Method of manufacturing semiconductor device

• US 6,632,738 B2
• Filed: 06/06/2001
• Issued: 10/14/2003
• Est. Priority Date: 06/07/2000
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: NEC Electronics Corporation (Renesas Electronics Corporation)
• Inventors: Sone, Shuji
• Primary Examiner(s): Meier, Stephen D.
• Assistant Examiner(s): VOCKRODT, JEFF B
• Application Number:
  US09/876,207
• Publication Number:
  US 20010053592A1
• Time in Patent Office: 860 Days
• Field of Search: 438/627, 438/643, 438/648, 438/659, 438/685, 438/681
• US Class Current: 438/659
• CPC Class Codes: H01L 21/76807 for dual damascene structures
• CPC Class Codes: H01L 21/76843 formed in openings in a dielectric
• CPC Class Codes: H01L 21/76859 by ion implantation
• CPC Class Codes: H01L 21/76877 Filling of holes, grooves or trenches, e.g. vias, with conductive material
• CPC Class Codes: H01L 2221/1036 Dual damascene with different via-level and trench-level dielectrics
• CPC Class Codes: H01L 23/53238 Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An interlayer insulating film and a first via connected to a diffusion layer in a MOS transistor are formed on the diffusion layer. Then, a low dielectric constant film for a first layer copper interconnection, and the first layer copper interconnection connected to the first via are formed. Then, an etching stopper film, an interlayer insulating film, and a low dielectric constant film for a second layer copper interconnection are formed in this order. Then, a via hole is formed in the etching stopper film and the interlayer insulating film, and a groove is formed in the low dielectric constant film for the second layer copper interconnection. A barrier metal layer is then formed. Thereafter, Ar ions are implanted. At the time, the implantation energy is 50 keV, and the dose is 1×10¹⁷ cm⁻². A second via and the second layer copper interconnection are formed, and annealing is performed at a temperature of 400° C.

Claims

1. A method of manufacturing a semiconductor device, wherein a multi-layer Interconnection structure is formed by a damascene method, comprising the steps in sequence of:

forming a first interconnection layer including a first interconnection;

forming an interlayer insulating film on said first interconnection layer;

forming a low dielectric constant film on said interlayer insulating film;

forming a groove for an interconnection in said low dielectric constant film;

forming a via hole between said first interconnection and said groove in said interlayer insulating film;

turning at least a surface layer of said first interconnection amorphous by implanting ions into the bottom of said via hole;

filling said via hole with a conductive material, thereby forming a via;

while said at least a surface layer of said first interconnection is still in an amorphous state, filling said groove with a conductive material, thereby forming a second interconnection layer including a second interconnection in connection with said via; and

performing annealing after forming said second interconnection layer.

2. The method according to claim 1, further comprising the step of:

forming a barrier metal layer on said via hole, said groove and said low dielectric constant film after forming said groove and said via hole.

3. The method according to claim 1, further comprising the step of:

forming an etching stopper film on said first interconnection layer after forming said first interconnection layer and before forming an interlayer insulating film.

4. A method of manufacturing a semiconductor device, wherein a multi-layer interconnection structure is formed by a damascene method, comprising the steps of:

forming a first interconnection layer including a first interconnection;

forming an interlayer insulating film on said first interconnection layer;

forming a low dielectric constant film on said interlayer insulating film;

forming a groove for an interconnection in said low dielectric constant film;

forming a via hole between said first interconnection and said groove in said interlayer insulating film;

implanting ions into the bottom of said via hole, thereby turning at least a surface layer of said first interconnection amorphous;

filling said via hole with a conductive material, thereby forming a via; and

filling said groove with a conductive material, thereby forming a second interconnection layer including a second interconnection in connection with said via; and

further comprising the step of forming a barrier metal layer on said via hole, said groove and said low dielectric constant film after forming said groove and said via hole;

wherein said barrier metal layer is formed before said first interconnection is turned amorphous by said ion implantation.

5. A method of manufacturing a semiconductor device, wherein a multi-layer interconnection structure is formed by a damascene method, comprising the steps in sequence of:

forming a first interconnection layer including a first interconnection;

forming an interlayer insulating film on said first interconnection layer;

forming a via hole in alignment with said first interconnection in said interlayer insulating film;

turning at least a surface layer of said first interconnection amorphous by implanting ions into the bottom of said via hole;

filling said via hole with a conductive material, thereby forming a via;

while said at least a surface layer of said first interconnection is still in an amorphous state, forming a second interconnection layer including a second interconnection in connection with said via on said interlayer insulating film; and

performing said second interconnection layer.

6. The method according to claim 5, further comprising the step of forming a barrier metal layer on said via hole and said interlayer insulating film after forming said via hole.

7. A method of manufacturing a semiconductor device, wherein a multi-layer interconnection structure is formed by a damascene method, comprising the steps in sequence of:

forming a first interconnection layer including a first interconnection;

forming an interlayer insulating film on said first interconnection layer;

forming a low dielectric constant film on said interlayer insulating film;

forming a groove for an interconnection in said low dielectric constant film;

forming a via hole between said first interconnection and said groove in said interlayer insulating film;

implanting ions into the bottom of said via hole, thereby turning at least a surface layer of said first interconnection amorphous;

filling said via hole with a conductive material, thereby forming a via; and

filling said groove with a conductive material, thereby forming a second interconnection layer including a second interconnection in connection with said via; and

further comprising the step of forming a barrier metal layer on said via hole and said interlayer insulating film after forming said via hole;

wherein said barrier metal layer is formed before said first interconnection is turned amorphous by said ion implantation.

8. A method of manufacturing a semiconductor device, wherein a multi-layer interconnection structure is formed by a damascene method, comprising the steps of:

forming a first interconnection layer including a first interconnection;

forming an interlayer insulating film on said first interconnection layer;

forming a low dielectric constant film on said interlayer insulating film;

forming a groove for an interconnection in said low dielectric constant film;

forming a via hole between said first interconnection and said groove in said interlayer insulating film;

forming a barrier metal layer on said via hole, said groove and said low dielectric constant film after forming said groove and said via hole;

turning at least a surface layer of said first interconnection amorphous by implanting ions into the bottom of said via hole;

filling said via hole with a conductive material, thereby forming a via;

while said at least a surface layer of said first interconnection is still in an amorphous state, filling said groove with a conductive material, thereby forming a second interconnection layer including a second interconnection in connection with said via; and

performing annealing after forming said second interconnection layer.

9. The method according to claim 8, wherein said barrier metal layer is formed before said first interconnection is turned amorphous by said ion implantation.

10. The method according to claim 8, wherein the ions used for said ion implantation are ions of at least one element selected from the group consisting of H, N, C, Ar, Ne, Xe, and Kr.

11. The method according to claim 8, further comprising the step of:

forming an etching stopper film on said first interconnection layer after forming said first interconnection layer and before forming an interlayer insulating film.

12.A method of manufacturing a semiconductor device, wherein a multi-layer Interconnection structure is formed by a damascene method, comprising the steps of;

forming a first interconnection layer including a first interconnection;

forming an interlayer insulating film on said first interconnection layer;

forming an etching stopper film on said first interconnection layer on said first interconnection layer;

forming a low dielectric constant film on said etching stopper film;

forming a groove for an interconnection in said low dielectric constant film;

forming a via hole between said first interconnection and said groove in said interlayer insulating film;

turning at least a surface layer of said first interconnection amorphous by implanting ions into the bottom of said via hole;

filling said via hole with a conductive material, thereby forming a via;

while said at least a surface layer of said first interconnection is still in an amorphous state, filling said groove with a conductive material, thereby forming a second interconnection layer including a second interconnection in connection with said via; and

performing annealing after forming said second interconnection layer.

12. The method according to claim 12, further comprising the step of:

forming a barrier metal layer on said via hole, said groove and said low dielectric constant film after forming said groove and said via hole.

13. The method according to claim 12, wherein the ions used for said ion implantation are ions of at least one element selected from the group consisting of H, N, C, Ar, Ne, Xe, and Kr.

14. A method of manufacturing a semiconductor device, wherein a multi-layer interconnection structure is formed by a damascene method, comprising the steps of:

forming a first interconnection layer including a first interconnection;

forming an interlayer insulating film on said first interconnection layer;

forming an etching stopper film on said first interconnection layer on said first interconnection layer;

forming a low dielectric constant film on said etching stopper film;

forming a groove for an interconnection in said low dielectric constant film;

forming a via hole between said first interconnection and said groove in said interlayer insulating film;

turning at least a surface layer of said first interconnection amorphous by implanting ions into the bottom of said via hole;

filling said via hole with a conductive material, thereby forming a via; and

filling said groove with a conductive material, thereby forming a second interconnection layer including a second interconnection in connection with said via; and

further comprising the step of forming a barrier metal layer on said via hole, said groove and said low dielectric constant film after forming said groove and said via hole;

wherein said barrier metal layer is formed before said first interconnection is turned amorphous by said ion implantation.