Method of thin film deposition as an active conductor

• US 6,631,555 B1
• Filed: 02/08/2000
• Issued: 10/14/2003
• Est. Priority Date: 02/08/2000
• Status: Expired due to Term

• Current Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Original Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Inventors: Youker, Nick A., Anderson, Ronald L.
• Primary Examiner(s): Tugbang, A. Dexter
• Assistant Examiner(s): NGUYEN, DONGHAI D
• Application Number:
  US09/499,725
• Time in Patent Office: 1,344 Days
• Field of Search: 298/32, 298/31, 298/46, 298/30, 298/41, 298/48, 298/51, 298/52, 298/55, 298/56, 298/81, 361/818, 361/816, 361/118, 174/35.R, 174/35.GC
• US Class Current: 29/830
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49172 : by molding of insulating material

Abstract

A method includes populating components in a cavity of a substrate, disposing a polymer over the components and within the cavity. The polymer is cured and a thin film is formed on the polymer. In addition, a method includes forming an EMI shield within a medical device by depositing a thin film of metal on a surface within the medical device. The thin film of metal, of gold, aluminum, or copper, is formed by vapor deposition or sputtering.

Claims

1. A method comprising:

filling a substrate cavity with a dielectric material to cover one or more electronic components which are located within the substrate cavity, the dielectric material defining a surface over the one or more electronic components;

placing the electronic components within a medical device;

forming an EMI shield within the medical device, wherein forming the EMI shield comprises depositing a thin film of metal on the surface, and at least partially curing the dielectric material before depositing the thin film on the surface.

2. A method comprising:

filling a substrate cavity with a dielectric material to cover one or more electronic components which are located within the substrate cavity, the dielectric material defining a surface over the one or more electronic components;

placing the electronic components within a medical device;

forming an EMI shield within the medical device, wherein forming the EMI shield comprises depositing a thin film of metal on the surface; and

disposing the substrate within an outer shell, disposing an insulator within the outer shell, and depositing a second thin film metal on a surface of the insulator.

3. A method comprising:

filling a substrate cavity with a dielectric material to cover one or more electronic components which are located within the substrate cavity, the dielectric material defining a surface over the one or more electronic components;

placing the electronic components within a medical device;

forming an EMI shield within the medical device, wherein forming the EMI shield comprises depositing a thin film of metal on the surface; and

populating a second substrate with electronic components, and depositing the thin film metal between the first substrate and the second substrate.

4. A method comprising:

populating a first set of electronic components in a cavity of a substrate;

disposing a polymer over the first set of electronic components within the cavity;

at least partially curing the polymer to form an outer surface;

forming a thin film of metal on the outer surface of the polymer;

electrically coupling the thin film of metal with an electrical ground, such that the thin film of metal forms an EMI shield;

coupling the substrate with a second substrate having second set of electronic components disposed thereon such that the EMI shield is located between the first set of electronic components and the second set of electronic components; and

disposing the substrate within an outer shell.

5. The method of claim 4, wherein at least partially curing the polymer includes forming a non-planar outer surface.

6. The method of claim 4, wherein forming the thin film of metal comprises sputtering the thin film of metal.

7. The method of claim 4, further comprising disposing an insulator within the outer shell, and depositing a thin film of metal on a surface of the insulator.

8. A method comprising:

populating a first substrate with a first set including one or more electronic components;

populating a second substrate with a second set including one or more electronic components;

forming a surface over the first set;

depositing a thin film metal on the surface;

positioning the first and second substrates such that the surface is between the first set and the second set; and

disposing the first substrate and second substrate within an outer shell.

9. A method comprising:

populating a first substrate with a first set including one or more electronic components;

populating a second substrate with a second set including one or more electronic components;

forming a surface over the first set;

depositing a thin film metal on the surface;

positioning the first and second substrates such that the surface is between the first set and the second set; and

disposing the first substrate and second substrate within an outer shell,

wherein populating a first substrate includes placing the first set of one or more electronic components within a cavity on the first substrate.