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IC-mounted card substrate and IC-mounted personal-data certification card

  • US 6,638,635 B2
  • Filed: 01/22/2002
  • Issued: 10/28/2003
  • Est. Priority Date: 01/25/2001
  • Status: Expired due to Fees
First Claim
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1. An IC-mounted card substrate comprising a first sheet member having at least a first support, a second sheet member having at least a second support and an electronic part fixing layer having therein an IC-module and provided between the first sheet member and the second sheet member, wherein the second sheet member has a cushion layer comprising an actinic ray-cured resin on the second support, and a displacement value of needle penetration of the cushion layer obtained by a thermo-mechanical analysis (TMA) apparatus is not more than 30% at temperature of 100°

  • C. and not less than 30% at a temperature of 150°

    C. based on a thickness of the cushion layer.

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