Data storage systems with enhanced cooling

• US 6,636,422 B1
• Filed: 12/11/2001
• Issued: 10/21/2003
• Est. Priority Date: 12/11/2001
• Status: Expired due to Fees

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Tanzer, Herbert J., Tsuyuki, Brian
• Primary Examiner(s): Schuberg, Darren
• Assistant Examiner(s): Edwards, Anthony Q.
• Application Number:
  US10/014,905
• Time in Patent Office: 679 Days
• Field of Search: 361/685, 361/687-690, 312/332.1
• US Class Current: 361/679.46
• CPC Class Codes: G11B 33/022 Cases
• CPC Class Codes: G11B 33/128 of the plurality of recording/reproducing devices, e.g. disk drives, onto a chassis
• CPC Class Codes: G11B 33/1426 by cooling plates, e.g. fins

Abstract

Data storage systems are provided. A representative data storage system includes a chassis that is configured to mount at least one data storage device and a carrier. The carrier incorporates a frame and a handle assembly. The frame includes a first and second rails that are spaced from each other and configured to engage opposing sides of a data storage device. Preferably, the first and second rails are formed at least partially of metal for dissipating heat from the data storage device. The handle assembly includes a handle that is configured to move between a latched position and an unlatched position. In the latched position, the handle facilitates secure mounting of the carrier to the chassis. In the unlatched position, the handle facilitates removal of the carrier from the chassis. Other systems and devices also are provided.

Claims

1. A system for mounting a data storage device to a chassis, said system comprising:

a carrier having a frame and a handle assembly,

said frame having a faceplate, a first rail, and a second rail, said first rail and said second rail extending from said faceplate, said first rail and second rail being configured to engage opposing sides of a data storage device,

said handle assembly having a handle configured to move between a latched position and an unlatched position such that, in said latched position, said handle facilitates secure mounting of said carrier to a chassis, and in said unlatched position, said handle facilitates removal of said carrier from the chassis;

means for thermally conducting heat from a data storage device engaging said carrier; and

a contact member formed, at least partially, of a dissipative material;

wherein said first rail has a distal end, said distal end engaging said contact member such that said contact member slows a rate of electro-static discharge from said rail.

2. The system of claim 1, wherein at least one of said rails includes at least one fin, said at least one fin extending outwardly from an exterior surface of said at least one of said rails and providing an increased surface area of said at least one of said rails thereby enhancing heat dissipation of said at least one of said rails.

3. The system of claim 2, wherein said at least one fin extends along at least a portion of the length of said at least one of said rails.

4. The system of claim 1, wherein said means for thermally conducting heat comprises:

a first thermally-conductive member attached to one of said rails such that said first thermally-conductive member transfers heat from a data storage device engaging said carrier and provides the heat to said one of said rails.

5. The system of claim 4, wherein said means for thermally conducting heat further comprises:

a second thermally-conductive member attached to the other of said rails such that said second thermally-conductive member transfers heat from the data storage device engaging said carrier and provides the heat to said other of said rails.

6. The system of claim 1, wherein said frame is formed, at least partially, of aluminum.

7. The system of claim 1, wherein said first rail defines a recessed portion, said recessed portion being sized and shaped to permit cooling air to flow between said first rail and a data storage device engaging said carrier.

8. The system of claim 1, wherein said means for thermally conducting heat comprises:

a cover configured to at least partially encase a data storage device received by said carrier, said cover being formed, at least partially, of aluminum.

9. The system of claim 1, further comprising:

a data storage device engaging said carrier.

10. The system of claim 1, wherein said carrier has a shield at least partially disposed between said faceplate and said handle assembly, said shield being configured to inhibit propagation of electromagnetic energy directed from the data storage device and toward said shield.

11. The system of claim 9, wherein said carrier has spring fingers arranged at least partially between said handle assembly and said frame, each of said spring fingers being configured as a flexible member, said spring fingers being spaced from each other and protruding about at least a portion of the periphery of said carrier, each of said spring fingers being configured to deflect from a non-displaced position in response to a displacement force such that said spring fingers tend to damp vibration encountered by said carrier.

12. A data storage system comprising:

a chassis configured to mount at least one data storage device; and

a carrier having a frame and a handle assembly, said frame having a first rail and a second rail, said first rail and said second rail being spaced from each other and configured to engage opposing sides of a data storage device, said first rail and said second rail being formed at least partially of metal for dissipating heat from the data storage device, said handle assembly having a handle configured to move between a latched position and an unlatched position such that, in said latched position, said handle facilitates secure mounting of said carrier to a chassis, and in said unlatched position, said handle facilitates removal of said carrier from the chassis; and

a contact member formed, at least partially, of a dissipative material;

wherein said first rail has a distal end, said distal end engaging said contact member such that said contact member slows a rate of electro-static discharge from said rail to said chassis.

13. The system of claim 12, further comprising:

a data storage device mounted to said carrier.

14. The system of claim 13, further comprising:

a cover engaged between said first and second rails, said cover being configured to at least partially encase said data storage device, said cover being thermally coupled to said first and second rails such that heat provided to said first and second rails by said data storage device is dissipated by said cover.

15. The system of claim 13, further comprising:

a first thermally-conductive member thermally coupled between said data storage device and said first rail, said first thermally-conductive member being adapted to transfer heat from said data storage device to said first rail.

16. The system of claim 12, wherein said contact member engages the exterior of said first rail.

17. The system of claim 12, wherein at least one of said rails includes at least one fin, said at least one fin extending outwardly from an exterior surface of said at least one of said rails and providing an increased surface area of said at least one of said rails thereby enhancing heat dissipation of said at least one of said rails.