Contact/noncontact type data carrier module

• US 6,634,564 B2
• Filed: 10/23/2001
• Issued: 10/21/2003
• Est. Priority Date: 10/24/2000
• Status: Active Grant

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: Kuramochi, Satoru
• Primary Examiner(s): Frech, Karl D.
• Assistant Examiner(s): Labaze, Edwyn
• Application Number:
  US09/983,223
• Publication Number:
  US 20020162894A1
• Time in Patent Office: 728 Days
• Field of Search: 235/441, 235/449, 235/486, 235/487, 235/492, 235/493, 343/700, 343/866, 343/873, 343/895, 340/539, 399/12, 399/13
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: G06K 7/10178 including auxiliary means for focusing, repeating or boosting the electromagnetic interrogation field comparable booster antennas integrated on the record carrier itself G06K19/07794
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

A contact/noncontact data carrier module applicable to a wide variety of purposes, and capable of satisfactorily meeting conditions on security. The contact/noncontact data carrier module includes a base member; a semiconductor chip mounted on the base member; a coil connected to the semiconductor chip adapted to be electromagnetically coupled with an external booster antenna for noncontact communication; and contact terminals connected to the semiconductor chip for contact with external contacts.

Claims

1. A contact/noncontact data carrier module comprising:

a base member;

a semiconductor chip mounted on the base member, said semiconductor chip comprising a terminal surface with terminals thereon;

a coil connected to the semiconductor chip adapted to be electromagnetically coupled with an external booster antenna for noncontact communication; and

a contact terminal connected to the semiconductor chip and adapted to be brought into contact with an external contact, wherein

the semiconductor chip is located on a first major surface of the base member such that said terminal surface provided with terminals faces away from said first major surface;

the contact terminal is located on a second major surface on a side opposite the first major surface of the base member;

the semiconductor chip and the contact terminals are connected through a hole located in the base member by a contact terminal connecting part; and

the contact terminal connecting part comprising a bonding wire connecting a terminal of the semiconductor chip and the contact terminal.

2. The contact/noncontact data carrier module according to claim 1, wherein the coil is located on the terminal surface of the semiconductor chip;

and the coil and the semiconductor chip are connected by a coil connecting part.

3. The contact/noncontact data carrier module according to claim 2, wherein the coil connecting part comprises a bonding wire connecting a terminal of the semiconductor chip and a terminal of the coil.

4. The contact/noncontact data carrier module according to claim 1, wherein the coil is located on the first major surface of the base member;

and the semiconductor chip and the coil are connected by a coil connecting part.

5. The contact/noncontact data carrier module according to claim 4, wherein the coil connecting part comprises a bonding wire connecting a terminal of the semiconductor chip and a terminal of the coil.

6. The contact/noncontact data carrier module according to claim 4, wherein the coil is located near the semiconductor chip on the first major surface of the base member.

7. The contact/noncontact data carrier module according to claim 1, further comprising a sealing resin layer sealing the semiconductor chip, the coil and the wiring part therein.

8. The contact/noncontact data carrier module according to claim 1, is a SIM in combination with a booster card.

9. The contact/noncontact data carrier module according to claim 1, is a SIM in combination with a portable telephone.

10. The contact/noncontact data carrier module according to claim 1, wherein the semiconductor chip comprises a user authentication circuit for authenticating a user, and a noncontact communication circuit for downloading information from the Internet.

11. A contact/noncontact data carrier module comprising:

a base member;

a semiconductor chip mounted on the base member, said semiconductor chip comprising a terminal surface with terminals thereon;

a coil connected to the semiconductor chip and adapted to be electromagnetically coupled with an external booster antenna for noncontact communication; and

a contact terminal connected to the semiconductor chip and adapted to contact with an external contact, wherein

the semiconductor chip is located on a first major surface of the base member such that said terminal surface provided with terminals faces the base member;

the contact terminal is located on a second major surface on an opposite side of the first major surface of the base member; and

the semiconductor chip and the contact terminals are connected through a hole located in the base member by a contact terminal connecting part.

12. The contact/noncontact data carrier module according to claim 11, wherein the contact terminal connecting part comprises a connecting wiring part located on the first major surface of the base member, and a via part located in the hole and connecting the connecting wiring part and the contact terminal;

and a terminal of the semiconductor chip is connected to the connecting wiring part by flip-chip solder bonding.

13. The contact/noncontact data carrier module according to claim 11, wherein the coil is located on the terminal surface of the semiconductor chip;

and the coil and the semiconductor chip are connected by a coil connecting part.

14. The contact/noncontact data carrier module according to claim 13, wherein the coil is located on an insulting layer covering a wiring layer located on the terminal surface of the semiconductor chip;

the wiring layer is connected to a terminal of the semiconductor chip; and

the coil connecting part comprises the wiring layer, and a via part located in the insulating layer and connecting the wiring layer and the terminal of the coil.

15. The contact/noncontact data carrier module according to claim 11, wherein the coil is located on the first major surface of the base member;

and the semiconductor chip and the coil are connected by a coil connecting part through a pair of coil connecting holes located in the base member.

16. The contact/noncontact data carrier module according to claim 15, wherein the coil connecting part comprises a connecting wiring part located on the second major surface of the base member, a connecting terminal located on the first major surface of the base member, and a pair of via parts respectively located in the pair of coil connecting holes of the base member and respectively connecting one terminal of the coil and the connecting wiring part, and the connecting wiring part and the connecting terminal;

and terminals of the semiconductor chip are connected to the connecting terminal, connected to one terminal of the coil, and the other terminal of the coil by flip-chip solder bonding.

17. The contact/noncontact data carrier module according to claim 11, further comprising a sealing resin layer sealing the semiconductor ship, the coil and the wiring part therein.

18. The contact/noncontact data carrier module according to claim 11, wherein the data carrier module is a SIM in combination with a booster card.

19. The contact/noncontact data carrier module according to claim 11, wherein the data carrier module is a SIM in combination with a portable telephone.

20. The contact/noncontact data carrier module according to claim 11, wherein the semiconductor ship comprises a user authentication circuit for authenticating a user, and a noncontact type communication circuit for downloading information from the Internet.

21. A contact/noncontact data carrier module comprising:

a base member;

a semiconductor chip mounted on the base member, said semiconductor chip comprising a terminal surface with terminals thereon;

a coil connected to the semiconductor chip adapted to be electromagnetically coupled with an external booster antenna for noncontact communication; and

a contact terminal connected to the semiconductor chip and adapted to be brought into contact with an external contact, wherein

the semiconductor chip is located on a first major surface of the base member such that said terminal surface provided with terminals faces away from said first major surface;

the contact terminal is located on a second major surface on a side opposite the first major surface of the base member;

the semiconductor chip and the contact terminals are connected through a hole located in the base member by a contact terminal connecting part; and

the contact terminal connecting part comprises a connecting wiring part located on the first major surface of the base member, a bonding wire connecting a terminal of the semiconductor chip and the connecting wiring part, and a via part formed in the hole of the base member and connecting the connecting wiring part and the contact terminal.

22. The contact/noncontact data carrier module according to claim 21, wherein the coil is located on the terminal surface of the semiconductor ship;

and the coil and the semiconductor ship are connected by a coil connecting part.

23. The contact/noncontact data carrier module according to claim 22, wherein the coil connecting part comprises a bonding wire connecting a terminal of the semiconductor ship and a terminal of the coil.

24. The contact/noncontact data carrier module according to claim 21, wherein the coil is located on the first major surface of the base member;

and the semiconductor ship and the coil are connected by a coil connecting part.

25. The contact/noncontact data carrier module according to claim 24, wherein the coil connecting part comprises a bonding wire connecting a terminal of the semiconductor ship and a terminal of the coil.

26. The contact/noncontact data carrier module according to claim 24, wherein the coil is located near the semiconductor ship on the first major surface of the base member.

27. The contact/noncontact data carrier module according to claim 24, wherein the coil is located on the terminal surface of the semiconductor ship;

and the coil and the semiconductor ship are connected by a coil connecting part.

28. The contact/noncontact data carrier module according to claim 27, wherein the coil is located on an insulating layer covering a wiring layer formed on the terminal surface of the semiconductor chip;

the wiring layer is connected to a terminal of the semiconductor ship; and

the coil connecting part comprises the wiring layer, and a via part located in the insulating layer and connecting the wiring layer and the terminal of the coil.

29. The contact/noncontact data carrier module according to claim 21, further comprising a sealing resin layer sealing the semiconductor ship, the coil and the wiring part therein.

30. The contact/noncontact data carrier module according to claim 21 is a SIM in combination with a booster card.

31. The contact/noncontact data carrier module according to claim 21 is a SIM in combination with a portable telephone.

32. The contact/noncontact data carrier module according to claim 21, wherein the semiconductor ship comprises a user authentication circuit for authenticating the user, and a noncontact type communication circuit for downloading information from the Internet.

33. A contact/noncontact data carrier module comprising:

a base member;

a semiconductor ship mounted on the base member, said chip comprising a terminal surface with terminals thereon;

a coil connected to the semiconductor ship adapted to be electromagnetically coupled with an external booster antenna for noncontact communication; and

a contact terminal connected to the semiconductor ship and adapted to be brought into contact with an external contact,

wherein the semiconductor ship is located on a first major surface of the base member such that said terminal surface provided with terminals faces the base member;

the contact terminal is located on a second major surface on a side opposite the first major surface of the base member;

the semiconductor ship and the contact terminals are connected through a hole located in the base member by a contact terminal connected part; and

the contact terminal connecting part comprises a connecting wiring part formed on the first major surface of the base member, and a via part located in the hole and connecting the connecting wiring part and the contact terminal; and

a terminal of the semiconductor chip is connected to the connecting wiring part by flip-chip solder bonding.

34. The contact/noncontact data carrier module according to claim 33, wherein the coil is located on the first major surface of the base member;

and the semiconductor chip and the coil are connected by a coil connecting part through a pair of coil connecting holes located in the base member.

35. The contact/noncontact data carrier module according to claim 34, wherein the coil connecting part comprises a connecting wiring part located on the second major surface of the base member, a connecting terminal located on the first major surface of the base member, and a pair of via parts respectively located in the pair of coil connecting holes of the base member and respectively connecting one terminal of the coil and the connecting wiring part, and the connecting wiring part and the connecting terminal;

and terminals of the semiconductor ship are connected to the connecting terminal, connected to one terminal of the coil, and the other terminal of the coil by flip-chip solder bonding.

36. The contact/noncontact data carrier module according to claim 33, further comprising a sealing resin layer sealing the semiconductor chip, the coil and the wiring part therein.

37. The contact/noncontact data carrier module according to claim 33 is a SIM in combination with a booster card.

38. The contact/noncontact data carrier module according to claim 33 is a SIM in combination with a portable telephone.

39. The contact/noncontact data carrier module according to claim 33, wherein the semiconductor chip comprises a user authentication circuit for authenticating a user, and a noncontact type communication circuit for downloading information from the Internet.