Fluid flow sensor

• US 6,631,638 B2
• Filed: 01/30/2001
• Issued: 10/14/2003
• Est. Priority Date: 01/30/2001
• Status: Expired due to Term

• Current Assignee: Rosemount Aerospace, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Rosemount Aerospace, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Kunik, William G., James, Steven D.
• Primary Examiner(s): Lefkowitz, Edward
• Assistant Examiner(s): THOMPSON, JEWEL VERGIE
• Application Number:
  US09/772,677
• Publication Number:
  US 20020100316A1
• Time in Patent Office: 987 Days
• Field of Search: 732/042.6, 732/041.6, 732/04, 731/95, 732/041.1, 732/041.5, 732/041.7, 732/042.3, 731/89, 732/041.9, 732/042.7, 731/15, 73/250.3, 731/182, 364/557, 374/44
• US Class Current: 73/204.26
• CPC Class Codes: G01F 1/6845 Micromachined devices
• CPC Class Codes: G01P 13/02 Indicating direction only, e.g. by weather vane
• CPC Class Codes: G01P 5/12 using variation of resistance of a heated conductor

Abstract

A flow sensor for determining the velocity and direction of a fluid flow including a substrate, a heat source located on the substrate, and a first and a second heat sensor located on the substrate to detect at least a portion of heat generated by the heat source. The first and second heat sensors and the heat source are arranged in a non-linear orientation.

Claims

1. A flow sensor for determining the speed of a fluid flow comprising:

a die including a relatively thick substrate portion and a thin diaphragm portion;

a heat source located on said diaphragm portion of said die;

a first and a second heat sensor located on said diaphragm portion of said die to detect at least a portion of heat generated by said heat source, said first and second heat sensors and said heat source being arranged in a non-linear orientation; and

a pressure sensor located on said die for determining the pressure of said fluid flow.

2. The flow sensor of claim 1 further comprising a substrate temperature sensor located on said substrate portion for detecting the temperature of said substrate portion.

3. The flow sensor of claim 2 wherein said substrate temperature sensor includes material having a non-zero temperature coefficient of resistance having a generally serpentine shape.

4. The flow sensor of claim 1 wherein said die is primarily made of silicon, and wherein said heat source and said first and second heat sensors include material having non-zero temperature coefficient of resistance located on said die.

5. The flow sensor of claim 1 further comprising a processor coupled to said heat source and to said first and second heat sensors, wherein said processor can determine the amount of heat transmitted from said heat source to said first and second heat sensors to estimate the velocity of a fluid flow.

6. The flow sensor of claim 5 wherein said processor estimates the isotherms set up by said heat source in the presence of said fluid flow to estimate the velocity of said fluid flow.

7. The flow sensor of claim 1 further comprising a third and a fourth heat sensor located on said die, and wherein at least two of said heat sensors are aligned along a first axis and the other two of said heat sensors are aligned along a second axis.

8. The flow sensor of claim 7 wherein said first axis is generally perpendicular to said second axis.

9. The flow sensor of claim 7 wherein said heat source is located at the intersection of said first axis and said second axis.

10. The flow sensor of claim 7 further comprising fifth, sixth, seventh and eighth heat sensors located on said die to detect at least a portion of heat generated by said heat source.

11. The flow sensor of claim 1 further comprising an electrically insulating layer located between said die and said heat source and between said die and said heat sensors.

12. The flow sensor of claim 1 further comprising a plurality of conductive connecting pads, each connecting pad being electrically coupled to one of said heat source or said heat sensors.

13. The flow sensor of claim 12 wherein said die includes a first surface and a second surface opposite said first surface, said heat source and said heat sensors being located on said first surface, and wherein each connecting pad can be electrically coupled to a wire extending to said second surface.

14. The flow sensor of claim 13 wherein said die includes a plurality of access aperture, each access aperture extending from said second surface to one of said connecting pads.

15. The flow sensor of claim 14 wherein each access aperture includes a conductive material therein, said conductive material extending from said connecting pad to said second surface.

16. The flow sensor of claim 1 wherein said die includes a relatively thin fluid temperature sensor diaphragm portion, and wherein said flow sensor further includes a fluid temperature sensor located on said fluid temperature sensor diaphragm portion to detect the upstream temperature of said fluid which is substantially unheated by said heat source.

17. The flow sensor of claim 16 wherein said fluid temperature sensor includes material having non-zero temperature coefficient of resistance located onto said die and having a generally serpentine shape.

18. The flow sensor of claim 16 further comprising a layer of thermally conductive material located on said fluid temperature sensor improve the thermal conductivity of said fluid flow to said fluid temperature sensor.

19. The flow sensor of claim 1 wherein said die includes a relatively thin pressure sensor diaphragm portion, and wherein said pressure sensor is located on said pressure sensor diaphragm portion to detect the pressure of said fluid flow.

20. The flow sensor of claim 19 wherein said pressure sensor includes a pressure sensitive portion located on said pressure sensor diaphragm portion.

21. The flow sensor of claim 19 wherein said pressure sensitive portion includes a portion of piezoresistive material.

22. The flow sensor of claim 19 wherein said die includes a pressure cavity located below said pressure sensor diaphragm portion, and wherein said flow sensor further includes a plate located on a bottom surface of said die to seal said pressure cavity.

23. The flow sensor of claim 19 wherein said pressure sensor diaphragm portion is embossed.

24. The flow sensor of claim 19 further comprising a protective layer located on top of said heat source, said heat sensors and said pressure sensor, and wherein at least a portion of said protective layer is located on top of said pressure sensor is embossed.

25. The flow sensor of claim 1 further comprising a protective layer located on top of said heat source and heat sensors.

26. The flow sensor of claim 1 wherein said die is generally circular in top view.

27. The flow sensor of claim 1 wherein said flow sensor is a microsensor.

28. The flow sensor of claim 1 wherein each heat sensor is located on an upper surface of said die to detect at least a portion of heat generated by said heat source as carried by said fluid flow.

29. The flow sensor of claim 1 wherein said pressure sensor provides a variable output that is proportional to the pressure of the fluid flow.

30. A flow sensor for determining the speed of a fluid flow over said flow sensor comprising:

a die including a relatively thick substrate portion and a thin diaphragm portion;

a heat source located on said diaphragm portion of said die;

a first and a second heat sensor located on said diaphragm portion of said die to detect at least a portion of heat generated by said heat source, said first heat sensor and said heat source forming a first axis and said second heat sensor and said heat source forming a second axis, said first and said second axes being non-parallel; and

a pressure sensor located on said die for determining the pressure of said fluid flow.

31.The flow sensor of claim 30 wherein said first axis is generally perpendicular to said second axis.

31. The flow sensor of claim 30 wherein each heat sensor is located on an upper surface of said die to detect at least a portion of heat generated by said heat source as carried by said fluid flow.

32. The flow sensor of claim 30 wherein said pressure sensor provides a variable output that is proportional to the pressure of the fluid flow.

33. A flow sensor for determining the speed of a fluid flow over said flow sensor comprising:

a die;

a heat source located on said die, said heat source being connectable to a processor such that said processor can control the temperature of said heat source;

a heat sensor located on said die to detect at least a portion of heat generated by said heat source, said heat source being connectable to said processor to provide an output to said processor; and

a fluid temperature sensor located on said die for determining the upstream temperature of fluid which is substantially unheated by said heat source flowing over said die, said fluid temperature sensor being connectable to said processor to provide an output to said processor such that said processor can determine the speed of said fluid flow.

34. The flow sensor of claim 34 further comprising a pressure sensor located on said die for determining the pressure of said fluid flow.

35. The flow sensor of claim 34 further comprising a die temperature sensor located on said die for detecting the temperature of said die.

36. A flow sensor for determining the speed of a fluid flow over said flow sensor comprising:

a die;

a heat source located on said die, said heat source being connectable to a processor such that said processor can control the temperature of said heat source;

a heat sensor located on said die to detect at least a portion of heat generated by said heat source, said heat sensor being connectable to said processor to provide an output to said processor;

a pressure sensor located on said die for determining the pressure of said fluid flow; and

a die temperature sensor located on said die for determining the temperature of said die;

said die temperature sensor being connectable to said processor to provide an output to said processor such that said processor can determine the speed of said fluid flow.

37. The flow sensor of claim 37 further comprising a fluid temperature sensor located on said die for detecting the temperature of said fluid.

38. The flow sensor of claim 37 wherein said pressure sensor includes a pressure sensor diaphragm and a piezoelectric element located on said pressure sensor diaphragm such that said piezoelectric element can measure deflection of said pressure sensor diaphragm.

40. The flow sensor of claim 37 further comprising an auxiliary heat sensor located on said die to detect at lest a portion of heat generated by said heat source, said auxiliary heat sensor being connectable to said processor to provide an output to said processor.

39. The flow sensor of claim 39 wherein said piezoelectric element has a thickness of less than about a thickness of said pressure sensor diaphragm.

41. A flow sensor for determining the speed of a fluid flow comprising:

a die;

a processor; and

a first, second and third heat sensor located on said die, said first, second and third heat sensors being arranged in a non-linear orientation and coupled to said processor such that said processor can monitor and directly control the temperature of said first, second and third heat sensors by maintaining said first, second and third heat sensors at a generally constant temperature for a predetermined period of time and thereby determine the speed of said fluid flow.

42. The flow sensor of claim 42 wherein said first, second heat and third sensors are resistors, and wherein said processor monitors the power required to maintain said heat sensors at said generally constant temperature, and processes the required power for each heat sensor to determine the velocity of flow over the flow sensor.

43. The flow sensor of claim 42 wherein said die includes a relatively thick substrate portion and a relatively thin diaphragm portion, and wherein said heat sensors are located on said diaphragm portion to thermally isolate said heat sensors from said substrate.

44. The flow sensor of claim 42 further comprising a die temperature sensor located on said die for detecting the temperature of said die, a pressure sensor located on said die for determining the pressure of said fluid flow, and a fluid temperature sensor located on said die for detecting a temperature of said fluid.

45. A method for determining the speed of a fluid flow comprising the steps of:

providing a flow sensor comprising a die and a first and a second heat sensor located on said die;

providing a processor;

coupling said first and second heat sensors to said die such that an output of said first and second heat sensors is provided to said processor;

causing a fluid to flow over said flow sensor;

using said processor to maintain said first and second heat sensors at a generally constant temperature for a predetermined period of time as said fluid flows over said sensor; and

monitoring said first and second heat sensors as said fluid flows over said sensor to determine said fluid speed.

46. The method of claim 46 wherein said monitoring step includes maintaining said first and second heat sensors at a constant temperature.

47. A method for determining the speed of a fluid flow comprising the steps of:

providing a flow sensor comprising a die, a heat source located on a diaphragm portion of said die, a first and a second heat sensor located on said diaphragm portion of said die, said first and second heat sensors and said heat source being located in a non-linear orientation, and a pressure sensor located on said die for determining the pressure of said fluid flow;

providing a processor;

coupling said heat source and said first and second heat sensors to said processor such that an output of said first and second heat sensors is provided to said processor;

causing a fluid to flow over said flow sensor;

causing said processor to control the heat output by said heat source and monitor said first and second heat sensors to determine said fluid speed; and

monitoring the pressure measured by said pressure sensor to determine said fluid speed.

48. A flow sensor comprising:

a die;

a speed sensor located on said die, said speed sensor being connectable to a processor to provide an output such that said processor can determine the speed of said fluid flow;

a pressure sensor located on said die, said pressure sensor being connectable to a processor to provide an output such that said processor can determine the pressure of said fluid flow; and

a fluid temperature sensor located on said die, said fluid temperature sensor being connectable to said processor to provide an output such that said processor can determine the upstream temperature of said fluid which is substantially unheated by said heat source.

49. The flow sensor of claim 49 wherein said die includes a relatively thin pressure sensor diaphragm portion, and wherein said pressure sensor includes a portion of piezoresistive material located on said pressure sensor diaphragm portion to detect the pressure of said fluid flow.

50. The sensor of claim 50 wherein said speed sensor and said fluid temperature sensor each include a resistor.

51. The sensor of claim 51 wherein said resistor of said speed sensor and said fluid temperature sensor each include material having a non-zero temperature coefficient of resistance formed in a generally serpentine shape.

52. The flow sensor of claim 52 further comprising a processor coupled to said speed sensor, said fluid temperature sensor and said pressure sensor to determine the speed, temperature, and pressure of said fluid.

53. The flow sensor of claim 53 wherein said processor maintains said resistor of said speed sensor at a constant temperature for at least part of the time, and said processor can monitor the power required to maintain the resistor at said constant temperature to calculate the speed of said fluid flow.

54. A flow sensor for determining the speed of a fluid flow comprising:

a die;

a heat source located on said die;

a first and a second heat sensor located on said die to detect at least a portion of heat generated by said heat source, said first and second heat sensors and said heat source being arranged in a non-linear orientation; and

a protective layer located on top of said heat source and said heat sensors.

55. A flow sensor for determining the speed of a fluid flow comprising:

a die including a relatively thick substrate portion and a relatively thin diaphragm portion;

a heat source located on said diaphragm portion of said die;

a first and a second heat sensor located on said diaphragm portion of said die to detect at least a portion of heat generated by said heat source, said first and second heat sensors and said heat source being arranged in a non-linear orientation, wherein each heat sensor is located on an upper surface of said die to detect at least a portion of heat generated by said heat source as carried by said fluid flow; and

a pressure sensor located on said die for determining the pressure of said fluid flow.

56. A flow sensor for determining the speed of a fluid flow over said flow sensor comprising:

a die;

a heat source located on said die, said heat source being connectable to a processor such that said processor can control the temperature of said heat source;

a heat sensor located on said die to detect at least a portion of heat generated by said heat source, said heat sensor being connectable to said processor to provide an output to said processor;

a pressure sensor located on said die for determining the pressure of said fluid flow, said pressure sensor including a pressure sensor diaphragm and a piezoelectric element located on said pressure sensor diaphragm such that said piezoelectric element can measure deflection of said pressure sensor diaphragm; and

a die temperature sensor located on said die for determining the temperature of said die, said die temperature sensor being connectable to said processor to provide an output to said processor such that said processor can determine the speed of said fluid flow.