Leadframe and method for manufacturing resin-molded semiconductor device

• US 6,638,790 B2
• Filed: 11/06/2001
• Issued: 10/28/2003
• Est. Priority Date: 09/01/1999
• Status: Expired due to Term

• Current Assignee: III Holdings 12, LLC (Intellectual Ventures LLC)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Minamio, Masanori, Adachi, Osamu
• Primary Examiner(s): Pham, Long
• Assistant Examiner(s): Trinh, Hoa B.
• Application Number:
  US09/985,883
• Publication Number:
  US 20020031869A1
• Time in Patent Office: 721 Days
• Field of Search: 438/123, 438/121, 438/122, 438/125, 438/126, 438/127, 438/110, 438/111, 438/112, 438/106, 438/118, 257/666, 257/672, 257/676
• US Class Current: 438/111
• CPC Class Codes: H01L 21/4842 Mechanical treatment, e.g. punching, cutting, deforming, cold welding
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/566 Release layers for moulds, e.g. release layers, layers against residue during moulding
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32014 the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32055 being circular or elliptic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/35121 : Peeling or delaminating
• CPC Class Codes: H05K 3/3442 : having edge contacts, e.g. leadless chip capacitors, chip carriers

Abstract

In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is inclined at a predetermined angle and the bottom of the land portion is made lower than that of a lead. Thus, in a resin molding process using a seal sheet, the land electrode is forced into, and strongly adhered to, the seal sheet when pressure is applied through dies, and no resin encapsulant reaches the land electrode. As a result, no resin bur will be left on the land electrode of the land lead.

Claims

1. A method for manufacturing a resin-molded semiconductor device, comprising the steps of:

a) preparing a leadframe,

the leadframe including;

a frame rail made of a metal plate;

a die pad for mounting a semiconductor chip thereon, the die pad being disposed approximately in a center region of an opening of the frame rail;

support leads, one end of each said support lead supporting the die pad, the other end of the support lead being connected to the frame rail;

a first group of leads, one end of each said lead of the first group extending toward the die pad at least partially, the other end of the lead of the first group being connected to the frame rail, the bottom of the lead of the first group being used as a land electrode of a first group; and

a second group of leads, one end of each said lead of the second group extending toward the die pad and being closer to the die pad than the end of each said lead of the first group is, the other end of the lead of the second group being connected to the frame rail, part of the bottom of the lead of the second group being used as a land electrode of a second group,

wherein the first and second groups of land electrodes are arranged in two lines, and

wherein part of each said lead of the second group has been pressed down by half-cut pressworking such that the bottom of each said land electrode of the second group is lower than the bottom of each said land electrode of the first group, and

wherein said part of the lead of the second group is inclined downward;

b) bonding a semiconductor chip onto the die pad of the leadframe prepared;

c) connecting electrode pads, which are formed on the principal surface of the semiconductor chip bonded to the die pad, to respective upper surfaces of the first and second groups of leads of the leadframe with metal fine wires;

d) adhering a seal sheet to at least the bottoms of the die pad and the first and second groups of leads on the back-side of the leadframe;

e) molding an upper part of the leadframe, the semiconductor chip, the die pad and the metal fine wires together with a resin encapsulant, while applying a pressure to at least the ends of the first and second groups of leads to press the first and second groups of land electrodes against the seal sheet; and

f) stripping the seal sheet from the leadframe after the step e) has been performed.

2. The method of claim 1, wherein in the step e), when the first group of land electrodes are pressed against the seal sheet with the pressure applied, the second group of land electrodes are pressed against, and forced into, the seal sheet.