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Process for manufacturing a composite polymeric circuit protection device

  • US 6,640,420 B1
  • Filed: 09/14/1999
  • Issued: 11/04/2003
  • Est. Priority Date: 09/14/1999
  • Status: Expired due to Term
First Claim
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1. A process for manufacturing a composite polymeric circuit protection device, said process comprising(1) providing a polymeric assembly comprising (a) providing first and second laminates, each of which comprises a Iaminar polymer element having at least one conducive surface;

  • (b) providing a pattern of conducive material on at least one of the conductive surfaces, and one of which comprises a PTC conductive polymer composition on one laminate;

    (c) securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates comprising an eternal conductive surface of the stack; and

    (d) making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate, steps (c) and (d) being performed simultaneously; and

    (2) subdividing the assembly into individual devices each of which comprises at least one electrical connection.

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