Capacitor constructions, methods of forming bitlines, and methods of forming capacitor and bitline structures

• US 6,636,415 B2
• Filed: 07/17/2002
• Issued: 10/21/2003
• Est. Priority Date: 03/03/2000
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Narasimhan, Raj, Tang, Sanh D.
• Primary Examiner(s): Dinkins, Anthony
• Application Number:
  US10/198,401
• Publication Number:
  US 20020176220A1
• Time in Patent Office: 461 Days
• Field of Search: 361/303, 361/306.3, 361/306.1, 361/311-313, 361/321.2, 361/321.3, 361/330, 257/306, 257/309-310, 257/303, 257/308, 438/240, 438/241, 438/253, 438/396, 438/639
• US Class Current: 361/303
• CPC Class Codes: H01L 21/76897 Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step self-aligned silicidation on field effect transistors H01L29/665
• CPC Class Codes: H10B 12/0335 Making a connection between the transistor and the capacitor, e.g. plug
• CPC Class Codes: H10B 12/482 Bit lines

Abstract

The invention encompasses a method of forming bitlines. A substrate is provided, and comprises a plurality of spaced electrical nodes. A bitline layer is formed over at least some of the spaced electrical nodes. The bitline layer comprises at least one conductive material. Openings are etched through the bitline layer and to the electrical nodes. After the openings are formed, the bitline layer is patterned into bitlines. The invention also encompasses a method of forming a capacitor and bitline structure. A substrate is provided, and comprises a plurality of spaced electrical nodes. A stack of bitline materials is formed over at least some of the spaced electrical nodes. The bitline materials comprise at least one insulative material over at least one conductive material. Openings are etched through the bit line materials and to the electrical nodes. Conductive masses are formed in at least some of the openings. After the conductive masses are formed, the bitline materials are patterned into bitlines. Capacitor constructions are formed over the patterned bit lines and electrically connected to the electrical nodes through the conductive masses. Additionally, the invention encompasses capacitor constructions.

Claims

1. A semiconductor construction, comprising:

an insulative material;

a first conductive material extending into the insulative material and comprising an upper surface of cobalt suicide;

a dielectric layer over the cobalt silicide upper surface; and

a second conductive material over the dielectric layer.

2. The construction of claim 1 further comprising a third conductive material between the cobalt silicide upper surface and the dielectric material.

3. The construction of claim 1 further comprising a third conductive material between the cobalt silicide upper surface and the dielectric material;

and wherein the third conductive material is in a container shape.

4. The construction of claim 1 further comprising a third conductive material between the cobalt silicide upper surface and the dielectric material;

and wherein the third conductive material is in a shape of a rectangular block.

5. The construction of claim 1 wherein the cobalt suicide upper surface is part of a layer comprising cobalt suicide;

and

wherein the layer comprising cobalt silicide is on a layer comprising conductively-doped polysilicon.

6. A DRAM array construction, comprising:

a semiconductive material substrate;

an insulative material supported by the substrate;

first conductive material extending into the insulative material and comprising an upper surface of cobalt silicide;

a dielectric layer over the cobalt silicide upper surface; and

a second conductive material over the dielectric layer;

the first conductive material, dielectric layer and second conductive material together being incorporated into at least one capacitor construction.

7. The construction of claim 6 further comprising a third conductive material between the cobalt silicide upper surface and the dielectric material.

8. The construction of claim 6 further comprising a third conductive material between the cobalt silicide upper surface and the dielectric material;

and

wherein the third conductive material is in a container shape.

9. The construction of claim 6 further comprising a third conductive material between the cobalt suicide upper surface and the dielectric material;

and

wherein the third conductive material is in a shape of a rectangular block.

10. The construction of claim 6 wherein the cobalt suicide upper surface is part of a layer comprising cobalt silicide;

and

wherein the layer comprising cobalt silicide is on a layer comprising conductively-doped polysilicon.