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Insulator/metal bonding island for active-area silver epoxy bonding

  • US 6,630,735 B1
  • Filed: 04/07/2000
  • Issued: 10/07/2003
  • Est. Priority Date: 04/09/1999
  • Status: Expired due to Term
First Claim
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1. A semiconductor interconnection system, comprising:

  • a semiconductor die;

    first and second conductive contacts, said first conductive contact coupled to a surface of said semiconductor die, and said second conductive contact coupled to an external structure;

    a silver epoxy bond interposed between said first and second conductive contacts, said epoxy bond providing electrical and mechanical interconnection between said semiconductor die and said external structure;

    a plurality of silver migration regions in the first conductive contact extending from the silver epoxy bond toward the surface of said semiconductor die; and

    an insulating island interposed between said silver migration regions and the surface of said semiconductor die, wherein the first conductive contact is in contact with the surface of said semiconductor die in a region adjacent the insulating island.

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