connection;

    at least one external electrode carried by said housing for contact by a finger of a user;

    an electrostatic discharge circuit within said housing and connected to said at least one external electrode for protecting said fingerprint sensing integrated circuit; and

    a power supply isolation circuit within said housing and connected to the at least one power supply line for external connection for further protecting said fingerprint sensing integrated circuit;

    said power supply isolation circuit comprising a DC power modulator and a DC power demodulator magnetically coupled thereto.

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