Method of operating a dual chamber reactor with neutral density decoupled from ion density

• US 6,635,578 B1
• Filed: 04/14/2000
• Issued: 10/21/2003
• Est. Priority Date: 02/09/1998
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Xu, Songlin, Qian, Xueyu, Holland, John
• Primary Examiner(s): CHEN, KIN CHAN
• Application Number:
  US09/550,646
• Time in Patent Office: 1,285 Days
• Field of Search: 156/345, 118/723, 438/706, 438/710, 438/712
• US Class Current: 438/706
• CPC Class Codes: H01J 37/32009 Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources plasma generation in general H05H1/24
• CPC Class Codes: H01J 37/32321 Discharge generated by other radiation H01J37/32055, H01J37/32073, H01J37/32082, H01J37/32192, H01J37/32348 take precedence
• CPC Class Codes: H01J 37/32422 Arrangement for selecting ions or species in the plasma
• CPC Class Codes: H01J 37/32871 Means for trapping or directing unwanted particles
• CPC Class Codes: H01L 21/31116 by dry-etching

Abstract

A method for operating a plasma reactor having a secondary chamber that is a neutral species source for the main chamber. The method in one embodiment of the invention consists of determining the desired increase in main chamber neutral particle density to be contributed by the secondary chamber for a given main chamber ion density range, and then to maintain the main chamber source power below a level beneath which the secondary chamber is capable of supplying the desired main chamber neutral density contribution.

Claims

1. A method of operating a plasma reactor having a main chamber for containing a process gas and for holding a semiconductor wafer to be processed, a bias power applicator for applying RF bias power to the wafer and a main plasma source power applicator for applying main chamber plasma source power to the main chamber, and a secondary chamber capable of forming, from a secondary chamber process gas, neutral species furnished to said main chamber, and a second plasma source power applicator for applying secondary chamber plasma source power to said secondary chamber, said method comprising:

applying main chamber plasma source power to said process gases in said main chamber by said main plasma source power applicator to produce a first plasma in said main chamber;

applying secondary chamber plasma source power to said process gases in said secondary chamber by said second plasma source power applicator to produce a second plasma in said secondary chamber;

applying RF bias power to the wafer by said bias power applicator;

selecting an increase in neutral species density in said main chamber;

selecting a secondary chamber plasma source power level;

preventing charged particles formed in the secondary chamber from entering the main chamber by interposing a charged particle filter between the main and secondary chambers, whereby said secondary chamber is primarily a neutral species source to said main chamber for independent control of ion and neutral species densities in said main chamber; and

finding an upper limit of the main chamber plasma source power level below which said secondary chamber plasma source power level results in at least the increase in neutral species density in said main chamber selected in the first step of selecting, and maintaining said main chamber plasma source power level below said upper limit.

2. The method of claim 1 further comprising:

introducing into the main chamber a molecular gas additive which tends to reduce the electron temperature of a plasma in said main chamber.

3. The method of claim 2 wherein said molecular gas additive comprises an etchant species.

4. The method of claim 3 wherein said molecular gas additive comprises one of HBr and Cl₂.

5. The method of claim 2 further comprising:

controlling neutral species density in the main chamber by controlling flow rate into said main chamber of said molecular gas additive.

6. The method of claim 5 wherein said gas additive is chlorine gas and said flow rate is about 125 sccm.

7. The method of claim 5 wherein said gas additive is HBr and said flow rate is about 55 sccm.

8. The method of claim 1 further comprising:

enhancing the neutral species density in the main chamber without significantly increasing ion density by increasing the secondary chamber source power level.

9. The method of claim 8 wherein the secondary chamber source power is increased to at least about 600 Watts.

10. The method of claim 8 wherein the secondary chamber source power is increased to at least about 1000 Watts.

11. The method of claim 8 wherein the secondary chamber source power is increased to at least about 2000 Watts.

12. The method of claim 1 further comprising:

adjusting the neutral species density in the main chamber by adjusting pressure in said main chamber.

13. The method of claim 12 wherein the step of adjusting pressure comprises maintaining the pressure within a range of about 5 mT or 50 mT.

14. The method of claim 1 wherein said upper limit is about 1000 Watts.

15. The method of claim 1 wherein said upper limit is about 800 Watts.

16. The method of claim 1 wherein said upper limit is about 500 Watts.

17. The method of claim 1 wherein said upper limit is about 300 Watts.

18. A method of operating a plasma etch reactor having a main chamber for containing a process gas and for holding a semiconductor wafer to be etch processed, a bias power applicator for applying RF bias power to the wafer and a main plasma source power applicator for applying main chamber plasma source power to the main chamber, and a secondary chamber capable of forming, from a secondary chamber process gas, neutral species furnished to said main chamber, and a second plasma source power applicator for applying secondary chamber plasma source power to said secondary chamber, said method comprising:

applying main chamber plasma source power to said process gases in said main chamber by said main plasma source power application to produce a first plasma in said main chamber;

applying secondary chamber plasma source power to said process gases in said secondary chamber by said second plasma source power applicator to produce a second plasma in said secondary chamber;

applying RF bias power to the wafer by said bias power applicator;

selecting a range of etch rates at which said wafer is to be etch processed, said range of etch rates corresponding to a large range of main chamber plasma source power in the absence of secondary chamber plasma source power;

operating said main chamber source power within a compressed range corresponding to the bottom of said large range and corresponding to a diminished etch rate in the absence of said secondary chamber plasma source power;

preventing charged particles formed in the secondary chamber from entering the main chamber by interposing a charged particle filter between the main and secondary chambers, whereby said secondary chamber is primarily a neutral species source to said main chamber for independent control of ion and neutral species densities in said main chamber; and

raising said secondary chamber source power to an increased level sufficient to raise said etch rate into the range of etch rates selected in the step of selecting.

19. The method of claim 18 wherein said compressed range of said source power lies below an upper limit of said main chamber source power.

20. The method of claim 19 wherein said upper limit of said main chamber source power is a level below which said secondary chamber source power is able to provide said desired range of etch rates.

21. The method of claim 19 wherein said upper limit corresponds to an efficiency ratio defining the responsiveness of neutral species density in said main chamber to said secondary chamber source power.

22. The method of claim 19 wherein said upper limit is about 1000 Watts.

23. The method of claim 19 wherein said upper limit is about 800 Watts.

24. The method of claim 19 wherein said upper limit is about 500 Watts.

25. The method of claim 19 wherein said upper limit is about 300 Watts.

26. The method of claim 18 further comprising:

introducing into the main chamber a molecular gas additive which tends to reduce the electron temperature of a plasma in said main chamber.

27. The method of claim 26 wherein said molecular gas additive comprises an etchant species.

28. The method of claim 27 wherein said molecular gas additive comprises one of HBr and Cl₂.

29. The method of claim 26 further comprising:

controlling neutral species density in the main chamber by controlling flow rate into said main chamber of said molecular gas additive.

30. The method of claim 29 wherein said gas additive is chlorine gas and said flow rate is about 125 sccm.

31. The method of claim 29 wherein said gas additive is HBr and said flow rate is about 55 sccm.

32. The method of claim 18 further comprising:

enhancing the neutral species density in the main chamber without significantly increasing ion density by increasing the secondary chamber source power level.

33. The method of claim 32 wherein the secondary chamber source power is increased to at least about 600 Watts.

34. The method of claim 32 wherein the secondary chamber source power is increased to at least about 1000 Watts.

35. The method of claim 32 wherein the secondary chamber source power is increased to at least about 2000 Watts.

36. The method of claim 18 further comprising:

adjusting the neutral species density in the main chamber by adjusting pressure in said main chamber.

37. The method of claim 36 wherein the step of adjusting pressure comprises maintaining the pressure within a range of about 5 mT or 50 mT.

38. A method of performing a plasma enhanced chemical vapor deposition process in a reactor having a main chamber for containing a process gas and for holding a semiconductor wafer to be etch processed, a bias power applicator for applying RF bias power to the wafer and a main power applicator for applying main chamber source power to the main chamber, and a secondary chamber capable of forming, from a secondary chamber process gas, neutral species furnished to said main chamber, and a second power applicator for applying secondary chamber source power to said secondary chamber, said method comprising:

applying main chamber plasma source power to said process gases in said main chamber by said main plasma source power applicator to produce a first plasma in said main chamber;

applying secondary chamber plasma source power to said process gases in said secondary chamber by said second plasma source power applicator to produce a second plasma in said secondary chamber

applying RF bias power to the wafer by said bias power applicator;

selecting a range of deposition rates at which said wafer is to be processed, said range of deposition rates corresponding to a large range of main chamber source power in the absence of secondary chamber source power;

operating said main chamber source power within a compressed range corresponding to the bottom of said large range and corresponding to a diminished deposition rate in the absence of said secondary chamber source power;

preventing charged particles formed in the secondary chamber from entering the main chamber by interposing a charged particle filter between the main and secondary chambers, whereby said secondary chamber is primarily a neutral species source to said main chamber for independent control of ion and neutral species densities in said main chamber; and

raising said secondary chamber source power to an increased level sufficient to raise said deposition rate into the range of deposition rates selected in the selecting step.

39. The method of claim 38 wherein said compressed range of said source power lies below an upper limit of said main chamber source power.

40. The method of claim 39 wherein said upper limit of said main chamber source power that below which said secondary chamber source power is able to provide said desired range of etch rates.

41. The method of claim 39 wherein said upper limit corresponds to an efficiency ratio defining the responsiveness of neutral species density in said main chamber to said secondary chamber source-power.

42. The method of claim 38 further comprising:

introducing into the main chamber a molecular gas additive which tends to reduce the electron temperature of a plasma in said main chamber.

43. The method of claim 42 wherein said molecular gas additive comprises an etchant species.

44. The method of claim 42 wherein said molecular gas additive comprises one of HBr and Cl₂.

45. The method of claim 42 further comprising:

controlling neutral species density in the main chamber by controlling flow rate into said main chamber of said molecular gas additive.

46. The method of claim 42 wherein said gas additive is chlorine gas and said flow rate is about 125 sccm.

47. The method of claim 42 wherein said gas additive is HBr and said flow rate is about 55 sccm.

48. The method of claim 38 further comprising:

enhancing the neutral species density in the main chamber without significantly increasing ion density by increasing the secondary chamber source power level.

49. The method of claim 38 further comprising:

adjusting the neutral species density in the main chamber by adjusting pressure in said main chamber.

50. The method of claim 49 wherein the pressure is adjusted within a range of about 5 mT to 50 mT.

51. A method of operating a plasma reactor having a main chamber for containing a process gas and for holding a semiconductor wafer to be processed, a bias power applicator for applying RF bias power to the wafer and a main plasma source power applicator for applying main chamber source power to the main chamber, and a secondary chamber capable of forming, from a secondary chamber process gas, neutral species furnished to said main chamber, and a second plasma source power applicator for applying secondary chamber source power to said secondary chamber, said method comprising:

applying main chamber plasma source power to said process gases in said main chamber by said main plasma source power applicator to produce a first plasma in said main chamber;

applying secondary chamber plasma source power to said process gases in said secondary chamber by said second plasma source power applicator to produce a second plasma in said secondary chamber;

applying RF bias power to the wafer by said bias power applicator;

selecting a secondary chamber source power level; and

determining an upper limit of said main chamber source power level below which said secondary chamber source power level results in at least said desired increase in neutral species density in said main chamber;

preventing charged particles formed in the secondary chamber from entering the main chamber by interposing a charged particle filter between the main and secondary chambers, whereby said secondary chamber is primarily a neutral species source to said main chamber for independent control of ion and neutral species densities in said main chamber; and

maintaining the main chamber source power level below said upper limit so as to enhance an increase in the neutral species density in said main chamber in response to an increase in said secondary chamber source power level.