Structure of semiconductor device with improved reliability

• US 6,635,941 B2
• Filed: 03/19/2002
• Issued: 10/21/2003
• Est. Priority Date: 03/21/2001
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Suda, Yasuo
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Nguyen, Thinh T.
• Application Number:
  US10/099,960
• Publication Number:
  US 20020163054A1
• Time in Patent Office: 581 Days
• Field of Search: 257/431, 359/619, 250/208.1, 200/5.A, 251/11, 428/65, 296/03, 349/153, 365/100, 350/368, 348/355
• US Class Current: 257/431
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02164 for shielding light, e.g. light blocking layers, cold shields for infrared detectors
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216

Abstract

A semiconductor device formed by cutting a first substrate and a second substrate bonded together by a spacer, wherein: the spacer is disposed at an end of the first substrate after cutting; the second substrate is a semiconductor wafer formed with a light reception element or elements; and the first substrate has an optical element or an optical element set for converging light on the light reception element or elements. A method of manufacturing such a semiconductor device. A semiconductor device manufacture method includes: a step of detecting a warp of a semiconductor substrate; a step of holding the semiconductor substrate on a base under a condition that the warp is removed; a step of bonding an opposing substrate to the semiconductor substrate; and a step of cutting the opposing substrate, wherein the opposing substrate bonded to the semiconductor substrate is set with a size corresponding to the warp of the semiconductor substrate or with a gap to an adjacent opposing substrate.

Claims

1. A semiconductor device comprising a first substrate and a second substrate bonded together by a spacer, wherein:

an end of the spacer is disposed so as to form a planar surface with an end of the first substrate;

the second substrate is a semiconductor wafer formed with a light reception element or elements; and

the first substrate has an optical element or an optical element set for converging light on the light reception element or elements.

2. A semiconductor device according to claim 1, wherein the first substrate has a compound eye optical element having a plurality of lenses.