Chip size image sensor bumped package fabrication method

• US 6,629,633 B1
• Filed: 11/13/2000
• Issued: 10/07/2003
• Est. Priority Date: 11/13/2000
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P., Webster, Steven, Liebhard, Markus K.
• Primary Examiner(s): Dunn, Tom
• Assistant Examiner(s): Tran, Len
• Application Number:
  US09/711,994
• Time in Patent Office: 1,058 Days
• Field of Search: 228/124.6, 228/180.22, 228/175, 228/248.1, 361/783, 361/820
• US Class Current: 228/180.22
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/1469 Assemblies, i.e. hybrid integration
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED

Abstract

To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. The image sensor further includes a plurality of bond pads on the upper surface. Interior traces on a lower surface of a step up ring are aligned with the bond pads on the upper surface of the image sensor. Bumps are formed between the interior traces and the bond pads thus flip chip mounting the step up ring to the image sensor. The step up ring is mounted such that the window is located in or adjacent a central aperture of the step up ring. An underfill material is applied into the central aperture. The underfill material flows from the central aperture between the lower surface of the step up ring and the upper surface of the image sensor. The underfill material encloses the bumps. The underfill material is cured, if necessary, to form a package body. The package body enhances the reliability of the image sensor package by preventing the failure of the bumps and preventing the associated dismounting of the step up ring.

Claims

1. A method comprising:

mounting a window above an active area on a first surface of a sensor device with a window support in contact with said window and said first surface, said sensor device comprising a bond pad on said first surface;

aligning a first trace on a first surface of a step up ring with said bond pad; and

forming a bump between said first trace and said bond pad to mount said step up ring to said sensor device.

2. The method of claim 1 wherein said forming a bump comprises:

forming a solder bump on said first trace or bond pad; and

reflowing said solder bump.

3. The method of claim 1 wherein said forming a bump comprises:

applying an electrically conductive epoxy paste or film to said first trace or bond pad; and

curing said electrically conductive epoxy paste or film.

4. The method of claim 1 wherein said forming a bump comprises:

forming a gold bump on said first trace or bond pad; and

thermal or thermosonic bonding said gold bump.

5. The method of claim 1 wherein said window support supports said window above said active area.

6. The method of claim 5 wherein said window support fills a region between said window and said active area.

7. The method of claim 5 wherein said window support is formed around said active area.

8. The method of claim 7 wherein said window support is an epoxy bead.

9. The method of claim 7 wherein said window support and said window are formed of a same material.

10. The method of claim 9 wherein said material is borosilicate glass.

11. The method of claim 1 wherein an image sensor substrate comprises a plurality of image sensors comprising said sensor device, said method further comprising singulating said image sensor substrate.

22. The method of claim 1 further comprising electrically connecting said first trace to a second trace on a second surface of said step up ring.

23. The method of claim 22 wherein a via extends from said first surface of said step up ring to said second surface of said step up ring and electrically connects said first trace to said second trace.

24. The method of claim 22 further comprising forming an interconnection ball on said second trace.

12. A method comprising:

mounting windows above active areas on first surfaces of image sensors;

aligning a sheet comprising step up rings with an image sensor substrate comprising said image sensors; and

mounting said sheet to said image sensor substrate by bumps, wherein said windows are located in or adjacent central apertures of said step up rings.

13. The method of claim 12 wherein bond pads are formed on said first surfaces of said image sensors, said aligning a sheet comprising aligning first traces on a first surface of said sheet with said bond pads.

14. The method of claim 13 wherein said bumps are between said bond pads and said first traces.

15. The method of claim 13 wherein said bond pads are formed in rows adjacent sides of said image sensors.

16. The method of claim 13 wherein said bond pads are distributed on said first surfaces of said image sensors.

17. The method of claim 12 further comprising applying an underfill material into a first central aperture of said central apertures.

18. The method of claim 17 wherein said underfill material flows from said first central aperture between said sheet and said image sensor substrate to a second central aperture of said central apertures.

19. The method of claim 18 wherein said underfill material displaces air between said sheet and said image sensor substrate.

20. The method of claim 12 further comprising singulating said image sensor substrate.

21. The method of claim 20 wherein said sheet is singulated during said singulation of said image sensor substrate.

25. A method comprising:

forming a window support to mount a window above an active area on a first surface of a sensor device, said window support contacting said window and contacting said first surface of said sensor device, said sensor device comprising a bond pad on said first surface;

coupling a first trace on a first surface of a step up ring to said bond pad to mount said step up ring to said sensor device; and

forming a package body, said package body filling a space between said first surface of said sensor device and said first surface of said step up ring.

26. The method of claim 25 wherein sides of said step up ring, sides of said package body and sides of said sensor device are coplanar.