Probe for use in an infrared thermometer
First Claim
1. A probe for use in an infrared thermometer, comprising:
- a waveguide;
a first heat sink thermally coupled to said waveguide;
an IR sensor for sensing thermal radiation directed by and through said waveguide;
a spacer between said first heat sink and said IR sensor for thermally insulating said IR sensor from said first heat sink, wherein the spacer is an O-ring with good elasticity and poor thermal conductivity surrounding the IR sensor;
a second heat sink thermally coupled to one end of said IR sensor; and
at least one first silicon film positioned between said first heat sink and said second heat sink for increasing thermal resistance.
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Accused Products
Abstract
The present invention discloses a probe assembly for used in an infrared ear thermometer. Given that the exchanged thermal radiation and the infrared detector'"'"'s temperature are known, the subject temperature can be calculated according to Stefan-Boltzman'"'"'s law. To make the Stefan-Boltzman'"'"'s law applicable in a dynamic environment where temperature may vary greatly, the contact temperature sensor (thermistor) must acuurately and fast track the temperature of the infrared detector (thermopile sensor). By using the heat transfer theorem, the disclosed assembly makes the thermistor accurately track the cold junction temperature of the thermopile chip without being in an isothermal condition. Not only minimizes the measurement error in a dynamic environment, the design of the disclosed probe assembly also makes a samll and compact infrared thermometer possible.
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Citations
4 Claims
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1. A probe for use in an infrared thermometer, comprising:
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a waveguide;
a first heat sink thermally coupled to said waveguide;
an IR sensor for sensing thermal radiation directed by and through said waveguide;
a spacer between said first heat sink and said IR sensor for thermally insulating said IR sensor from said first heat sink, wherein the spacer is an O-ring with good elasticity and poor thermal conductivity surrounding the IR sensor;
a second heat sink thermally coupled to one end of said IR sensor; and
at least one first silicon film positioned between said first heat sink and said second heat sink for increasing thermal resistance. - View Dependent Claims (2, 3, 4)
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Specification
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- Resources
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Current AssigneeOriental System Technology Incorporated
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Original AssigneeOriental System Technology Incorporated
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InventorsChang, Ryan, Lee, Alich, Wu, Cruise, Lee, Burt
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Primary Examiner(s)Fulton, Christopher W.
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Assistant Examiner(s)Jagan, Mirellys
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Application NumberUS09/935,191Publication NumberTime in Patent Office797 DaysField of Search374/131, 374/130, 374/132, 374/133, 600/474US Class Current374/131CPC Class CodesG01J 5/16 Arrangements with respect t...
