Molded electronic component
First Claim
1. A molded electronic component with numerous connection pins protruding on a single plane from a side surface area of an essentially cuboid housing, with top and bottom sides, and a circumferential ridge along other side surface areas on the plane of the connection pins, the thickness of which ridge essentially corresponds to the thickness of the connection pins, wherein, on the other side surface area located opposite to the side surface area with the connection pins, the ridge passes into a groove in the plane of the connection pins.
1 Assignment
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Accused Products
Abstract
A molded electronic component has numerous connection pins protruding on a single plane from a side surface area of an essentially cuboid housing, and a circumferential ridge of molded housing material protrudes from the other side area surfaces on the plane of the connection pins. The thickness of this ridge essentially corresponds to the thickness of the connection pins. On the side surface area located opposite the side surface area from which the connection pins protrude, in the plane of the connection pins, the ridge passes or transitions into a groove such that there is no ridge protruding outwardly beyond the side surface in this area. Thus, the component can be better placed by a tool such as a suction needle onto a printed circuit board without interference from such a ridge. The invention is particularly suitable for the production of molded electronic components whose separation plane runs through that housing surface which serves as a docking surface for a suction needle.
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Citations
18 Claims
- 1. A molded electronic component with numerous connection pins protruding on a single plane from a side surface area of an essentially cuboid housing, with top and bottom sides, and a circumferential ridge along other side surface areas on the plane of the connection pins, the thickness of which ridge essentially corresponds to the thickness of the connection pins, wherein, on the other side surface area located opposite to the side surface area with the connection pins, the ridge passes into a groove in the plane of the connection pins.
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9. A molded electronic component comprising:
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electronic circuitry;
a housing of a molded material that encases said electronic circuitry and that has a top surface, a bottom surface, opposite first and second side surfaces, and opposite third and fourth side surfaces forming a primarily rectangular block shape; and
plural electrical connection pins extending from said electronic circuitry out of said housing, outwardly from said first side surface along a single pin plane;
wherein said housing further has a ridge of said molded material protruding outwardly from at least said third and fourth side surfaces along said pin plane, and a groove recessed inwardly into at least a portion of said second side surface along said pin plane. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A combination of a frame and a molded electronic component, comprising:
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electronic circuitry;
a housing of a molded material that encases said electronic circuitry and that has a top surface, a bottom surface, opposite first and second side surfaces, and opposite third and fourth side surfaces forming a primarily rectangular block shape; and
plural electrical connection pins extending from said electronic circuitry out of said housing, outwardly from said first side surface alone a single pin plane;
wherein said housing further has a ridge of said molded material protruding outwardly from at least said third and fourth side surfaces along said pin plane, and a groove recessed inwardly into at least a portion of said second side surface along said pin plane;
wherein said frame is interconnected with said connection pins and extends around said first, second, third and fourth side surfaces; and
wherein said frame is spaced away from said third and fourth side surfaces, said ridge protrudes outwardly to said frame at said third and fourth side surfaces, and said frame has at least a widened portion at said second side surface, whereby said widened portion protrudes into said groove in said second side surface of said housing.
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Specification