Heat sink subassembly
First Claim
Patent Images
1. A heat sink subassembly comprising:
- a retainer comprising a plurality of attachment points;
a heat sink coupled to the retainer, wherein the heat sink comprises a plurality of fins, wherein a first fin of the plurality of fins is shorter than other fins in the plurality of fins, and wherein the first fin is located between two or more of the other fins in the plurality of fins;
a force-generating device coupled to at least one of the plurality of attachment points and to the first fin, wherein when the force-generating device is coupled to the at least one of the plurality of attachment points, the force-generating device is configured to exert a force on the heat sink such that the heat sink is securely coupled to the retainer.
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Accused Products
Abstract
A heat sink subassembly may include a retainer comprising several attachment points, a heat sink coupled to the retainer, and a force-generating device. The heat sink includes several fins, one of which is shorter than the other fins. The force-generating device is coupled to at least one of the attachment points and to the first fin. The force-generating device is configured to exert a force that keeps the heat sink securely coupled to the retainer when the force-generating device is coupled to the attachment points.
115 Citations
57 Claims
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1. A heat sink subassembly comprising:
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a retainer comprising a plurality of attachment points;
a heat sink coupled to the retainer, wherein the heat sink comprises a plurality of fins, wherein a first fin of the plurality of fins is shorter than other fins in the plurality of fins, and wherein the first fin is located between two or more of the other fins in the plurality of fins;
a force-generating device coupled to at least one of the plurality of attachment points and to the first fin, wherein when the force-generating device is coupled to the at least one of the plurality of attachment points, the force-generating device is configured to exert a force on the heat sink such that the heat sink is securely coupled to the retainer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A computer system comprising:
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a printed circuit board;
an integrated circuit coupled to the printed circuit board; and
a heat sink subassembly coupled to the printed circuit board, wherein the heat sink subassembly comprises;
a retainer;
a heat sink coupled to the retainer, wherein the heat sink comprises a plurality of fins, wherein a first fin of the plurality of fins is shorter than other fins in the plurality of fins, and wherein the first fin is located between two or more of the other fins in the plurality of fins; and
a force-generating device coupled to the first fin, wherein the force-generating device is configured to exert a force on the heat sink, wherein the force keeps the heat sink securely coupled to the integrated circuit. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48)
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49. A computer system comprising:
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a printed circuit board comprising a plurality of holes;
an integrated circuit coupled to the printed circuit board;
a heat sink subassembly comprising;
a retainer coupled to the printed circuit board by no more than two fasteners, wherein each of the fasteners extends through a respective one of the plurality of holes in the printed circuit board;
a heat sink coupled to the retainer;
one or more force-generating devices coupled to the heat sink, the no more than two fasteners, and the retainer, wherein the one or more force-generating devices exert a force on the heat sink, wherein the force securely couples the heat sink to the integrated circuit;
wherein an installation force required to couple the heat sink subassembly to the printed circuit board and to cause the one or more force-generating devices to exert the force on the heat sink is less than the force exerted on the heat sink by the one or more force-generating devices. - View Dependent Claims (50)
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51. A method of assembling a computer system, the method comprising:
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attaching a force-generating device to a retainer to form a heat sink subassembly, wherein a heat sink comprising a plurality of fins is interposed between a portion of the force-generating device and a portion of the retainer, wherein said attaching causes the force-generating device to hold the heat sink in the retainer, wherein the force-generating device is coupled to a first fin of the plurality of fins, wherein the first fin is shorter than other fins in the plurality of fins;
placing the heat sink subassembly over an integrated circuit coupled to a printed circuit board; and
coupling the heat sink subassembly to the printed circuit board by exerting an installation force, wherein the installation force is less than a force exerted by the force-generating device on the heat sink as a result of said coupling. - View Dependent Claims (52, 53, 54)
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55. A heat sink subassembly comprising:
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a retainer comprising a plurality of attachment points;
a heat sink coupled to the retainer, wherein the heat sink comprises a plurality of fins, wherein a first fin of the plurality of fins is shorter than other fins in the plurality of fins;
a force-generating device coupled to at least one of the plurality of attachment points and to the first fin, wherein when the force-generating device is coupled to the at least one of the plurality of attachment points, the force-generating device is configured to exert a force on the heat sink such that the heat sink is securely coupled to the retainer; and
an electromagnetic shield coupled to the retainer, wherein the electromagnetic shield is coupled to a retaining ridge extending along an inside surface of the retainer, and wherein the electromagnetic shield is configured to be inserted and removed from the retainer without decoupling the heat sink from the retainer.
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56. A computer system comprising:
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a printed circuit board comprising a plurality of holes;
an integrated circuit coupled to the printed circuit board;
a heat sink subassembly comprising;
a retainer coupled to the printed circuit board by no more than two fasteners, wherein each of the fasteners extends through a respective one of the plurality of holes in the printed circuit board;
a heat sink coupled to the retainer;
one or more force-generating devices coupled to the heat sink, the no more than two fasteners, and the retainer, wherein the one or more force-generating devices exert a force on the heat sink, wherein the force securely couples the heat sink to the integrated circuit;
wherein an installation force required to couple the heat sink subassembly to the printed circuit board and to cause the one or more force-generating devices to exert the force on the heat sink is less than the force exerted on the heat sink by the one or more force-generating devices;
wherein the retainer comprises one or more anti-rotation posts each configured to limit rotation of one of the one or more force-generating devices.
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57. A method of assembling a computer system, the method comprising:
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attaching a force-generating device to a retainer to form a heat sink subassembly, wherein a heat sink is interposed between a portion of the force-generating device and a portion of the retainer, wherein said attaching causes the force-generating device to hold the heat sink in the retainer;
placing the heat sink subassembly over an integrated circuit coupled to a printed circuit board; and
coupling the heat sink subassembly to the printed circuit board by exerting an installation force, wherein the installation force is less than a force exerted by the force-generating device on the heat sink as a result of said coupling; and
placing a stiffening plate underneath the printed circuit board.
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Specification