Bonding structures for optical members

• US 6,640,032 B2
• Filed: 09/24/2001
• Issued: 10/28/2003
• Est. Priority Date: 09/29/2000
• Status: Active Grant

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Yoshino, Takashi, Kondo, Jungo, Ejiri, Tetsuya
• Primary Examiner(s): Healy, Brian
• Assistant Examiner(s): VALENCIA, DANIEL E
• Application Number:
  US09/961,786
• Publication Number:
  US 20020114577A1
• Time in Patent Office: 764 Days
• Field of Search: 385/51, 385/52, 385/49, 385/14, 385/129
• US Class Current: 385/51
• CPC Class Codes: G02B 6/30 for use between fibre and thin-film device
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4234 Passive alignment along the optical axis and active alignment perpendicular to the optical axis
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material
• CPC Class Codes: H01L 2224/26175 Flow barriers
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Abstract

An optical member-bonding structure includes a first optical component, a second optical component, and an integral substrate having a mounting face on which the first and second optical components are mounted, at least the first optical member being bonded to the integral substrate, wherein a bonding face of the first optical member is bonded to the mounting face of the integral substrate with a cured and shrunk optical adhesive in such a state that an optical axis of the first optical member is aligned with that of the second optical member at a precision of not more than 1 μm, a groove is formed in a such bonding region of that mounting face of the integral substrate as being bonded with the first optical member, and at least part of the optical adhesive is filled into the groove.

Claims

1. A bonding structure for optical members, comprising a first optical member, a second optical member, and an integral substrate having a mounting face on which the first and second optical members are mounted, at least said first optical member being bonded to the integral substrate at a bonding region including a main plane surface and at least one groove formed in the integral substrate, wherein a bonding face of said first optical member is bonded to the main plane surface and said at least one groove with a cured and shrunk optical adhesive in such a state that an optical axis of the first optical member is aligned with the optical axis of the second optical member at a precision of not more than 1 μ

m, and at least part of the optical adhesive is filled into said at least one groove.

2. The bonding structure set forth in claim 1, wherein the groove has a depth of 5 to 200 μ

m.

3. The bonding structure set forth in claim 2, wherein the groove depth is not more than 150 μ

m.

4. The bonding structure set forth in claim 2, wherein the groove depth is not less than 25 μ

m.

5. The bonding structure set forth in claim 1, wherein the groove has a width of 0.1 to 5 μ

m.

6. The bonding structure set forth in claim 5, wherein a bonding layer of said optical adhesive is interposed between the bonding face of the first optical member and the mounting face of the integral substrate and at a location different from said groove, and said bonding layer has a thickness of 1 to 3 μ

m.

7. The bonding structure set forth in claim 1, wherein a bonding layer of said optical adhesive is interposed between the bonding face of the first optical member and the mounting face of the integral substrate and at a location different from said groove, and said bonding layer has a thickness of 1 to 3 μ

m.

8. The bonding structure set forth in claim 1, wherein the first member is an optical waveguide substrate provided with an optical waveguide, said second optical member is a laser diode, and an optical axis of the laser diode is aligned with the that of the optical waveguide at a precision of not more than 1 μ

m.

9. The bonding structure set forth in claim 8, wherein the laser diode is bonded to the mounting face of the integral substrate with a cured and shrunk optical adhesive, a groove is formed at such a bonding region of the mounting face for the laser diode, and a part of the optical adhesive is present in the groove.

10. The bonding structure set forth in claim 1, wherein said optical adhesive is selected from the group consisting of a UV curable type resin, a visual light curable type resin, an instantaneous adhesive and an anaerobic curable type resin.

11. The bonding structure set forth in claim 2, wherein said optical adhesive is selected from the group consisting of a UV curable type resin, a visual light curable type resin, an instantaneous adhesive and an anaerobic curable type resin.

12. The bonding structure set forth in claim 7, wherein a film of gold is formed on the bonding face of the laser diode, and the optical adhesive is an acrylic-based UV curable resin.

13. The bonding structure set forth in claim 8, wherein a film of gold is formed on the bonding face of the laser diode, and the optical adhesive is an acrylic-based UV curable resin.

14. The bonding structure set forth in claim 6, wherein said integral substrate is selected from the group consisting of silicon, aluminum nitride, silicon carbide and diamond.

15. The bonding structure set forth in claim 11, wherein said integral substrate is selected from the group consisting of silicon, aluminum nitride, silicon carbide and diamond.

16. The bonding structure set forth in claim 7, wherein said integral substrate is selected from the group consisting of silicon, aluminum nitride, silicon carbide and diamond.

17. The bonding structure set forth in claim 8, wherein said integral substrate is selected from the group consisting of silicon, aluminum nitride, silicon carbide and diamond.