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Contact/noncontact type data carrier module

  • US 6,634,564 B2
  • Filed: 10/23/2001
  • Issued: 10/21/2003
  • Est. Priority Date: 10/24/2000
  • Status: Active Grant
First Claim
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1. A contact/noncontact data carrier module comprising:

  • a base member;

    a semiconductor chip mounted on the base member, said semiconductor chip comprising a terminal surface with terminals thereon;

    a coil connected to the semiconductor chip adapted to be electromagnetically coupled with an external booster antenna for noncontact communication; and

    a contact terminal connected to the semiconductor chip and adapted to be brought into contact with an external contact, wherein the semiconductor chip is located on a first major surface of the base member such that said terminal surface provided with terminals faces away from said first major surface;

    the contact terminal is located on a second major surface on a side opposite the first major surface of the base member;

    the semiconductor chip and the contact terminals are connected through a hole located in the base member by a contact terminal connecting part; and

    the contact terminal connecting part comprising a bonding wire connecting a terminal of the semiconductor chip and the contact terminal.

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