Wafer mapping apparatus and method

• US 6,636,626 B1
• Filed: 11/30/1999
• Issued: 10/21/2003
• Est. Priority Date: 11/30/1999
• Status: Expired due to Fees

• Current Assignee: WaferMasters, Inc.
• Original Assignee: WaferMasters, Inc.
• Inventors: Kang, Kitaek, Yoo, Woo Sik
• Primary Examiner(s): Au, Amelia M.
• Assistant Examiner(s): KIBLER, VIRGINIA M
• Application Number:
  US09/451,674
• Time in Patent Office: 1,421 Days
• Field of Search: 382/140, 382/141, 382/142, 382/143, 382/144, 382/145, 382/146, 382/147, 382/148, 382/149, 382/151, 348/91, 348/92, 348/94, 348/95, 348/86, 324/755
• US Class Current: 382/151
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/0004 Industrial image inspection
• CPC Class Codes: H01L 21/67265 of substrates stored in a container, a magazine, a carrier, a boat or the like

Abstract

A wafer mapping system uses a camera to acquire an image of a carrier containing wafers. In one embodiment, the acquired image is stored as rows and columns of pixels. The presence and location of a wafer in the carrier are determined by looking for pixel intensity variations in a column of the image.

Claims

1. A method for detecting a wafer in a wafer carrier, comprising:

acquiring an image of a carrier having a plurality of slots, said carrier including at least one wafer;

recognizing a first feature of the at least one wafer in a first column of the image;

determining a first position in the first column of the image where the first feature is detected, said first position corresponding to a first reference slot of said plurality of slots;

recognizing a second feature of the at least one wafer in a second column of the image;

determining a second position in the second column of the image where the second feature is detected, said second position corresponding to a second reference slot of said plurality of slots; and

comparing said first reference slot to said second reference slot to determine if said first reference slot is the same or different from said second reference slot.

2. The method of claim 1 wherein the first feature is represented as peak intensity in the first column and the second feature is represented as peak intensity in the second column.

3. The method of claim 1 wherein the image is acquired using a camera.

4. The method of claim 3 wherein the camera is a video camera.

5. The method of claim 3 wherein the camera is a digital camera.

6. The method of claim 5 wherein the image is a digitized image.

7. In a semiconductor manufacturing equipment, a wafer mapping apparatus comprising:

a camera for acquiring an image of a wafer contained in a carrier, said carrier including a plurality of slots for supporting wafers therein;

means for recognizing a first feature of the wafer in a first column of the image;

means for determining a first position in the first column of the image where the first feature is detected, said first position corresponding to a first reference slot of said plurality of slots;

means for recognizing a second feature of the wafer in a second column of the image;

means for determining a second position in the second column of the image where the second feature is detected, said second position corresponding to a second reference slot of said plurality of slots; and

means for comparing said first reference slot to said second reference slot to determine if said first reference slot is the same or different from said second reference slot.

8. The apparatus of claim 7 further comprising a light source.

9. The apparatus of claim 7 wherein the camera is a video camera.

10. The apparatus of claim 7 wherein the camera is a digital camera.

11. The apparatus of claim 7 wherein the camera is coupled to a display monitor.

12. The apparatus of claim 7 wherein the feature of the wafer is detected in a column of the image.