Method for electrostatic force bonding and a system thereof

• US 6,638,627 B2
• Filed: 12/10/2001
• Issued: 10/28/2003
• Est. Priority Date: 12/13/2000
• Status: Active Grant

• Current Assignee: Rochester Institute of Technology
• Original Assignee: Rochester Institute of Technology
• Inventors: Potter, Michael D.
• Primary Examiner(s): Mills, Gregory
• Assistant Examiner(s): Kackar, Ram N
• Application Number:
  US10/016,782
• Publication Number:
  US 20020072201A1
• Time in Patent Office: 687 Days
• Field of Search: 257/350, 310/324, 428/461, 428/446, 428/448, 365/151, 438/455, 156/273.1, 156/60, 369/126
• US Class Current: 428/446
• CPC Class Codes: B81C 3/002 Aligning microparts
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 428/31692 Next to addition polymer from unsaturated monomers

Abstract

A method for electrostatic bonding includes placing a first region of a first unit at least adjacent to a first region of a second unit. The first region of the first unit has trapped charge. A bond between the first region of the first unit and the first region of the second unit is formed by the electrostatic forces between the trapped charge and induced charge in the first region of the second unit. A system for electrostatic bonding includes a first unit having a first region with trapped charge and a second unit with a first region with induced charge. Electrostatic forces between the trapped charge in the first region of the first unit and the induced charge in the first region of the second unit bond the first and second units together.

Claims

1. A system for electrostatic force bonding, the system comprising:

a first unit having a first region with fixed, trapped charge; and

a second unit with a first region with induced charge, electrostatic forces between the fixed, trapped charge in the first region of the first unit and the induced charge in the first region of the second unit bonding the first and second units together

wherein the first region of the first unit comprises a first layer and a second layer on top of the first layer to form a dual dielectric, the dual dielectric having an interface between the first and second layers where at least a portion of the fixed, trapped charge resides.

2. The system as set forth in claim 1 wherein one of the first and second units is a component and the other one of the first and second units is an assembly.

3. The system as set forth in claim 1 further comprising a bonding material on at least a portion of at least one of the first region of the first unit and the first region of the second unit.

4. The system as set forth in claim 1 wherein the first and second layers comprise different materials.

5. The system as set forth in claim 1 wherein one of the first and second layers is silicon oxide and the other one of the first and second layers is silicon nitride.

6. The system as set forth in claim 1 wherein one of the first and second layers is silicon oxide and the other one of the first and second layers is aluminum oxide.

7. The system as set forth in claim 1 wherein the second layer is thinner than the first layer.

8. The system as set forth in claim 1 wherein the first region of the first unit further comprises a third layer in the first unit, the third layer is made of a conductive material and is located between at least a portion of the first layer and a remaining region of the first unit.

9. The system as set forth in claim 8 further comprising a fourth layer between the first and second layers, the fourth layer is made of a conductive material and acts as the interface between the first and second layers, wherein at least a portion of the trapped charge resides in the fourth layer.

10. The system as set forth in claim 1 further comprising a third layer between the first and second layers, the third layer is made of a conductive material and acts as the interface between the first and second layers, wherein at least a portion of the trapped charge resides in the third layer.

11. A system for electrostatic bonding, the system comprising:

a first substrate;

a first insulating layer on at least a portion of the substrate;

a second insulating layer on at least a portion of the first insulating layer to form a dual dielectric with fixed, trapped charge residing at an interface between the first and second insulating layers; and

a second substrate bonded to the second insulating layer with electrostatic forces between the fixed, trapped charge and induced charge in the second substrate.

12. The system as set forth in claim 11 further comprising a bonding material on at least a portion of at least one of the second insulating layer and the second substrate.

13. The system as set forth in claim 11 wherein the first and second insulating layers comprise different materials.

14. The system as set forth in claim 11 wherein one of the first and second insulating layers is silicon oxide and the other one of the first and second layers is silicon nitride.

15. The system as set forth in claim 11 wherein one of the first and second insulating layers is silicon oxide and the other one of the first and second layers is aluminum oxide.

16. The system as set forth in claim 11 wherein the second insulating layer is thinner than the first insulating layer.

17. A system for electrostatic bonding, the system comprising:

a first substrate;

a first conductive layer on at least a portion of the substrate;

a first insulating layer on at least a portion of the first conductive layer;

a second insulating layer on at least a portion of the first insulating layer to form a dual dielectric, fixed, trapped charge residing at an interface between the first and second insulating layers; and

a second substrate bonded to the second insulating layer with electrostatic forces between the trapped charge and induced charge in the second substrate.

18. The system as set forth in claim 17 further comprising a bonding material on at least a portion of at least one of the second insulating layer and the second substrate.

19. The system as set forth in claim 17 wherein the first and second insulating layers comprise different materials.

20. The system as set forth in claim 17 wherein one of the first and second insulating layers is silicon oxide and the other one of the first and second insulating layers is silicon nitride.

21. The system as set forth in claim 17 wherein one of the first and second insulating layers is silicon oxide and the other one of the first and second insulating layers is aluminum oxide.

22. The system as set forth in claim 17 wherein the second insulating layer is thinner than the first insulating layer.

23. A system for electrostatic bonding, the system comprising:

a first substrate;

a first insulating layer on at least a portion of the first substrate;

a first conductive layer on at least a portion of the first insulating layer, the first conductive layer having fixed, trapped charge;

a second insulating layer on at least a portion of the first conductive layer; and

a second substrate bonded to the second insulating layer with electrostatic forces between the fixed, trapped charge and induced charge in the second substrate.

24. The system as set forth in claim 23 further comprising a bonding material on at least a portion of at least one of the second insulating layer and the second substrate.

25. The system as set forth in claim 23 wherein the first and second insulating layers comprise different materials.

26. The system as set forth in claim 23 wherein one of the first and second insulating layers is silicon oxide and the other one of the first and third layers is silicon nitride.

27. The system as set forth in claim 23 wherein one of the first and second insulating layers is silicon oxide and the other one of the first and third layers is aluminum oxide.

28. The system as set forth in claim 23 wherein the second insulating layer is thinner than the first insulating layer.

29. A system for electrostatic bonding, the system comprising:

a first substrate;

a first conductive layer on at least a portion of the first substrate;

a first insulating layer on at least a portion of the first conductive layer;

a second conductive layer on at least a portion of the first insulating layer, the second conductive layer having fixed, trapped charge;

a second insulating layer on at least a portion of the second conductive layer;

a second substrate bonded to the second insulating layer with electrostatic forces between the fixed, trapped charge and induced charge in the second substrate.

30. The system as set forth in claim 29 further comprising a bonding material on at least a portion of at least one of the second insulating layer and the second substrate.

31. The system as set forth in claim 29 wherein the first and second insulating layers comprise different materials.

32. The system as set forth in claim 29 wherein one of the first and second insulating layers is silicon oxide and the other one of the first and second layers is silicon nitride.

33. The system as set forth in claim 29 wherein one of the first and second insulating layers is silicon oxide and the other one of the first and second layers is aluminum oxide.

34. The system as set forth in claim 29 wherein the second insulating layer is thinner than the first insulating layer.