Method for reducing topography dependent charging effects in a plasma enhanced semiconductor wafer processing system

• US 6,635,577 B1
• Filed: 03/30/1999
• Issued: 10/21/2003
• Est. Priority Date: 03/30/1999
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Huang, Kenlin, Loewengardt, Peter K., Yamartino, John M., Ma, Diana Xiaobing
• Primary Examiner(s): CHEN, KIN CHAN
• Application Number:
  US09/280,462
• Time in Patent Office: 1,666 Days
• Field of Search: 438/706, 438/707, 156/345, 204/164, 204/31
• US Class Current: 438/706
• CPC Class Codes: H01J 37/32339 using electromagnetic radiation
• CPC Class Codes: H01L 21/32136 using plasmas

Abstract

A method of eliminating charging resulting from plasma processing a semiconductor wafer comprising the steps of plasma processing the semiconductor wafer in a manner that may result in topographically dependent charging and exposing, during at least a portion of a time in which the semiconductor wafer is being plasma processed, the semiconductor wafer to particles that remove charge from the semiconductor wafer and reduce topographically dependent charging.

Claims

1. A method of processing a semiconductor wafer comprising the steps of:

providing a semiconductor wafer to a process chamber, wherein the semiconductor wafer has a topographic structure thereon;

exposing the semiconductor wafer to a plasma in the process chamber;

monitoring the plasma using spectroscopy to determine when a period is approaching that may cause charge damage to the semiconductor wafer; and

illuminating the semiconductor wafer with light in response to a determination that the period is approaching that may cause charge damage to the semiconductor wafer to remove electrical charge therefrom.

2. The method of claim 1 wherein the light is produced by a light source, other than the plasma to which the semiconductor wafer is exposed.

3. The method of claim 2 wherein the light source is a lamp.

4. The method of claim 2 wherein the energy of the light varies as a function of a power applied to the light source.

5. The method of claim 2 wherein the intensity of the light varies as a function of a power applied to the light source.

6. The method of claim 1 wherein the light is produced by adding at least one chemical to the plasma.

7. The method of claim 1 wherein the semiconductor wafer is illuminated with light only during a time period when the plasma may cause charge damage to the semiconductor wafer.

8. The method of claim 7 wherein the time period is a transition period between a main etch period and an over etch period.

9. The method of claim 7 wherein the time period is an over etch period.

10. The method of claim 7 wherein the time period is a post etch period.

11. The method of claim 1 wherein the light is selected from at least one band of the electromagnetic spectrum comprising infrared, ultraviolet, visible, and vacuum ultraviolet bands.

12. A method of processing a semiconductor wafer comprising the steps of:

providing a semiconductor wafer to a process chamber, wherein the semiconductor wafer has a topographic structure thereon;

exposing the semiconductor wafer to a plasma in the process chamber;

monitoring the plasma using spectroscopy to determine when a period Is approaching that may cause charge damage to the semiconductor wafer; and

illuminating the semiconductor wafer with light in response to a determination that the period is approaching that may cause charge damage to the semiconductor wafer to remove electrical charge therefrom, wherein the semiconductor wafer is illuminated while being exposed to the plasma.

13. The method of claim 12 wherein the light is produced by a light source, other than the plasma to which the semiconductor wafer is exposed.

14. The method of claim 13 wherein the light source is a lamp.

15. The method of claim 13 wherein the light is produced by adding at least one chemical to the plasma.

16. The method of claim 13 wherein the semiconductor wafer is illuminated only during a time period when the plasma may cause charge damage to the semiconductor wafer.

17. The method of claim 16 wherein the time period is a transition period between a main etch period and an over etch period.

18. The method of claim 16 wherein the time period is an over etch period.

19. The method of claim 13 wherein the light is selected from at least one band of the electromagnetic spectrum comprising infrared, ultraviolet, visible, and vacuum ultraviolet bands.

20. The method of claim 13 wherein the intensity of the light varies as a function of a power applied to the light source.

21. The method of claim 13 wherein the energy of the light varies as a function of a power applied to the light source.