Multi-tool control system, method and medium

• US 6,640,151 B1
• Filed: 12/22/1999
• Issued: 10/28/2003
• Est. Priority Date: 12/22/1999
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Grunes, Howard E., Somekh, Sasson
• Primary Examiner(s): Picard, Leo
• Assistant Examiner(s): FRANK, ELLIOT L
• Application Number:
  US09/469,227
• Time in Patent Office: 1,406 Days
• Field of Search: 700/9, 700/44, 700/96, 700/99, 700/100, 700/108, 700/109, 700/116, 700/121, 438/5, 438/11, 438/13
• US Class Current: 700/121
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring

Abstract

A system/method for interactively monitoring and adjusting product output from a module that includes two or more preparation tools. The output is a result of the coordinated effort of the two or more semiconductor preparation tools making up the module. The first of the tools is capable of implementing a first process on a semiconductor product and producing a first output. The second of the tools is configured to receive as input the first output from the first tool. The second tool is also capable of implementing a second process on the semiconductor product and producing a second output. A module control mechanism is capable of facilitating the exchange of information between the first tool and the second tool so that the module yields a desired semiconductor product output. Certain information can also be exchanged between the first and second tools. Other system/method embodiments for output/production control are also envisioned.

Claims

1. A method of processing wafers in a wafer processing facility, said wafer processing facility comprising at least two wafer processing tools, each for providing a distinct function, the method comprising the steps of:

(1) dispositioning, by the wafer processing facility, a discrete number of wafers to be processed;

(2) conveying, to said at least two wafer processing tools, a request to produce a specified product from each of said discrete number of wafers, and determining from said at least two wafer processing tools whether said request can be granted;

(3) upon determining in said step (2) that said specified product can be produced, accessing an initial recipe, said initial recipe for directing said discrete number of wafers through a plurality of process steps using said at least two wafer processing tools, to produce said specified product;

(4) upon receipt of information relating to a characteristic of at least one of said discrete number of wafers;

(i) modifying, where required, at least one of said process steps of said initial recipe for said at least one of said discrete number of wafers,

(ii) continuing to utilize said initial recipe for those of said discrete number of wafers not modified by said step (i);

(5) storing said modification made to said initial recipe for said one of said discrete number of wafers, for potential future use.

2. The method of claim 1, further comprising the steps of:

(6) implementing a first function on said at least one of said discrete number of wafers, using a first tool of said at least two wafer processing tools, to produce a first output;

(7) implementing a second function on said at least one of said discrete number of wafers, using a second tool of said at least two wafer processing tools, to produce a second output, said second tool receiving as input said first output from said first tool; and

(8) measuring and obtaining measurement data relating to one of the first and second outputs produced by one of said first or second tools, and conveying said measurement data to the other of said first or second tools for use in modifying a behavior of said other of said first or second tool.

3. The method of claim 2, further comprising the step of:

(9) facilitating the communication of information between said first tool and said second tool so that said at least two wafer processing tools yield said specified product, said specified product being, or resulting from, said second output.

4. The method of claim 3, wherein at least some aspects of said step (9) are controlled by a controller for said at least two wafer processing tools.

5. The method of claim 3, wherein at least some aspects of said step (9) are controlled by either said first or second tools, or by a combination of said first and second tools.

6. The method of claim 3, wherein said information communicated between the first and second wafer processing tools is directed to measurement data.

7. The method of claim 6, wherein said measurement data relates to the thickness and/or uniformity of a film.

8. The method of claim 1, wherein one of said at least two wafer processing tools includes at least one of a deposition function, a CMP function, an etch function, and an electroplating function.

9. The method of claim 1 further comprising the step of:

delaying step (3) until said request is granted.

10. A method for associating information with a wafer in a semiconductor processing facility, comprising the steps of:

(1) processing a wafer at a first wafer processing tool, and storing first information pertaining to said wafer on a traveling information file,

wherein said traveling information file comprises information pertaining to the status of said wafer;

(2) transferring said wafer to a second wafer processing tool;

(3) transferring said traveling information file with said wafer to said second wafer processing tool;

(4) receipt of said traveling information file by said second wafer processing tool; and

(5) processing said wafer at said second processing tool using said first information in said wafer status file, and storing second information pertaining to said wafer on said traveling information file, wherein traveling information file contains a recipe, and wherein said first wafer processing tool comprises the step of using said recipe in said traveling information file to process said wafer.

11. The method of claim 10, wherein said traveling information file further includes information relating to a number of additional recipes.

12. The method of claim 11, wherein said traveling information file further includes information relating to identifications of wafer processing tools to perform said number of additional recipes.

13. The method of claim 10, wherein said traveling information file further includes parameters that represents variations from said recipe.

14. The method of claim 10, wherein said second information relates to at least one of temperature of said wafer at certain times in said wafer'"'"'s process history, wafer thickness, and uniformity.

15. The method of claim 10, further comprising the step of:

determining a treatment for said wafer different from said recipe based on the second information.

16. The method of claim 10, wherein one of said first and second wafer processing tools includes at least one of a deposition function, a CMP function, an etch function, and an electroplating function.

17. A method for associating information with a wafer in a semiconductor processing facility, comprising the steps of:

(1) processing a wafer at a first wafer processing tool, and storing first information pertaining to said wafer on a wafer information entity,

wherein said wafer information entity comprises information pertaining to the status of said wafer;

(2) transferring said wafer to a second wafer processing tool;

(3) transferring said wafer information entity with said wafer to said second wafer processing tool;

(4) receiving said wafer information entity by said second wafer processing tool;

(5) processing said wafer at said second processing tool using said first information in said wafer information entity, and storing second information pertaining to said wafer on said wafer information entity, wherein wafer information entity contains a recipe or a modification of said recipe, and wherein said first wafer processing tool comprises the step of using said recipe or said modification of said recipe in said wafer information entity to process said wafer.

18. The method of claim 17, wherein said traveling information entity further includes information relating to a number of additional recipes.

19. The method of claim 18, wherein said traveling information entity further includes information relating to identifications of wafer processing tools to perform said number of additional recipes.

20. The method of claim 17, wherein said traveling information entity further includes parameters that represents variations from said recipe.

21. The method of claim 17, wherein said second information relates to at least one of temperature of said wafer at certain times in said wafer'"'"'s process history, wafer thickness, and uniformity.

22. The method of claim 17, further comprising the step of:

determining a treatment for said wafer different from said recipe based on the second information.

23. The method of claim 17, wherein one of said first and second wafer processing tools includes at least one of a deposition function, a CMP function, an etch function, and an electroplating function.

24. The method of claim 17, wherein said traveling information entity is a computer readable file.