Planar mode converter used in printed microwave integrated circuits

• US 6,639,484 B2
• Filed: 06/07/2002
• Issued: 10/28/2003
• Est. Priority Date: 11/01/2001
• Status: Active Grant

• Current Assignee: National Chiao Tung University (Government of The Republic of China)
• Original Assignee: National Chiao Tung University (Government of The Republic of China)
• Inventors: Tzuang, Ching-kuang, Lee, Cheng-jung
• Primary Examiner(s): Tokar, Michael
• Assistant Examiner(s): MAI, LAM T
• Application Number:
  US10/165,547
• Publication Number:
  US 20030080822A1
• Time in Patent Office: 508 Days
• Field of Search: 333/21.R, 333/26, 333/33, 333/34, 333/128, 333/204, 333/218
• US Class Current: 333/21.00R
• CPC Class Codes: H01P 1/2088 Integrated in a substrate
• CPC Class Codes: H01P 5/107 Hollow-waveguide/strip-line transitions

Abstract

A planar mode converter includes a rectangular waveguide, a microstrip feed-in circuit, and a microstrip feed-out circuit. The rectangular waveguide is filled with dielectric layers and surrounded with metal materials. The lowermost dielectric layer has usually largest thickness and dielectric constant. Except for the lowermost dielectric layer, each of the dielectric layers has a rectangular aperture at its front-end and back-end, respectively. The microstrip feed-in circuit is constituted by first, second and third metal strips, and a feed-in metal ground plane. The first metal strip and the feed-in metal ground plane form a feed-in signal line. The first, second and third metal strips are adhered to the top surface of the lowermost dielectric layer, and the feed-in metal ground plane is adhered to the bottom surface of the lowermost dielectric layer. The microstrip feed-out circuit is constituted of fourth, fifth and sixth metal strips, and a feed-out metal ground plane. The sixth metal strip and the feed-out metal strip form a feed-out signal line.

Claims

1. A planar mode converter used in printed microwave integrated circuits comprising:

a rectangular waveguide, with its interior filled with a plurality of dielectric layers, which are closely situated on top of one another;

wherein a top surface of an uppermost dielectric layer, a bottom surface of a lowermost dielectric layer, and right and left sides of said plurality of dielectric layers, are covered with metal materials;

said lowermost dielectric layer has largest thickness and dielectric constant;

except for the lowermost dielectric layer, each of said plurality of dielectric layers has a rectangular aperture at its front-end and one at its back-end, respectively;

said rectangular apertures at the front-end are closely situated on top of one another, and said rectangular apertures at the back-end are closely situated on top of one another;

a microstrip feed-in circuit constituted by a first metal strip, a second metal strip, a third metal strip, and a feed-in metal ground plane;

wherein said first metal strip and said feed-in metal ground plane form a feed-in signal line;

said second metal strip is tapered in shape;

a width of said first metal strip is the same as that of a narrow end of said second metal strip, and the narrow end of said second metal strip is connected with said first metal strip;

a width of said third metal strip approximates to that of said rectangular waveguide, and is the same as that of a wide end of said second metal strip;

the wide end of said second metal strip is connected with one end of said third metal strip whose the other end partially extends into the front-end of said rectangular waveguide;

said third metal strip extended is situated closely on top of one another with said rectangular apertures at the front-end and is electrically insulated from surrounding metal planes of said rectangular waveguide;

said first metal strip, said second metal strip, and said third metal strip are adhered to a top surface of said lowermost dielectric layer, and said feed-in metal ground plane is adhered to the bottom surface of said lowermost dielectric layer; and

a microstrip feed-out circuit constituted of a fourth metal strip, a fifth metal strip, a sixth metal strip, and a feed-out metal ground plane;

wherein said sixth metal strip and said feed-out metal strip form a feed-out signal line;

the shape of said fourth metal strip is identical to that of said third metal strip, the shape of said fifth metal strip is identical to that of said second metal strip, and the shape of said sixth metal strip is identical to that of said first metal strip;

a narrow end of said fifth metal strip is connected with said sixth metal strip, and a wide end of said fifth metal strip is connected with one end of the fourth metal strip whose other end extends partially into a back-end of said rectangular waveguide;

said fourth metal strip extended is situated closely on top of one another with said rectangular apertures at the back-end and is electrically insulated from all surrounding metal planes of said rectangular waveguide;

said fourth metal strip, said fifth metal strip, and said sixth metal strip are adhered to the top surface of said lowermost dielectric layer and said feed-out metal ground plane is adhered to the bottom surface of said lowermost dielectric layer.

2. The planar mode converter as described in claim 1, wherein the number of said plurality of dielectric layers is two.

3. The planar mode converter as described in claim 2, wherein said lowermost dielectric layer is made of fiberglass.

4. The planar mode converter as described in claim 2, wherein said lowermost dielectric layer is made of ferrite.

5. The planar mode converter as described in claim 3, wherein the surrounding metal planes of said rectangular waveguide, the metal strips forming said microstrip feed-in circuit and said microstrip feed-out circuit, and the metal ground plane, are made of gold.

6. The planar mode converter as described in claim 3, wherein the surrounding metal planes of said rectangular waveguide, the metal strips forming said microstrip feed-in circuit and said microstrip feed-out circuit, and the metal ground plane, are made of silver.

7. The planar mode converter as described in claim 3, wherein the surrounding metal planes of said rectangular waveguide, the metal strips forming said microstrip feed-in circuit and said microstrip feed-out circuit, and the metal ground plane, are made of copper.

8. The planar mode converter as described in claim 4, wherein the surrounding metal planes of said rectangular waveguide, the metal strips forming said microstrip feed-in circuit and said microstrip feed-out circuit, and the metal ground plane, are made of gold.

9. The planar mode converter as described in claim 4, wherein the surrounding metal planes of said rectangular waveguide, the metal strips forming said microstrip feed-in circuit and said microstrip feed-out circuit, and the metal ground plane, are made of silver.

10. The planar mode converter as described in claim 4, wherein the surrounding metal planes of said rectangular waveguide, the metal strips forming said microstrip feed-in circuit and said microstrip feed-out circuit, and the metal ground plane, are made of copper.

11. A waveguide bandpass filter used in printed microwave integrated circuits comprising:

a rectangular waveguide, with its interior filled with a plurality of dielectric layers, which are closely situated on top of one another;

a top surface of an uppermost dielectric layer, a bottom surface of a lowermost dielectric layer, and right and left sides of said respective layers, are covered with metal materials;

each of said plurality of dielectric layers has N pairs of symmetrical metal-coated rectangular slits at right and left sides, where N is an integer greater than or equal to 2;

said N pairs of symmetrical metal-coated rectangular slits are situated on top of one another and are not connected at front or back ends nor at right or left sides, and the surfaces thereof are covered with metal materials;

the lowermost dielectric layer has largest dielectric constant and thickness;

except for the lowermost dielectric layer, each of said plurality of dielectric layers has a rectangular aperture at its front-end and one at its back-end, respectively;

the rectangular apertures at said front-end are situated closely on top of one another, and the rectangular apertures at said back-end are situated closely on top of one another;

said N pairs of symmetrical metal-coated rectangular slits are not connected with said rectangular apertures at the front-end and the back-end;

a microstrip feed-in circuit constituted by a first metal strip, a second metal strip, a third metal strip, and a feed-in metal ground plane;

wherein said first metal strip and said feed-in metal ground plane form a feed-in signal line;

said second metal strip is tapered in shape, a width of said first metal strip is the same as that of a narrow end of said second metal strip, and the narrow end of said second metal strip is connected with said first metal strip;

a width of said third metal strip approximates to that of said rectangular waveguide, and is the same as that of a wide end of said second metal strip;

the wide end of said second metal strip is connected with one end of said third metal strip whose the other end partially extends into the front-end of said rectangular waveguide;

said third metal strip extended is situated closely on top of one another with said respective front-end apertures and is electrically insulated from all surrounding metal planes of said rectangular waveguide;

said first metal strip, said second metal strip, and said third metal strip are adhered to a top surface of said lowermost dielectric layer, and said feed-in metal ground plane is adhered to the bottom surface of said lowermost dielectric layer; and

a microstrip feed-out circuit constituted of a fourth metal strip, a fifth metal strip, a sixth metal strip, and a feed-out metal ground plane;

wherein said sixth metal strip and said feed-out metal strip form a feed-out signal line;

the shape of said fourth metal strip is identical to that of said third metal strip, the shape of said fifth metal strip is identical to that of said second metal strip, and the shape of said sixth metal strip is identical to that of said first metal strip;

a narrow end of said fifth metal strip is connected with said sixth metal strip, and a wide end of said fifth metal strip is connected with one end of the fourth metal strip whose other end extends partially into the back-end of said rectangular waveguide;

said fourth metal strip extended is situated closely on top of one another with rectangular apertures at the back-end and is electrically insulated from surrounding metal planes of said rectangular waveguide;

said fourth metal strip, said fifth metal strip, and said sixth metal strip are adhered to the top surface of said lowermost dielectric layer and said feed-out metal ground plane is adhered to the bottom surface of said lowermost dielectric layer.

12. The waveguide bandpass filter as described in claim 11, wherein the number of said plurality of dielectric layers is 2.

13. The waveguide bandpass filter as described in claim 12, wherein the value of N is 4.

14. The waveguide bandpass filter as described in claim 13, wherein the lowermost dielectric layer is made of fiberglass.

15. The waveguide bandpass filter as described in claim 13, wherein the lowermost dielectric layer is made of ferrite.

16. The waveguide bandpass filter as described in claim 14, wherein the surrounding metal planes of said rectangular waveguide, the metal strips forming said microstrip feed-in circuit and said microstrip feed-out circuit, and the metal ground plane, are made of gold.

17. The waveguide bandpass filter as described in claim 14, wherein the surrounding metal planes of said rectangular waveguide, the metal strips forming said microstrip feed-in circuit and said microstrip feed-out circuit, and the metal ground plane, are made of silver.

18. The waveguide bandpass filter as described in claim 14, wherein the surrounding metal planes of said rectangular waveguide, the metal strips forming said microstrip feed-in circuit and said microstrip feed-out circuit, and the metal ground plane, are made of copper.

19. The waveguide bandpass filter as described in claim 15, wherein the surrounding metal planes of said rectangular waveguide, the metal strips forming said microstrip feed-in circuit and said microstrip feed-out circuit, and the metal ground plane, are made of gold.

20. The waveguide bandpass filter as described in claim 15, wherein the surrounding metal planes of said rectangular waveguide, the metal strips forming said microstrip feed-in circuit and said microstrip feed-out circuit, and the metal ground plane, are made of silver.

21. The waveguide bandpass filter as described in claim 15, wherein the surrounding metal planes of said rectangular waveguide, the metal strips forming said microstrip feed-in circuit and said microstrip feed-out circuit, and the metal ground plane, are made of copper.