Molded electronic component

• US 6,635,955 B2
• Filed: 11/20/2001
• Issued: 10/21/2003
• Est. Priority Date: 11/15/2000
• Status: Expired due to Fees

• Current Assignee: Vishay Semiconductor GmbH (Vishay Intertechnology Incorporated)
• Original Assignee: Vishay Semiconductor GmbH (Vishay Intertechnology Incorporated)
• Inventors: Scheidle, Helmut
• Primary Examiner(s): Loke, Steven
• Assistant Examiner(s): VU, QUANG D
• Application Number:
  US09/991,346
• Publication Number:
  US 20020063320A1
• Time in Patent Office: 700 Days
• Field of Search: 257/666, 257/678, 257/680, 257/682, 257/685, 257/686, 257/687, 257/692-697, 257/731, 257/735, 257/784, 438/121, 438/112, 438/124, 438/127, 438/116
• US Class Current: 257/678
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/082 Suction, e.g. for holding solder balls or components
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A molded electronic component has numerous connection pins protruding on a single plane from a side surface area of an essentially cuboid housing, and a circumferential ridge of molded housing material protrudes from the other side area surfaces on the plane of the connection pins. The thickness of this ridge essentially corresponds to the thickness of the connection pins. On the side surface area located opposite the side surface area from which the connection pins protrude, in the plane of the connection pins, the ridge passes or transitions into a groove such that there is no ridge protruding outwardly beyond the side surface in this area. Thus, the component can be better placed by a tool such as a suction needle onto a printed circuit board without interference from such a ridge. The invention is particularly suitable for the production of molded electronic components whose separation plane runs through that housing surface which serves as a docking surface for a suction needle.

Claims

1. A molded electronic component with numerous connection pins protruding on a single plane from a side surface area of an essentially cuboid housing, with top and bottom sides, and a circumferential ridge along other side surface areas on the plane of the connection pins, the thickness of which ridge essentially corresponds to the thickness of the connection pins, wherein, on the other side surface area located opposite to the side surface area with the connection pins, the ridge passes into a groove in the plane of the connection pins.

2. The molded electronic component according to claim 1, wherein the component is a surface-mounting component.

3. The molded electronic component according to claim 2, wherein the connection pins are angled.

4. The molded electronic component according to claim 2, wherein the connection pins are each angled at two locations.

5. The molded electronic component according to claim 4, wherein, due to the angling of each of the connection pins at two locations, the component can be mounted onto a printed circuit board with said side surface area from which the connection pins protrude.

6. The molded electronic component according to claim 4, wherein the component is mounted with the bottom side thereof on a circuit board.

7. The molded electronic component according to claim 4, wherein the bottom side thereof features a recess for receiving the angled connection pins.

8. The molded electronic component according to claim 1, wherein the component features two lenses on the top side thereof.

9. A molded electronic component comprising:

electronic circuitry;

a housing of a molded material that encases said electronic circuitry and that has a top surface, a bottom surface, opposite first and second side surfaces, and opposite third and fourth side surfaces forming a primarily rectangular block shape; and

plural electrical connection pins extending from said electronic circuitry out of said housing, outwardly from said first side surface along a single pin plane;

wherein said housing further has a ridge of said molded material protruding outwardly from at least said third and fourth side surfaces along said pin plane, and a groove recessed inwardly into at least a portion of said second side surface along said pin plane.

10. The molded electronic component according to claim 9, wherein said housing further has two ridge portions of said molded material protruding outwardly from said second side surface respectively laterally adjacent to said groove along said pin plane, such that said ridge portions each transition into said groove.

11. The molded electronic component according to claim 9, wherein at least said portion of said second side surface having said groove therein is a flat planar continuous side surface except for said groove therein, and no part of said component protrudes outwardly from or beyond said flat planar continuous side surface on said portion of said second side surface.

12. The molded electronic component according to claim 9, wherein said ridge has a thickness in a direction perpendicular to said top and bottom surfaces that corresponds to a thickness of said pins in said direction.

13. The molded electronic component according to claim 9, wherein said pins are each respectively bent out of said pin plane at a first bend to extend along said first side surface away from said pin plane.

14. The molded electronic component according to claim 13, wherein said pins are each respectively additionally bent at a second bend to extend from said first side surface along said bottom surface toward said second side surface.

15. The molded electronic component according to claim 14, wherein said bottom surface has a recess therein, and portions of said pins extending from said second bends toward said second side surface are received at least partially in said recess in said bottom surface.

16. The molded electronic component according to claim 9, wherein said top surface includes a planar surface area and two lenses protruding from said planar surface area.

17. A combination of said molded electronic component according to claim 9, and a pick-up device comprising a suction needle that is arranged in contact with and suction-engages said second side surface at said portion thereof having said groove therein.

18. A combination of a frame and a molded electronic component, comprising:

electronic circuitry;

a housing of a molded material that encases said electronic circuitry and that has a top surface, a bottom surface, opposite first and second side surfaces, and opposite third and fourth side surfaces forming a primarily rectangular block shape; and

plural electrical connection pins extending from said electronic circuitry out of said housing, outwardly from said first side surface alone a single pin plane;

wherein said housing further has a ridge of said molded material protruding outwardly from at least said third and fourth side surfaces along said pin plane, and a groove recessed inwardly into at least a portion of said second side surface along said pin plane;

wherein said frame is interconnected with said connection pins and extends around said first, second, third and fourth side surfaces; and

wherein said frame is spaced away from said third and fourth side surfaces, said ridge protrudes outwardly to said frame at said third and fourth side surfaces, and said frame has at least a widened portion at said second side surface, whereby said widened portion protrudes into said groove in said second side surface of said housing.