Microelectronic assemblies with multiple leads

• US 6,635,553 B1
• Filed: 11/22/2000
• Issued: 10/21/2003
• Est. Priority Date: 07/07/1994
• Status: Expired due to Fees

• Current Assignee: Iessera Incorporated
• Original Assignee: Iessera Incorporated
• Inventors: Smith, John W., DiStefano, Thomas H.
• Primary Examiner(s): Everhart, Caridad
• Assistant Examiner(s): Keshavan, Belur V.
• Application Number:
  US09/721,048
• Time in Patent Office: 1,063 Days
• Field of Search: 438/455, 438/461, 438/464, 438/125, 257/696, 257/692, 257/701
• US Class Current: 438/455
• CPC Class Codes: H01L 21/4839 Assembly of a flat lead with an insulating support, e.g. for TAB
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/22 liquid at the normal operating temperature of the device
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01066 : Dysprosium [Dy]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 1/118 : specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/0133 : Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/0394 : Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/0397 : Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/09081 : Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
• CPC Class Codes: H05K 2201/091 : Locally and permanently deformed areas including dielectric material
• CPC Class Codes: H05K 2203/063 : of preperforated insulating layer
• CPC Class Codes: H05K 3/361 : Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/4084 : by deforming at least one of the conductive layers
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base

Abstract

A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.

Claims

1. A component for making connections comprising:

(a) a support having top and bottom surfaces and having holes extending between said top and bottom surfaces;

(b) a plurality of leads extending along a surface of said support, said leads having terminal ends permanently attached to said support and having tip ends aligned with said holes, the tip end of each said lead being releasably connected to the terminal end of another one of said leads.

2. A component as claimed in claim 1, wherein said leads extend along said bottom surface of said support.

3. A component as claimed in claim 1 wherein said leads are arranged in rows, with the tip end of each lead being releasably connected to the terminal end of the next lead in the same row.

4. A component as claimed in claim 1 wherein each said lead has a frangible section connected between the tip end of such lead and the terminal end of another one of said leads.

5. A component as claimed in claim 4 further comprising terminals exposed at said top surface of said support, at least some of said terminals being connected to at least some of said terminal ends of said leads.

6. A component as claimed in claim 1 wherein said support includes a dielectric sheet.

7. A component as claimed in claim 6 wherein said support is a multi-layer sheet.

8. A component as claimed in claim 6 wherein said support includes a polymeric film.

9. A component as claimed in claim 8 wherein said support is comprised of polyimide.

10. A component as claimed in claim 6 wherein said support is flexible.

11. A packaged semiconductor wafer comprising:

(a) a support having top and bottom surfaces and having holes extending between said top and bottom surfaces;

(b) a unitary wafer including a plurality of semiconductor chips, each chip having a plurality of associated chip contacts, said wafer being juxtaposed with said support bottom surface so that said chip contacts are aligned with said holes;

(c) a plurality of terminals on said support, said terminals being exposed at said support top surface; and

(d) a plurality of leads extending downward from said support to said chip contacts, said leads and said contacts being bonded to one another within said holes, said leads further having terminal ends connected to said terminals.

12. A packaged semiconductor wafer as claimed in claim 11, wherein said leads further include lead portions extending along said support surface from said terminal ends to said holes.

13. A packaged semiconductor wafer as claimed in claim 12, wherein said leads extend along said bottom surface of said support.

14. A packaged semiconductor wafer as claimed in claim 11 wherein said leads are arranged in rows.

15. A packaged semiconductor wafer as claimed in claim 11 wherein said support includes a dielectric sheet.

16. A packaged semiconductor wafer as claimed in claim 15 wherein said support is a multi-layer sheet.

17. A packaged semiconductor wafer as claimed in claim 15 wherein said support includes a polymeric film.

18. A packaged semiconductor wafer as claimed in claim 17 wherein said polymeric film includes polyimide.

19. A packaged semiconductor wafer as claimed in claim 15 wherein said support is flexible.