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Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment

  • US 6,639,799 B2
  • Filed: 12/22/2000
  • Issued: 10/28/2003
  • Est. Priority Date: 12/22/2000
  • Status: Expired due to Fees
First Claim
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1. An assembly having an integrated heat sink and spreader for cooling an item, comprising:

  • a microelectronic die to be cooled;

    a vapor chamber heat sink defined by a thinner first wall and a thicker second wall, the thicker second wall having a substantially uniform thickness and having a flat exterior surface portion for coupling to a surface of the microelectronic die, the flat exterior surface portion having an area that is considerably larger than an area of the surface of the microelectronic die;

    a plurality of heat-radiating fins attached to the thinner first wall; and

    a layer of thermal interface material interposed between the flat exterior surface portion of the thicker second wall and the surface of the microelectronic die.

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