Form-in place EMI gaskets

• US 6,635,354 B2
• Filed: 09/12/2001
• Issued: 10/21/2003
• Est. Priority Date: 01/20/1995
• Status: Expired due to Term

• Current Assignee: Parker Intangibles LLC (Parker-Hannifin Corporation)
• Original Assignee: Parker-Hannifin Corporation
• Inventors: Kalinoski, John P., Bunyan, Michael H.
• Primary Examiner(s): NAKARANI, DHIRAJLAL S
• Application Number:
  US09/951,135
• Publication Number:
  US 20020039658A1
• Time in Patent Office: 769 Days
• Field of Search: 174/35.R, 174/35.GR, 174/35.MS, 428/35.8, 428/328, 428/425.8, 428/425.9, 428/450, 428/462, 428/463
• US Class Current: 428/450
• CPC Class Codes: B29L 2031/26 Sealing devices, e.g. packaging for pistons or pipe joints
• CPC Class Codes: F16J 15/064 the packing combining the sealing function with other functions
• CPC Class Codes: F16J 15/14 by means of granular or plastic material, or fluid
• CPC Class Codes: H05K 9/0015 Gaskets or seals
• CPC Class Codes: Y10T 428/256 Heavy metal or aluminum or compound thereof
• CPC Class Codes: Y10T 428/31605 Next to free metal
• CPC Class Codes: Y10T 428/31609 Particulate metal or metal compound-containing
• CPC Class Codes: Y10T 428/31696 Including polyene monomers [e.g., butadiene, etc.]
• CPC Class Codes: Y10T 428/31699 Ester, halide or nitrile of addition polymer

Abstract

A form-in-place, electrically-conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive outer layer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.

Claims

1. An EMI shielded substrate comprising

a first electrically conductive substrate,

a second electrically conductive substrate adjacent to the first substrate, and

a single layer formed in place electrically conductive elastomeric gasket formed on and bonded to a predetermined portion of the first substrate so as to provide an electrical connection and EMI shielding between the first and second substrates, said gasket having a Shore A hardness of from about 5 to about 90, a force/deflection value of from about 0.2 pounds/inch to 15.0 pounds/inch, a bulk electrical resistance value of from about 0.005 ohms cm to 0.1 ohms cm, a compression set value of from about 5% to 50%, and an EMI sheilding effectiveness of from about 10-100 dB at a frequency range from about 10 MHz to about 12 GHz.

2. The structure of claim 1 wherein the first substrate is an enclosure and the second substrate is a cover for the enclosure.

3. The structure of claim 1 wherein the first and second substrates are formed of an electrically conductive material selected from the group consisting of metals, metal plated plastic, metal/plastic laminate, metal/plastic composite, coated plastics and combinations thereof.

4. The substrate of claim 1 wherein the gasket is formed of an elastomer resin and is rendered electrically conductive by the incorporation of one or more conductive fillers into the resin.

5. The structure of claim 1 wherein the gasket is formed of an elastomer and one or more electrically conductive fillers.

6. The structure of claim 5, wherein the electrically-conductive filler is selected from the group consisting of noble metals, noble metal-plated noble metals, noble metal-plated non-noble metals, noble metal-plated glass, noble metal-plated plastic, noble metal-plated metal-filled plastic, noble metal-filled plastic, noble metal-plated ceramics, noble-metal plated alumina, noble-metal plated plastic microspheres, noble-metal plated mica, non-noble metal-plated non-noble metals, non-noble metals, non-noble metal plated non-metals, and non-metal materials.

7. The structure of claim 6, wherein the electrically-conductive filler is selected from the group consisting of silver, gold, copper, aluminum, nickel, cobalt, silver-plated gold, silver-plated copper, silver-plated nickel, silver-plated aluminum, silver-plated aluminum core particles, silver-plated glass microspheres, silver-plated copper-filled silicone, silver-plated aluminum-filled silicone, silver-plated copper-filled fluorosilicone, silver-plated aluminum-filled fluorosilicone, silver-filled silicone, silver-filled fluorosilicone, copper-coated iron, nickel-plated copper, nickel plated graphite, carbon black, and graphite.

8. The structure of claim 1 wherein the gasket is formed of silicone-based polymeric material containing one or more electrically conductive fillers.

9. An EMI shielded substrate comprising:

a substrate having an electrically conductive surface;

a cover for the substrate, the cover having an electrically conductive surface which corresponds to and is in register with the conductive surface of the substrate; and

a single layer formed in place electrically conductive eleastomeric gasket formed on and bonded to a predetermined portion of the conductive surface of the substrate or cover so as to provide an electrical connection and an EMI shielding between the substrate and cover upon mating of the cover to the substrate, said gasket having a Shore A hardness of from about 5 to about 90, a force/deflection value of from about 0.005 ohms cm to 0.1 ohms cm, a compression set value of from about 5% to 50% and an EMI shielding effectiveness of from about 10-1000 dB at a frequency range from about 10 MHz to about 12 GHz.

10. The substrate of claim 9 wherein the substrate and cover are formed of an electrically conductive material selected from the group consisting of metals, metal plated plastic, metal/plastic laminates, metal/plastic composites, electrically conductive coated plastics, and combinations thereof.

11. The substrate of claim 9 wherein the gasket is formed of an elastomer resin and is rendered electrically conductive by the incorporation of one or more conductive fillers into the resin.