Stable plating performance in copper electrochemical plating

• US 6,638,409 B1
• Filed: 05/21/2002
• Issued: 10/28/2003
• Est. Priority Date: 05/21/2002
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Yang, San-Sun, Ku, Chih-Chen, Cheng, Li-Chuen, Huang, Chen-Ming, Lin, Hung-Jen
• Primary Examiner(s): King, Roy
• Assistant Examiner(s): Nicolas, Wesley A.
• Application Number:
  US10/152,471
• Time in Patent Office: 525 Days
• Field of Search: 205/99, 205/98, 204/238, 204/240, 204/276
• US Class Current: 205/99
• CPC Class Codes: C25D 21/06 Filtering particles other than ions filtering ions C25D21/22
• CPC Class Codes: C25D 21/12 Process control or regulation controlling or regulating in general G05
• CPC Class Codes: C25D 21/18 of electrolytes C25D21/22 takes precedence

Abstract

A real-time and in-line process control system maintains stable plating performance in copper electrochemical plating IC devices by using a real time, on-line programmable controller. Two or more valves to direct the flow of the electrolyte from the electroplating cell back to the reservoir connect an alternative carbon-filter as well as a mirco-filter. The programmable controller controls the operation of at least two in-line valves to direct the flow of the electrolyte within the system.

Claims

1. A system for maintaining stable plating performance in copper electrochemical plating IC devices comprising:

an electrolyte tank containing the copper-plating electrolyte;

an electroplating cell receiving said copper plating electrolyte from said electrolyte tank, said cell adapted to receive the IC devices to be plated;

a micro-filter receiving said copper plating electrolyte from said cell;

a first valve interposed said cell and said micro-filter, said first valve is operable to control the flow of said copper plating electrolyte to said micro-filter;

a carbon-filter coupled to said cell for receiving said copper plating electrolyte from said cell, said carbon-filter for removing byproducts of additives from said electrolyte, said electrolyte flowing to said micro-filter from said carbon-filter;

a second valve interposed said cell and said carbon-filter, said second valve operable to control the flow of said copper plating electrolyte from said cell to said carbon-filter;

a programmable controller having a memory, input circuits, valve control circuits, output circuits, and analysis control circuits, said controller operable for controlling said first and second valves in such a manner that said copper plating electrolyte flows from said cell to one of said filters; and

an algorithm stored in said memory of said programmable controller and responsive to several inputs measuring a plating process for opening one of said valves and closing the other of said valves for controlling said flow of the copper plating electrolyte.

2. The system according to claim 1 additionally including;

a cyclic voltammetric stripping, CVS, system connected to said tank; and

a third valve operatively interposed said electrolyte tank and said cyclic voltammetric stripping system, said third valve operatively controlled by said valve controls in said programmable controller.

3. The system according to claim 1 wherein said programmable controller operates in real time and on-line, wherein said programmable controller controls said flow and said byproducts from said electrolyte during said plating process.

8. The system according to claim 1 wherein said micro-filter and said carbon-filter include sensors to provide information indicative of a condition of said electrolyte.

4. A method for controlling the stability of the electrolyte in a copper electrochemical plating of IC devices comprising the steps of:

supplying a tank of copper plating electrolyte;

flowing the copper-plating electrolyte from the electrolyte tank, to an electroplating cell;

placing the IC devices to be plated in the electroplating cell;

filtering through a micro-filter the copper-plating electrolyte flowing from the cell;

controlling through a first valve the flow of the copper-plating electrolyte to the micro-filter;

controlling through a second valve the flow of the copper-plating electrolyte from the cell;

removing additives from the electrolyte from the cell through a carbon-filter coupled to the cell and the second valve, said electrolyte flowing to said micro-filter from said carbon-filter;

controlling by a programmable controller the first and second valves in such a manner that the copper plating electrolyte flows from the cell to only one of the filters; and

storing in the memory of the programmable controller an algorithm responsive to several inputs measuring a plating process for opening one of the valves and closing the other of the valves for controlling the flow of the copper-plating electrolyte.

5. The method according to claim 4 additionally including;

flowing the copper plating electrolyte through a cyclic voltammetric stripping, CVS, system connected to the tank; and

controlling the flow of the copper-plating electrolyte through a third valve from the electrolyte tank to the cyclic voltammetric stripping system by valve controls in the programmable controller.

6. The method according to claim 4 wherein the step of controlling the first valve and the second valve is a mutually exclusive operation wherein only one of the valves is open and the other valve is closed.

7. The method according to claim 6 wherein the first valve and second valve are mutually exclusive in operation.

9. The method according to claim 4 wherein said micro-filter and said carbon-filter include sensors to provide information indicative of a condition of said electrolyte.