Heat spreader with oscillating flow

• US 6,631,077 B2
• Filed: 02/11/2002
• Issued: 10/07/2003
• Est. Priority Date: 02/11/2002
• Status: Expired due to Term

• Current Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Original Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Inventors: Zuo, Jon
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US10/073,537
• Publication Number:
  US 20030151895A1
• Time in Patent Office: 603 Days
• Field of Search: 361/689, 361/690, 361/697, 361/698, 361/699, 361/700, 257/714, 257/715, 174/15.1, 174/15.2, 174/16.3, 165/80.4, 165/104.33
• US Class Current: 361/699
• CPC Class Codes: F28F 13/10 by imparting a pulsating motion to the flow, e.g. by sonic vibration
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat spreader includes a plate having a first and second ends and a plurality of channels between the ends. A reservoir is located at the first end. A fluid oscillator oscillates a fluid between the first and second ends with a reciprocating flow. The oscillator is integrally contained within the plate.

Claims

1. A heat spreader positioned within a housing containing an integrated circuit comprising:

a plate having a first and second ends and a plurality of channels therebetween, said plate being coupled to a top surface of said integrated circuit and;

a reservoir at the first end; and

a piezoelectric oscillator for oscillating a fluid between the first and second ends with a reciprocating flow, the oscillator being integrally contained within the plate.

2. The heat spreader of claim 1, wherein the channels are micro channels.

3. The heat spreader of claim 1, wherein the oscillator oscillates the working fluid with an adjustable pulse amplitude.

4. The heat spreader of claim 1, wherein the oscillator oscillates the working fluid with an adjustable pulse frequency.

5. The heat spreader of claim 1, wherein the oscillator oscillates the working fluid with an adjustable pulse amplitude and an adjustable pulse frequency.

6. The heat spreader of claim 1, wherein the fluid is a liquid.

7. The heat spreader of claim 1, wherein the fluid has a two-phase flow.

8. The heat spreader of claim 7, wherein the fluid includes liquid phase material and gas phase material.

9. The heat spreader of claim 1, wherein the oscillator is positioned at the second end of the plate.

10. The heat spreader of claim 1, wherein the plate is flat.

11. The heat spreader of claim 1, wherein the plurality of channels are parallel to each other.

12. The heat spreader of claim 1, wherein the plurality of channels are connected in a continuous serpentine pattern.

13. The heat spreader of claim 1, wherein the oscillator include a piezoelectric device.

14. The heat spreader of claim 1, wherein the oscillator include one of the group consisting of a micro actuator, a piezoelectric device, a micro mechanical pump, a diaphragm pump and a bubble pump.

15. The heat spreader of claim 1, wherein the plate is formed of silicon or ALSiC or CwW or other low CTE materials.

16. A heat spreader hermetically sealed within a housing containing an integrated circuit, said heat spreader comprising:

a plate having a first and second ends and a plurality of channels therebetween, said plate being coupled to a too surface of said integrated circuit within said an integrated circuit housing;

a reservoir at the first end; and

means for oscillating a fluid between the first and second ends with a reciprocating flow, the oscillating means being integrally contained within the plate.

18. The heat spreader of claim 16, wherein the oscillator oscillates the working fluid with at least one of the group consisting of an adjustable pulse frequency an adjustable pulse amplitude.

19. The heat spreader of claim 16, wherein the fluid has a two-phase flow.

20. The heat spreader of claim 16, wherein the plate is made of silicon or ALSiC or CwW or other low CTE materials.

17. Apparatus comprising:

a circuit board;

an integrated circuit hermetically sealed within a housing and connected to the circuit board; and

a heat spreader thermally coupled to the integrated circuit within said housing, comprising;

a plate having a first and second ends and a plurality of channels therebetween;

a reservoir at the first end; and

a piezoelectric oscillator for oscillating a fluid between the first and second ends with a reciprocating flow, the oscillator being integrally contained within the plate.

21. A thermally efficient semiconductor packaging structure comprising:

a hermetically sealed housing;

an integrated circuit located within said housing, said integrated circuit having a top surface; and

a heat spreader positioned within said housing and thermally and mechanically coupled to said top surface of said integrated circuit, said heat spreader comprising;

a plate having a first and second ends and a plurality of channels therebetween and;

a reservoir at the first end; and

a piezoelectric oscillator for oscillating a fluid between the first and second ends with a reciprocating flow, the oscillator being integrally contained within the plate.